JPS61216888A - 銀ろう材 - Google Patents
銀ろう材Info
- Publication number
- JPS61216888A JPS61216888A JP6438186A JP6438186A JPS61216888A JP S61216888 A JPS61216888 A JP S61216888A JP 6438186 A JP6438186 A JP 6438186A JP 6438186 A JP6438186 A JP 6438186A JP S61216888 A JPS61216888 A JP S61216888A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- brazing filler
- surface roughness
- silver brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title abstract description 36
- 229910052751 metal Inorganic materials 0.000 title abstract description 20
- 239000002184 metal Substances 0.000 title abstract description 20
- 239000000945 filler Substances 0.000 title abstract description 15
- 229910052709 silver Inorganic materials 0.000 title abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title abstract description 6
- 239000004332 silver Substances 0.000 title abstract description 6
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 9
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 7
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 6
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 10
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 239000000956 alloy Substances 0.000 abstract description 3
- 230000003746 surface roughness Effects 0.000 description 15
- 238000004439 roughness measurement Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910017888 Cu—P Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6438186A JPS61216888A (ja) | 1986-03-22 | 1986-03-22 | 銀ろう材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6438186A JPS61216888A (ja) | 1986-03-22 | 1986-03-22 | 銀ろう材 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3377981A Division JPS57149093A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61216888A true JPS61216888A (ja) | 1986-09-26 |
| JPS63159B2 JPS63159B2 (enrdf_load_stackoverflow) | 1988-01-05 |
Family
ID=13256673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6438186A Granted JPS61216888A (ja) | 1986-03-22 | 1986-03-22 | 銀ろう材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61216888A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018092251A1 (ja) * | 2016-11-17 | 2018-05-24 | 三菱電機株式会社 | 半導体パッケージ |
| JP2023519588A (ja) * | 2020-12-04 | 2023-05-11 | 杭州華光▲ハン▼接新材料股▲フン▼有限公司 | 電気真空素子の接合に用いる低銀ろう材及びその製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100950686B1 (ko) * | 2009-09-08 | 2010-03-31 | 주식회사 한국번디 | 용가재 합금조성물 |
-
1986
- 1986-03-22 JP JP6438186A patent/JPS61216888A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018092251A1 (ja) * | 2016-11-17 | 2018-05-24 | 三菱電機株式会社 | 半導体パッケージ |
| JPWO2018092251A1 (ja) * | 2016-11-17 | 2019-03-14 | 三菱電機株式会社 | 半導体パッケージ |
| JP2023519588A (ja) * | 2020-12-04 | 2023-05-11 | 杭州華光▲ハン▼接新材料股▲フン▼有限公司 | 電気真空素子の接合に用いる低銀ろう材及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63159B2 (enrdf_load_stackoverflow) | 1988-01-05 |
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