JPS61216887A - 銀ろう材 - Google Patents
銀ろう材Info
- Publication number
- JPS61216887A JPS61216887A JP6438086A JP6438086A JPS61216887A JP S61216887 A JPS61216887 A JP S61216887A JP 6438086 A JP6438086 A JP 6438086A JP 6438086 A JP6438086 A JP 6438086A JP S61216887 A JPS61216887 A JP S61216887A
- Authority
- JP
- Japan
- Prior art keywords
- filler metal
- brazing
- brazing filler
- surface roughness
- silver brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 23
- 239000002184 metal Substances 0.000 title claims abstract description 23
- 239000000945 filler Substances 0.000 title claims abstract description 18
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 7
- 239000004332 silver Substances 0.000 title claims abstract description 7
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 9
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 7
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 abstract description 8
- 229910017944 Ag—Cu Inorganic materials 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 7
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 239000000956 alloy Substances 0.000 abstract description 3
- 230000003746 surface roughness Effects 0.000 description 14
- 238000004439 roughness measurement Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000003892 spreading Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6438086A JPS61216887A (ja) | 1986-03-22 | 1986-03-22 | 銀ろう材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6438086A JPS61216887A (ja) | 1986-03-22 | 1986-03-22 | 銀ろう材 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3377881A Division JPS57149092A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61216887A true JPS61216887A (ja) | 1986-09-26 |
JPS6254599B2 JPS6254599B2 (enrdf_load_stackoverflow) | 1987-11-16 |
Family
ID=13256642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6438086A Granted JPS61216887A (ja) | 1986-03-22 | 1986-03-22 | 銀ろう材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61216887A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6596229B2 (en) * | 2000-12-29 | 2003-07-22 | United Technologies Corporation | Silver braze alloy |
-
1986
- 1986-03-22 JP JP6438086A patent/JPS61216887A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6596229B2 (en) * | 2000-12-29 | 2003-07-22 | United Technologies Corporation | Silver braze alloy |
US6936218B2 (en) * | 2000-12-29 | 2005-08-30 | United Technologies Corporation | Silver braze alloy |
Also Published As
Publication number | Publication date |
---|---|
JPS6254599B2 (enrdf_load_stackoverflow) | 1987-11-16 |
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