JPS61215615A - 半導体封止用樹脂組成物 - Google Patents
半導体封止用樹脂組成物Info
- Publication number
- JPS61215615A JPS61215615A JP5616085A JP5616085A JPS61215615A JP S61215615 A JPS61215615 A JP S61215615A JP 5616085 A JP5616085 A JP 5616085A JP 5616085 A JP5616085 A JP 5616085A JP S61215615 A JPS61215615 A JP S61215615A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- filler
- curing agent
- resin
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 238000007789 sealing Methods 0.000 title claims abstract description 4
- 239000011342 resin composition Substances 0.000 title claims description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 17
- 239000000945 filler Substances 0.000 claims abstract description 13
- 239000002245 particle Substances 0.000 claims abstract description 12
- 239000005350 fused silica glass Substances 0.000 claims abstract description 4
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 abstract description 14
- 229920005989 resin Polymers 0.000 abstract description 13
- 239000011347 resin Substances 0.000 abstract description 13
- 229920003986 novolac Polymers 0.000 abstract description 6
- 150000001875 compounds Chemical class 0.000 abstract description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 abstract description 2
- 125000002723 alicyclic group Chemical group 0.000 abstract description 2
- -1 amines acid anhydrides Chemical class 0.000 abstract description 2
- 230000007423 decrease Effects 0.000 abstract description 2
- 125000003700 epoxy group Chemical group 0.000 abstract description 2
- 150000002460 imidazoles Chemical class 0.000 abstract description 2
- 150000003512 tertiary amines Chemical class 0.000 abstract description 2
- 229930185605 Bisphenol Natural products 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical group N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 241000287828 Gallus gallus Species 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical class FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000010415 tropism Effects 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5616085A JPS61215615A (ja) | 1985-03-22 | 1985-03-22 | 半導体封止用樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5616085A JPS61215615A (ja) | 1985-03-22 | 1985-03-22 | 半導体封止用樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61215615A true JPS61215615A (ja) | 1986-09-25 |
| JPH0479379B2 JPH0479379B2 (enrdf_load_stackoverflow) | 1992-12-15 |
Family
ID=13019340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5616085A Granted JPS61215615A (ja) | 1985-03-22 | 1985-03-22 | 半導体封止用樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61215615A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6484739A (en) * | 1987-09-28 | 1989-03-30 | Nitto Denko Corp | Resin sealed semiconductor device |
| US4997863A (en) * | 1988-08-26 | 1991-03-05 | Somar Corporation | Thermosetting resin composition useful for forming insulating layer of multilayer printed wiring board |
| US5095047A (en) * | 1989-04-24 | 1992-03-10 | Somar Corporation | Epoxy resin composition and multilayer printed wiring board having insulating layer formed therefrom |
| WO2006067160A1 (en) * | 2004-12-23 | 2006-06-29 | Solvay Solexis, Inc. | Thermoplastic halogenated polymer composition |
| US8252419B2 (en) | 1998-08-13 | 2012-08-28 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board and process for its production |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6017936A (ja) * | 1983-07-12 | 1985-01-29 | Sumitomo Bakelite Co Ltd | 半導体封止用樹脂組成物 |
-
1985
- 1985-03-22 JP JP5616085A patent/JPS61215615A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6017936A (ja) * | 1983-07-12 | 1985-01-29 | Sumitomo Bakelite Co Ltd | 半導体封止用樹脂組成物 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6484739A (en) * | 1987-09-28 | 1989-03-30 | Nitto Denko Corp | Resin sealed semiconductor device |
| US4997863A (en) * | 1988-08-26 | 1991-03-05 | Somar Corporation | Thermosetting resin composition useful for forming insulating layer of multilayer printed wiring board |
| US5095047A (en) * | 1989-04-24 | 1992-03-10 | Somar Corporation | Epoxy resin composition and multilayer printed wiring board having insulating layer formed therefrom |
| US8273458B2 (en) | 1997-02-14 | 2012-09-25 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board and process for its production |
| US8252419B2 (en) | 1998-08-13 | 2012-08-28 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board and process for its production |
| US8273457B2 (en) | 1998-08-13 | 2012-09-25 | Hitachi Chemical Company, Ltd. | Adhesive for bonding circuit members, circuit board and process for its production |
| WO2006067160A1 (en) * | 2004-12-23 | 2006-06-29 | Solvay Solexis, Inc. | Thermoplastic halogenated polymer composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0479379B2 (enrdf_load_stackoverflow) | 1992-12-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |