JPH04133496A - Cooling device of electronic equipment - Google Patents

Abstract

PURPOSE:To cool an IC on a board inside a case efficiently by a method wherein cooling air is sent to a chassis in which the board mounted with the IC is housed, a separating plate is fixed to the board at a windward point, and a deflection plate is fixed to the board at a leeward point. CONSTITUTION:Boards 2 mounted with ICs 1 are fixed to a chassis 5 in parallel with each other, a separating plate 3 is inserted between the boards 2 in parallel, a deflection plate 4 whose end is bent into nearly the shape of a letter L is installed between the boards 2 in series with the separating plate 3, and a fan 6 is provided close to the chassis 5. The chassis 5 is housed in a casing 7, and cooling air is sucked through an intake vent 8 to cool the ICs 1 and discharged out through an exhaust vent 9.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a cooling device for electronic equipment.

(Prior art) Conventional electronic computers use integrated circuit elements (hereinafter referred to as IC).
It consists of a chassis that houses a plurality of boards with a large number of boards mounted thereon, a power supply, and ancillary equipment such as a magnetic tape drive and a magnetic disk drive, which are housed in a housing. In particular, ICs generate a large amount of heat and tend to reach high temperatures, so it is necessary to maintain reliability by keeping the temperature below a certain level. The I
This is a cooling device that cools C and discharges it from the outlet vent.

(Problem to be Solved by the Invention) In the above method, the air taken in from the inlet vent cools the IC as it passes between the boards, causing the temperature of the air itself to rise, from the windward side to the leeward side. The temperature gradually increases towards For this reason, multiple ICs on the board are
The ICs on the windward side are gradually cooled with higher temperature air toward the ICs on the leeward side, and the cooling capacity of the ICs on the leeward side decreases. To compensate for this, a fan with a larger air volume is required, which has the disadvantage of increasing noise.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic device cooling device that can improve the above-mentioned drawbacks and efficiently cool an IC on a board inside a housing.

[Structure of the Invention] (Means for Solving the Problems) The present invention includes a plurality of substrates on which integrated circuit elements are mounted, a chassis that fixes these substrates in parallel to each other, and a chassis that is inserted between the substrates in parallel with the substrates. a partition plate, a drift plate installed between the boards in series with the partition plate and having one end on the side of the partition plate bent into an abbreviated shape, and a cooling device provided adjacent to the chassis. This is a cooling device for electronic equipment.

(Function) Cooling air is sent to a chassis housing a board on which an IC is mounted, a partition plate is fixed to the board on the windward side of the board, and a drift plate is fixed to the board on the leeward side of the board to cool the electronic device.

(Example) Next, an example of the present invention will be described. Figures 1 and 2 show a plurality of boards 2 to which ICIs are attached, a shear 5 that fixes the boards 2 in parallel to each other, a partition plate 3 inserted between the boards 2 in parallel with the boards 2, and a partition plate 3. It comprises a drifting plate 4 which is installed between the board 2 in series with the plate 3 and has one end on the side of the partition plate 3 bent into an abbreviated shape, and a fan 6 which is installed adjacent to the chassis 5. A cooling device for electronic equipment is shown.

In a configuration in which the fans 6 are used to ventilate and cool the boards 2 housed in the chassis 5 in the housing, the partition plate 3 is arranged to divide the ventilation path between the boards 2 on the windward side. The air path from the windward side is divided into an air path that cools the ICI and an air path that does not cool the IC on the windward side, and a deflection plate 4 is disposed between the substrates 2 on the leeward side to deflect the air from the windward side.

That is, a board 2, which is made up of a partition plate 3 fixed to the windward side of the board 2 on which the ICI is mounted, and a drift plate 4 fixed to the leeward side, is housed in a chassis 5, and a fan 6 that sends cooling air to the board 2 is installed in the chassis 5. 5, a chassis 5 is housed in a casing 7, and cooling air is sucked in through an inlet vent 8 and discharged from an outlet vent 9.

Cooling air taken in through the inlet vent 8 passes between the substrates, cools the ICI, and is discharged from the outlet vent 9. At this time, when the cooling air passes through the position of the partition plate 3 on the windward side, the cooling air is divided into a portion that cools the ICI and a portion that does not cool the ICI.

When cooling air passes through the position of the drift plate 4 on the leeward side, air whose temperature has not increased without cooling the ICI on the windward side also passes through the ICI on the leeward side. Furthermore, at the position of the drift plate 4 on the leeward side, the cooling air whose temperature has increased by cooling the IC 1 on the windward side also passes through, but because the cross-sectional area of the ventilation path between the boards is reduced by the drift plate 4, , the wind speed increases and the cooling effect increases. Therefore, it is possible to suppress a decrease in cooling efficiency due to an increase in the temperature of the cooling air.

[Effects of the Invention] As described above, the present invention can increase cooling efficiency by reducing the cross-sectional area of the ventilation path on the leeward side and increasing the wind speed.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of an electronic device showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the line -■ in FIG. 1... IC2... Board 3... Partition plate 4... Straight flow plate 5... Chassis 6... Fan agent Patent attorney Ogo
Norio

Claims (1)

[Claims] A plurality of substrates on which integrated circuit elements are mounted, a chassis that fixes these substrates in parallel to each other, a partition plate inserted between the substrates in parallel with the substrates, and a plurality of substrates in series with the partition plates. A cooling device for an electronic device, comprising: a drift plate installed between the partition plates and having one end bent into a substantially L-shape on the side of the partition plate; and a cooling device installed adjacent to the chassis.