JPS61224495A - Manufacture of head for ion flow recording - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an ion flow recording head used as a writing head in facsimiles, printers, and the like.

2. Description of the Related Art A conventional ion flow recording head 1o1 has a common electrode 103 formed on one surface of an insulating plate 102, as shown in FIG.
A ring-shaped fine electrode 104 is formed on the other surface of the insulating plate 1o2, and a through hole 105 with a diameter of about φ0.1 to φ0.3 tm is formed in the common electrode 103, the insulating plate 102, and the ring-shaped fine IIat electrode 104. .

Then, ions are generated by the ion source 106, and the through-hole 106 is blocked by the voltage applied to the common electrode 103 and the ring-shaped fine electrode 104 of the ion flow recording head 1o1 to control the ion flow. A latent image can be formed in dielectric layer 108 over 107.

In the conventional ion flow recording head described above, one destination line was drawn out from each ring-shaped microelectrode 104.
For example, if the size is 4 mm, about 1700 lines will be drawn out, which will cause congestion around the head and increase the total cost. For this reason, it has been considered to reduce the number of lead lines from the head 1o1 by using multilayer wiring on the head 101, but due to the characteristics of the ion flow recording head 101, it is not possible to stack them on the common electrode 103. .

Conventionally, in order to solve the above-mentioned problems, a method has been proposed in which the electrodes are laminated only around the common electrode 103, or a method in which the common electrode 103 is laminated over the entire surface and then the central portion is removed by milling using a grindstone.

Problems to be Solved by the Invention However, the former method has problems such as the complexity of the mold structure and the deviation in thickness accuracy by one position. In addition, the latter takes a long time to process, cannot obtain high processing accuracy due to warpage of the printed circuit board, has poor surface roughness after processing, and has problems such as the need to gold plate the common electrode 103 after processing. be.

Therefore, the present invention provides multi-layer wiring around the functional parts, which does not require a complicated mold, reduces processing time and improves accuracy, and also provides a common electrode during processing. An object of the present invention is to provide a method for manufacturing an ion flow recording head that can prevent scratches on the ion flow recording head and eliminate the need for post-processing.

Means for solving the problems and technical means of the present invention for solving the above problems are as follows:
A first electrode is formed on one surface of the insulating material, a second electrode is formed on the other surface of the insulating material, an adhesive sheet is placed on the insulating material on the outer side of the second electrode, and the adhesive sheet is bonded onto the second electrode. Place a release sheet so that it has approximately the same thickness as the release sheet, alternately stack printed circuit boards and adhesive sheets with circuits formed on these adhesive sheets and release sheets, and adhere the entire thing in a laminated state. The unnecessary laminated portion on the second electrode is removed by cutting with a laser.

Operation The present invention can obtain a laminated structure using a mold with a simple structure by using the above-mentioned technical means, and also removes the necessary laminated portion by laser processing, thereby damaging the second pole. It is possible to manufacture an ion flow recording head that can be processed with high accuracy in a short period of time, and has a multilayer wiring around the second pole, and has fewer lead wires.

EXAMPLE Hereinafter, an example of the present invention will be described in detail with reference to the drawings. First, as shown in FIG. 1 (IL), a ring-shaped fine electrode 2 is formed on one surface of an insulating material 1, and a common electrode 3 is formed on the other surface. Both electrodes 2.3 are plated with gold.

A through hole 4 is formed in the ring-shaped microelectrode 2, the insulating material 1, and the common electrode 3.

An adhesive sheet 6 is placed on the outer side of the common electrode 3 on the common electrode 3 side of the insulating material 1, and a release sheet 6 is placed on the common electrode 3 so that it has the same thickness as the adhesive sheet 6 (approximately 100 μm). . Next, as shown in FIG. 1), a required number of printed circuit boards 7 and adhesive sheets 8 having circuits formed in their peripheral portions are alternately laminated on the adhesive sheet 5 and the release sheet 6. In this state, the whole is heated and pressurized to bond it into a laminated state at once. Next, as shown in FIG. 1C, a cut 11 is made with a laser 9 at the outer edge of the unnecessary laminated portion 1o of the release sheet 6, printed circuit board 7, and adhesive sheet 8 above the common electrode 3. At this time, as mentioned above, the common electrode 3 is plated with gold and the laser beam is reflected, so that it is not cut. Next, by removing the unnecessary laminated portion 1o on the inside where the cut 11 was made, the first
As shown in Figure (d) and Figure 2, the central part has a common electrode 3.
The ion flow recording head 12 of the present invention, which has multilayer wiring around the common electrode 30, can be obtained using only the ring-shaped microelectrode 2.

In this embodiment, by interposing the release sheet 6 in the middle, the entire structure can be laminated using an ordinary mold. In addition, when laser processing is performed, the laser beam is reflected by the three surfaces of the common electrode, so there is no need to increase the positioning accuracy in the depth direction, as is the case with conventional 7-lice processing or when using a diamond cutter. There is no effect of warping of the printed circuit board 70 or variations in thickness. Furthermore, unlike in the case of milling, there is no need to reduce the surface roughness of the common electrode 3 or to plate it with gold after processing, so that the processing time can be considerably shortened.

Note that - after the through hole 4 is formed in the state shown in FIG. 1(d),
It can also be formed.

In the above embodiment, the case where there is one through hole has been described, but it goes without saying that a plurality of through holes may be provided, and a common electrode may be provided for the plurality of through holes.

Effects of the Invention As is clear from the above explanation, according to the present invention, a first electrode and a second electrode are formed on both sides of an insulating material, an adhesive sheet is placed on the outside of the second electrode on the insulating material, and a second electrode is placed on the outside of the second electrode on the insulating material. A release sheet is placed on the two electrodes, and the printed circuit board with the circuit formed thereon and the adhesive sheet are alternately stacked on top of these sheets, and the whole is adhered in a laminated state, and the unnecessary laminated portion on the second electrode is removed using a laser. I try to remove the dents by cutting into them.

Therefore, a laminated structure can be obtained using a mold having a simple structure. In addition, as mentioned above, since unnecessary laminated parts are removed by laser cutting, processing time can be shortened and accuracy can be improved.
Multilayer wiring can be easily obtained without damaging the electrode portion and therefore without requiring post-processing.

[Brief explanation of drawings]

1 (IL) to (d) are cross-sectional views showing an embodiment of the method for manufacturing an ion flow recording head of the present invention, and FIG. 2 is a sectional view showing an ion flow recording head obtained by the manufacturing method of the present invention. The perspective view of FIG. 3 is an explanatory diagram of the principle of ion flow recording. 1...Insulating material, 2...Ring-shaped microelectrode, 3...Common electrode, 4...Through hole,
5... Adhesive tape, 6... Release tape, 7... Printed circuit board, 8... Adhesive tape, 9... Laser, 10...
Unnecessary laminated portion, 11... Cutting depth, 12...
...Ion flow recording head. Name of agent: Patent attorney Toshi Nakao, 1 person, 1'
Rumor Castle Go to 5d-4 Figure 2 Figure 3

Claims (1)

[Claims] A first electrode is formed on one surface of the insulating material, a second electrode is formed on the other surface of the insulating material, an adhesive sheet is placed on the insulating material on the outer side of the second electrode, and the adhesive sheet is bonded onto the second electrode. A release sheet is placed so that it has approximately the same thickness as the adhesive sheet, and the printed circuit boards and adhesive sheets with circuits formed on these adhesive sheets and the release sheet are alternately stacked, and the whole is adhered in a laminated state. A method for manufacturing an ion flow recording head, characterized in that unnecessary laminated portions on two electrodes are removed by cutting with a laser.