JPS6122463B2 - - Google Patents
Info
- Publication number
- JPS6122463B2 JPS6122463B2 JP4014079A JP4014079A JPS6122463B2 JP S6122463 B2 JPS6122463 B2 JP S6122463B2 JP 4014079 A JP4014079 A JP 4014079A JP 4014079 A JP4014079 A JP 4014079A JP S6122463 B2 JPS6122463 B2 JP S6122463B2
- Authority
- JP
- Japan
- Prior art keywords
- chuck
- hole
- frame
- push rod
- frame body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automatic Assembly (AREA)
- Manipulator (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4014079A JPS55133543A (en) | 1979-04-03 | 1979-04-03 | Multiple type mechanical chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4014079A JPS55133543A (en) | 1979-04-03 | 1979-04-03 | Multiple type mechanical chuck |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55133543A JPS55133543A (en) | 1980-10-17 |
| JPS6122463B2 true JPS6122463B2 (enExample) | 1986-05-31 |
Family
ID=12572467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4014079A Granted JPS55133543A (en) | 1979-04-03 | 1979-04-03 | Multiple type mechanical chuck |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55133543A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61154627U (enExample) * | 1985-03-14 | 1986-09-25 | ||
| JPS6374223U (enExample) * | 1986-10-31 | 1988-05-18 | ||
| DE10036081B4 (de) * | 2000-06-09 | 2005-03-10 | Georg Rudolf Sillner | Vorrichtung zum Zentrieren von Bauelementen und deren Verwendung in einer Fertigungslinie oder -Maschine, beispielsweise Back-End-Line-Maschine |
| CN102371588B (zh) * | 2010-08-25 | 2014-07-16 | 鸿富锦精密工业（深圳）有限公司 | 夹持机构 |
-
1979
- 1979-04-03 JP JP4014079A patent/JPS55133543A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55133543A (en) | 1980-10-17 |
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