JPS61222298A - Cooling construction - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a cooling structure that uses a fan to blow air into a printed circuit board package to cool electronic components mounted on the printed circuit board. The present invention relates to a cooling structure formed such that the air volume at a predetermined location of the printed board package is adjusted by a plate.

When using air cooling to cool a package containing a printed circuit board with electronic components mounted on it, a fan is generally installed and the fan is rotated to draw in outside air from one side of the package and exhaust it from the other side. This is done by circulating air within the package.

In such a case, if there is no difference in the amount of heat generated by each printed circuit board housed in the package, or if there is no difference in the air resistance of the printed circuit boards, there is no need to adjust the flow rate of the air being blown. However, if there is a difference in the amount of heat generated or a difference in air resistance, it is necessary to supply a large amount of flow to a printed circuit board that generates a large amount of heat or has a large air resistance.

However, in order to adjust the air volume, it is necessary to add a fan or use deflection blades to adjust the air volume.

Since this requires a complicated structure, a simplified and inexpensive structure is desired.

[Conventional technology]

Conventionally, the configuration was as shown in FIG. In Figure 3 (
a) is a front view and 5(b) is a side view.

A printed circuit board 5 on which a semiconductor element such as an IC chip 5A is mounted and a printed circuit board 6 on which a high-density semiconductor element such as an LSI element 6A is mounted are housed in a package 1, and each printed circuit board 5.6 is placed on the back side. It is removably connected to a bank panel 7 provided in the bank panel 7 via a connector 8.

In addition, at the bottom of the pan cage 1 there is an adjustment plate 9 for adjusting the air volume.
A duct 3 is fixed therein, and a filter 4 for filtering air and a fan 2 are also fixed to the duct 3.

Therefore, when the fan 2 is driven to rotate, the air filtered by the filter 4 and taken in from the directions of arrows A and B is blown by the adjusting plate 9 to the mounting portion of the printed circuit boards 5 and 6, and is exhausted from the upper part.

In this case, the adjusting plate 9 is used to adjust the air volume to an appropriate level for air with a large amount of heat generation or printed circuit board 6 with large air resistance.
, so that the rc element 5A and the LSI element 6A are uniformly cooled.

[Problem that the invention seeks to solve]

In such a configuration, an adjustment plate is always required, and the adjustment plate must be configured so that its movement or deflection angle can be changed depending on the mounting conditions of the printed circuit board.

Furthermore, it is possible to eliminate the use of a regulating plate by providing fans with different performances, but in either case, the structure becomes complicated and expensive.

[Means for solving problems]

The above-mentioned problems are solved by the cooling structure according to the present invention, in which at least the duct is provided with air resistance adjustment plates made of a plurality or different types so that the amount of air blown to a predetermined location of the package is different.

[Effect]

In other words, the air volume at a predetermined location of the package can be adjusted to a predetermined value by using an air resistance plate installed inside the duct, for example, by changing the thickness in the case of a filter, or by changing the aperture ratio in the case of punched metal. It was formed as follows.

As a result, there is no need to provide a conventional adjustment plate or special fan, and the structure can be simplified.

〔Example〕

The present invention will be explained in detail below with reference to one embodiment shown in FIG. 1 and another embodiment shown in FIG. Figure 1 (a) is a front view, (b) is a side view, Figure 2 (a) is a front view, (b)
) is a side view, and (C) is a top view. It should be noted that the same reference numerals refer to the same objects throughout the design.

As shown in FIGS. 1(a) and 1(b), an air resistance adjusting plate 11 formed of a filter or punched metal is attached to the duct 3 at a location where a printed circuit board 5 with a small amount of heat is attached. Otherwise, the configuration is the same as that described above.

With this configuration, the air flow resistance differs between a location where the air resistance adjustment plate 11 is provided and a location where it is not provided. Therefore, a part of the air taken in by arrow A is merged into the air flow of arrow B, and the part where the printed circuit board 5 with low heat generation or air resistance is attached and the part with high heat generation or air resistance are combined. It is possible to appropriately distribute the air volume to the location where the large printed circuit board 6 is mounted.

This air flow resistance is set by the thickness of the filter, and by the size of the mesh in the case of punched metal. You can adjust the air volume at each location.

Further, configurations as shown in (a), (b), and (c) of FIG. 2 can also be made.

A main plate 20 is fixed to the package 25, and further, an LSI element 6A and a printed circuit board 21 are mounted on the main plate 20 via a connector 22.

A fan 27 and a filter 29 are fixed to the lower part of the package 25 via a duct 23 in which an air resistance adjusting plate 28 made of a filter or punched metal similar to that described above is installed, and a fan 26 is attached to the package 25 via a duct 24.
is fixed to the top of the.

Therefore, when the fans 26 and 27 are driven to rotate, air is taken in from the direction of arrow C through the filter 29 and into the duct 23. Air is blown to the package 25 after passing through the air resistance adjusting plate 28, and after passing through the pan cage 25, it is sent to the duct 2.
4, and the air is exhausted in the direction of the arrow.

In this case, the location where the LSI element 6A is mounted has a relatively large amount of heat generation and air resistance, and the location where the printed circuit board 21 is mounted has a relatively small amount of heat generation and air resistance. An air resistance adjusting plate 28 is placed in the air to appropriately control the flow rate distribution.

In this way, the air volume at a predetermined location of the package 25 can be freely adjusted depending on the position at which the air resistance adjustment plate 28 is attached.

In addition, the air resistance adjusting plate 28 can be mounted with a simple structure such as a presser metal fitting or a rail so that it can be inserted.

〔Effect of the invention〕

As explained above, the present invention allows the air taken in by the fan to be formed so that the amount of air passed through each part of the package can be adjusted by changing the size of the air resistance adjusting plate or the size of the mesh. This is what I did.

This eliminates the need for conventional deflection vanes for air volume adjustment, which simplifies the structure and makes it cheaper.Furthermore, because the air volume can be easily adjusted by subdividing the pancage, uniform cooling can be achieved. , the practical effect is great.

[Brief explanation of the drawing]

FIG. 1 shows one embodiment of the present invention, and FIG. 2 shows another embodiment of the present invention, in which (a) in FIG. 1 is a front view, (b) is a side view, and ( a) is a front view, (b) is a side view,
(C) is a top view. FIG. 3 shows a conventional system in which (a) is a front view and (b) is a side view. In the figure, 1.25 is the package. 2.26.27 is a fan. 3.23.24 are ducts. 5.6.21 is a printed circuit board. 7 is the back panel. 8.22 is a connector. 11.28 is the air resistance adjustment plate. 4.29 is a filter. 20 indicates a main plate. ((1) (b) Figure 1 (a) Ryo 2 Figure (b) Kaya 3 Figure

Claims (1)

[Claims] A printed circuit board on which electronic components are mounted, a package in which a plurality of the printed circuit boards are arranged, a fan that blows air to the package, a duct that guides the air, and a filter that filters the air. A cooling structure that cools the electronic components by blowing the air into the package, the cooling structure comprising a plurality of pieces or different types of air so that the amount of air blowing to a predetermined location of the package can be adjusted. A cooling structure characterized in that at least the duct is provided with a resistance adjustment plate.