JPH0983166A - Cooling structure for electronic apparatus - Google Patents
Cooling structure for electronic apparatusInfo
- Publication number
- JPH0983166A JPH0983166A JP23645795A JP23645795A JPH0983166A JP H0983166 A JPH0983166 A JP H0983166A JP 23645795 A JP23645795 A JP 23645795A JP 23645795 A JP23645795 A JP 23645795A JP H0983166 A JPH0983166 A JP H0983166A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- cooling
- axial fan
- fan
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子機器の冷却構造に関
し，特にミニタワーと呼ばれるタイプの小型コンピュー
タの冷却構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for electronic equipment, and more particularly to a cooling structure for a small computer of a type called a mini tower.
【０００２】[0002]
【従来の技術】従来のミニタワータイプの小型コンピュ
ータは，例えば，ＭＡＣＬＩＦＥ,No.84.8, 1995,P.220
に見られるような冷却構造をしている。排気口付近にあ
る電源の前方には筺体内全域を冷却するための大型の軸
流ファン（120mm角程度）と複数のＰＣＩバス用カード
を冷却するための中型の軸流ファン（80mm角程度）が設
けられている。ＣＰＵはマザーボードに直付けではな
く，スロットに差し込むＣＰＵカードとして供給され，
将来的なグレードアップを容易としている。ＣＰＵカー
ドには発熱量が大きいため，大型の平板状のヒートシン
クが付いている。ヒートシンクには，大型の軸流ファン
の働きにより0.5m/s前後のゆっくりとした流れが形成さ
れる。2. Description of the Related Art A conventional mini-tower type small computer is disclosed in, for example, MACLIFE, No.84.8, 1995, P.220.
It has a cooling structure as seen in. In front of the power supply near the exhaust port, a large axial fan (about 120 mm square) for cooling the entire housing and a medium-sized axial fan (about 80 mm square) for cooling multiple PCI bus cards. Is provided. CPU is not directly attached to the motherboard, but is supplied as a CPU card that is inserted into the slot.
It is easy to upgrade in the future. Since the CPU card generates a large amount of heat, it has a large flat heat sink. On the heat sink, a slow flow of around 0.5 m / s is formed by the action of a large axial fan.
【０００３】[0003]
【発明が解決しようとする課題】このような従来構造に
おいてＣＰＵのアップグレードを行う場合，ＣＰＵカー
ドに流れる冷却風の速度がそれ程大きくないために，Ｃ
ＰＵの発熱量がさらに大きくなった際には，ＣＰＵの冷
却が十分に行われないという問題がある。When the CPU is upgraded in such a conventional structure, the speed of the cooling air flowing through the CPU card is not so high.
When the amount of heat generated by the PU is further increased, there is a problem that the CPU is not sufficiently cooled.
【０００４】本発明の目的は，前記のような従来構造を
有するミニタワータイプの小型コンピュータにおいて，
高発熱なＣＰＵを有するＣＰＵカードに適用可能な電子
機器の冷却構造を提供することである。An object of the present invention is to provide a mini tower type small computer having the above conventional structure,
An object of the present invention is to provide a cooling structure for an electronic device applicable to a CPU card having a CPU with high heat generation.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に，ＣＰＵカードの冷却に用いる平行平板状のヒートシ
ンクの平板方向に垂直かつ上向きに複数の小型の軸流フ
ァンを並列に並べる構造とした。In order to achieve the above object, a structure is provided in which a plurality of small axial fans are arranged in parallel vertically and upward with respect to the plate direction of a parallel plate heat sink used for cooling a CPU card. .
【０００６】[0006]
【作用】小型の軸流ファンは省スペースである反面風量
が少ないのが欠点であるが，並列に並べることにより，
高発熱なＣＰＵを有するヒートシンクを冷却するのに十
分な風量を得ることができる。[Function] Although a small axial fan is space-saving, it has the drawback that the air flow is small, but by arranging them in parallel,
It is possible to obtain a sufficient amount of air to cool the heat sink having the CPU with high heat generation.
【０００７】[0007]
【実施例】以下，本発明の実施例を図１〜図４により説
明する。図１は本発明の実施例の斜視図であり，図２は
平面図である。ＣＰＵカード１の上にはＣＰＵが搭載さ
れており，その上面にＣＰＵを冷却するための平行平板
状フィン群を有するヒートシンク２が取り付けられてい
る。ヒートシンク２のベース面積はＣＰＵカード１の面
積よりもわずかに小さい160×80mm2である。ヒートシン
ク２のコネクタ４側には切欠きが設けられており，そこ
に大きさ40mm角，厚さ12mmの小型軸流ファンが４個並列
に並べられている。図３は，上記図１，２のＣＰＵカー
ド１をミニタワー型の電子機器に適用した場合を示す。
ＣＰＵカード１は電源５の下側にあるスロットに挿入さ
れている。さらにその下側にはＰＣＩカード９が挿入で
きる様，コネクタ４”が複数個設けられている。ＰＣＩ
カード９の側面には，コネクタ４”の領域をカバーする
ように大きさ80mm角の中型軸流ファン10が設けられてい
る。ＣＰＵカード１やＰＣＩカード９の抜差しは中型軸
流ファン10をたおして行う。排気口近くの電源５の側面
には，大きさ120mm角の大型軸流ファンが設けられてい
る。また，給気口は筐体側面下部（中型軸流ファン10の
近く）に設けられている。Embodiments of the present invention will be described below with reference to FIGS. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a plan view. A CPU is mounted on the CPU card 1, and a heat sink 2 having a parallel plate fin group for cooling the CPU is attached to the upper surface of the CPU card 1. The base area of the heat sink 2 is 160 × 80 mm 2 which is slightly smaller than the area of the CPU card 1. A notch is provided on the connector 4 side of the heat sink 2, and four small axial fans with a size of 40 mm square and a thickness of 12 mm are arranged in parallel there. FIG. 3 shows a case where the CPU card 1 of FIGS. 1 and 2 is applied to a mini tower type electronic device.
The CPU card 1 is inserted into a slot below the power supply 5. Further, a plurality of connectors 4 "are provided below it so that the PCI card 9 can be inserted.
A medium-sized axial fan 10 having a size of 80 mm is provided on the side surface of the card 9 so as to cover the area of the connector 4 ″. The medium-sized axial fan 10 is used for inserting and removing the CPU card 1 and the PCI card 9. A large 120 mm square axial fan is provided on the side of the power supply 5 near the exhaust port, and the air supply port is provided on the lower side of the chassis (near the medium axial fan 10). Has been.
【０００８】この様な構成において，冷却空気は大型軸
流ファン６の働きにより給気口より流入し，筐体内を一
様に流れ，さらに電源５内を流れた後に排気口から外部
に放出される。中型の軸流ファン10はＰＣＩカード９を
冷却するために有効に働くが，ＣＰＵカード１の冷却に
は寄与していない。ＣＰＵカード１に搭載されたヒート
シンク２には，小型軸流ファン３が稼働しない場合で0.
5m/s前後の冷却風が流れる。これにより発熱量10Ｗ程度
のＣＰＵの冷却を十分に行うことができる。４台の小型
軸流ファン３が稼働した場合，ヒートシンク２の部分で
全部で0.4〜0.6m3/min程度の風量が確保できる。これ
は，ヒートシンク２のフィン間風速2.2〜3.2m/sに相当
し，数10Ｗレベルの高発熱量を有するＣＰＵの冷却を容
易に行うことができる。この際のＣＰＵカード１のまわ
りの流却空気の流れを図４により説明する。筐体８の側
面下部から流入した冷却空気はヒートシンク２の間を流
れた後，小型軸流ファン３により上方に向けて排出され
る。ヒートシンク２を通った空気は緩められているため
浮力を持っており，上方への排気は極めて良好に行われ
る。小型軸流ファン３を出た空気は大型軸流ファン６に
より吸われ，電源５の内部を流れた後に電源５の前方に
設けられた排気口より筐体８の外部に放出される。この
際，小型の軸流ファン群３と大型の軸流ファン６はプシ
ュ・プル構成となり，２つのファン群がお互いに助け合
う。すなわち，それぞれのファンが単独にある場合に比
べて，吐出口から出た際の静圧を大きく取ることができ
るため結果としてより大きい冷却風量を得ることができ
る。また，大型の軸流ファン６と中型の軸流ファン10が
フルに稼働している場合には，小型の軸流ファン群３を
付加することによる騒音の増加は0.3dB程度であり，実
用上ほとんど問題にならない。本実施例では，従来の筐
体８内部の構造に何ら変更を加えることなく，現状の数
倍の数10Ｗレベルの高発熱量を有するＣＰＵへのアップ
グレードを可能にできる利点がある。In such a structure, the cooling air flows in from the air supply port by the action of the large-scale axial fan 6, flows uniformly in the housing, further flows in the power supply 5, and then is discharged to the outside from the exhaust port. It The medium-sized axial fan 10 works effectively for cooling the PCI card 9, but does not contribute to cooling the CPU card 1. The heat sink 2 mounted on the CPU card 1 has 0.
Cooling air around 5m / s flows. As a result, the CPU having a heating value of about 10 W can be sufficiently cooled. When four small axial fans 3 are operated, a total air volume of 0.4 to 0.6 m 3 / min can be secured in the heat sink 2. This corresponds to an air velocity between the fins of the heat sink 2 of 2.2 to 3.2 m / s, and can easily cool the CPU having a high heating value of several tens of watts. The flow of the flowing air around the CPU card 1 at this time will be described with reference to FIG. The cooling air that has flowed in from the lower portion of the side surface of the housing 8 flows between the heat sinks 2 and is then discharged upward by the small axial fan 3. Since the air that has passed through the heat sink 2 is loosened, it has buoyancy, and the air can be exhausted upwards very well. The air that has exited the small axial fan 3 is sucked by the large axial fan 6, flows through the inside of the power source 5, and then is discharged to the outside of the housing 8 through an exhaust port provided in front of the power source 5. At this time, the small axial fan group 3 and the large axial fan group 6 have a push-pull configuration, and the two fan groups assist each other. That is, as compared with the case where each fan is provided independently, a larger static pressure can be secured when it comes out from the discharge port, and as a result, a larger cooling air volume can be obtained. In addition, when the large axial fan 6 and the medium axial fan 10 are fully operating, the noise increase due to the addition of the small axial fan group 3 is about 0.3 dB. Almost no problem. The present embodiment has an advantage that it is possible to upgrade to a CPU having a high heat generation amount of several tens of watts, which is several times the current level, without making any changes to the structure inside the conventional case 8.
【０００９】図５，６は本発明の別の実施例である。本
実施例ではヒートシンク２の小型軸流ファン３側の側端
面に後面シールド11が，ヒートシンク２の上面には上面
シールド12が設けられている。本実施例では上面シール
ド12，後面シールド11には，アルミの粘着テープを用い
ているが，材質はこれに限ることは無い。本実施例にお
いては，小型軸流ファン３により吸われ，上方に排気さ
れる冷却空気は，ヒートシンク２の前方のみから流入す
る。すなわち，本実施例では小型軸流ファン３に吸われ
る全ての空気は，ヒートシンク２の冷却に寄与すること
になり，冷却効率が向上する利点がある。ヒートシンク
２のフィン間を流れる流速も小型軸流ファン３の全風量
0.4〜0.6m3/minに対して2.5〜3.7m/sとなり，図１，図
２の実施例に比べてヒートシンク２の表面での放熱性能
が７％程度上昇する。また，本実施例では後面シールド
11及び上面シールド12に熱伝導性の良いアルミ粘着テー
プを用いているため，後面シールド11，上面シールド12
が放熱に寄与し，ヒートシンク２の有効放熱面積が５％
程度増加する。また，後面シールド11，上面シールド12
により，小型軸流ファン３を出た緩まった空気が，再び
ヒートシンク２に流入する空気流のショートパスを防止
することができ，筐体８内におけるヒートシンク２の実
質放熱性能の低下を防止できる利点もある。すなわち，
これらの効果によりヒートシンク２のトータルの放熱性
能を少なくとも10％程度向上できる利点がある。また，
シールド材は粘着テープであるため，シールド構造を作
る際の作業性が良い利点がある。本実施例のＣＰＵカー
ド１を，例えば，図３で示されるミニタワー型小型コン
ピュータに実装した際には，冷却ファンがプシュ・プル
構成となり図１〜図４の実施例で述べたのと同様の効果
がある。5 and 6 show another embodiment of the present invention. In this embodiment, the rear shield 11 is provided on the side end surface of the heat sink 2 on the side of the small axial fan 3, and the upper shield 12 is provided on the upper surface of the heat sink 2. In the present embodiment, aluminum adhesive tape is used for the top shield 12 and the rear shield 11, but the material is not limited to this. In this embodiment, the cooling air sucked by the small axial fan 3 and exhausted upward flows only from the front side of the heat sink 2. That is, in this embodiment, all the air sucked by the small axial fan 3 contributes to the cooling of the heat sink 2, which has the advantage of improving the cooling efficiency. The flow velocity between the fins of the heat sink 2 is also the total air volume of the small axial fan 3.
It becomes 2.5 to 3.7 m / s with respect to 0.4 to 0.6 m 3 / min, and the heat dissipation performance on the surface of the heat sink 2 is increased by about 7% as compared with the embodiment of FIGS. In addition, in this embodiment, the rear shield is
Since aluminum adhesive tape with good thermal conductivity is used for 11 and top shield 12, rear shield 11 and top shield 12
Contributes to heat dissipation, and the effective heat dissipation area of the heat sink 2 is 5%
Increase. Also, the rear shield 11 and the top shield 12
As a result, the loose air that has exited the small axial fan 3 can prevent a short path of the airflow that flows into the heat sink 2 again, and can prevent the substantial heat dissipation performance of the heat sink 2 in the housing 8 from decreasing. There are also advantages. That is,
These effects have the advantage that the total heat dissipation performance of the heat sink 2 can be improved by at least about 10%. Also,
Since the shield material is an adhesive tape, it has the advantage of good workability when creating the shield structure. When the CPU card 1 of the present embodiment is mounted on, for example, the mini tower type small computer shown in FIG. 3, the cooling fan has a push-pull structure and is the same as that described in the embodiment of FIGS. Has the effect of.
【００１０】本発明のさらに別の実施例は，後面シール
ド11ないし上面シールド12のいずれか一方のみを設けた
場合であり，図５の実施例に比べて部品点数を減らせる
利点がある。Yet another embodiment of the present invention is a case where only one of the rear shield 11 and the upper shield 12 is provided, which has an advantage that the number of parts can be reduced as compared with the embodiment of FIG.
【００１１】[0011]
【発明の効果】以上，本発明によれば，筐体内の構造を
何ら変更することなく，ＣＰＵカードの冷却性能を大巾
に向上できるため，ミニタワータイプの小型コンピュー
タにおいて，高発熱なＣＰＵを有するＣＰＵカードに適
用可能な電子機器の冷却構造を提供することができる。As described above, according to the present invention, the cooling performance of the CPU card can be greatly improved without changing the internal structure of the housing. A cooling structure for an electronic device which can be applied to a CPU card included in the electronic device can be provided.
【００１２】[0012]
【図１】 本発明のＣＰＵカードの斜視図。FIG. 1 is a perspective view of a CPU card of the present invention.
【図２】 本発明のＣＰＵカードの平面図。FIG. 2 is a plan view of a CPU card of the present invention.
【図３】 本発明のＣＰＵカードを搭載した電子機器の
斜視図。FIG. 3 is a perspective view of an electronic device equipped with a CPU card of the present invention.
【図４】 本発明のＣＰＵカードを搭載した電子機器の
断面図。FIG. 4 is a cross-sectional view of an electronic device equipped with the CPU card of the present invention.
【図５】 本発明のＣＰＵカードの斜視図。FIG. 5 is a perspective view of a CPU card of the present invention.
【図６】 本発明のＣＰＵカードの平面図。FIG. 6 is a plan view of a CPU card of the present invention.
１…ＣＰＵカード，２…ヒートシンク，３…小型軸流フ
ァン，４…コネクタ，５…電源，６…大型軸流ファン，
７…マザーボード，８…筐体，９…ＰＣＩカード，１０
…中型軸流ファン，１１…後面シールド，１２…上面シ
ールド。1 ... CPU card, 2 ... Heat sink, 3 ... Small axial fan, 4 ... Connector, 5 ... Power supply, 6 ... Large axial fan,
7 ... Motherboard, 8 ... Housing, 9 ... PCI card, 10
... Medium-sized axial fan, 11 ... Rear shield, 12 ... Top shield.
Claims (5)
路基板において、該ヒートシンクを平行平板状のフィン
群とし，該フィン群の側端上面部に切り欠きを設け，該
切り欠き部に切り欠かれた領域とほぼ寸法の等しい小型
軸流ファンを複数取り付けてなる電子機器の冷却構造。1. An electronic circuit board having a CPU with a heat sink, wherein the heat sink is a parallel plate fin group, a notch is provided on an upper surface of a side end of the fin group, and the notch is cut. A cooling structure for electronic devices that is equipped with multiple small axial fans that have almost the same dimensions as the area.
下部のヒートシンク側端面及び該小型軸流ファン群の領
域を除く該ヒートシンクの上面部にシールド構造を設け
てなる電子機器の冷却構造。2. A cooling structure for an electronic device according to claim 1, wherein a shield structure is provided on the heat sink side end surface of the lower portion of the small axial fan group and on the upper surface of the heat sink except for the area of the small axial fan group.
伝導性を有するアルミ等の粘着テープを用いた電子機器
の冷却構造。3. The cooling structure for an electronic device according to claim 2, wherein an adhesive tape made of aluminum or the like having high thermal conductivity is used as the shield material.
置及び電源を含み，かつそれらを冷却するためのファン
を有する電子機器において，該電子機器の筺体冷却用の
該ファンとプシュ・プル構成となる様，上記請求項１〜
３の電子回路基板を小型軸流ファンの排気口が，該前記
ファン吸気口を向くように組み込んだことを特徴とする
電子機器の冷却構造。4. An electronic device including a plurality of electronic circuit boards, a storage device such as a disk, and a power supply, and having a fan for cooling them, wherein the fan and the push-pull structure for cooling the housing of the electronic device. The above-mentioned claim 1
3. A cooling structure for electronic equipment, wherein the electronic circuit board 3 is incorporated so that an exhaust port of a small axial fan faces the fan intake port.
ニタワータイプの小型コンピュータであり，筺体冷却用
のファンとして，ヒートシンクを取り付けた小型軸流フ
ァンよりも寸法の大きい軸流ファンを用いた電子機器の
冷却構造。5. The electronic device according to claim 4, wherein the electronic device is a mini tower type small computer, and an axial fan having a size larger than that of a small axial fan provided with a heat sink is used as a fan for cooling the housing. Equipment cooling structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23645795A JPH0983166A (en) | 1995-09-14 | 1995-09-14 | Cooling structure for electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23645795A JPH0983166A (en) | 1995-09-14 | 1995-09-14 | Cooling structure for electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0983166A true JPH0983166A (en) | 1997-03-28 |
Family
ID=17001036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23645795A Pending JPH0983166A (en) | 1995-09-14 | 1995-09-14 | Cooling structure for electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0983166A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010014106A1 (en) * | 2008-07-31 | 2010-02-04 | Hewlett-Packard Development Company, L.P. | Heatsink with a plurality of fans |
-
1995
- 1995-09-14 JP JP23645795A patent/JPH0983166A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010014106A1 (en) * | 2008-07-31 | 2010-02-04 | Hewlett-Packard Development Company, L.P. | Heatsink with a plurality of fans |
| US8565933B2 (en) | 2008-07-31 | 2013-10-22 | Hewlett-Packard Development Company, L.P. | Heatsink with a plurality of fans |
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