JPS6120759Y2 - - Google Patents

Info

Publication number
JPS6120759Y2
JPS6120759Y2 JP1980079008U JP7900880U JPS6120759Y2 JP S6120759 Y2 JPS6120759 Y2 JP S6120759Y2 JP 1980079008 U JP1980079008 U JP 1980079008U JP 7900880 U JP7900880 U JP 7900880U JP S6120759 Y2 JPS6120759 Y2 JP S6120759Y2
Authority
JP
Japan
Prior art keywords
press
contact
heat sink
recess
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980079008U
Other languages
English (en)
Japanese (ja)
Other versions
JPS574244U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980079008U priority Critical patent/JPS6120759Y2/ja
Publication of JPS574244U publication Critical patent/JPS574244U/ja
Application granted granted Critical
Publication of JPS6120759Y2 publication Critical patent/JPS6120759Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1980079008U 1980-06-06 1980-06-06 Expired JPS6120759Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980079008U JPS6120759Y2 (enExample) 1980-06-06 1980-06-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980079008U JPS6120759Y2 (enExample) 1980-06-06 1980-06-06

Publications (2)

Publication Number Publication Date
JPS574244U JPS574244U (enExample) 1982-01-09
JPS6120759Y2 true JPS6120759Y2 (enExample) 1986-06-21

Family

ID=29441508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980079008U Expired JPS6120759Y2 (enExample) 1980-06-06 1980-06-06

Country Status (1)

Country Link
JP (1) JPS6120759Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51149778A (en) * 1975-06-17 1976-12-22 Toshiba Corp Pressure contact type semiconductor device

Also Published As

Publication number Publication date
JPS574244U (enExample) 1982-01-09

Similar Documents

Publication Publication Date Title
JPS5938734B2 (ja) 平形セル構造を有するパワ−半導体回路素子
US4246596A (en) High current press pack semiconductor device having a mesa structure
US4314270A (en) Hybrid thick film integrated circuit heat dissipating and grounding assembly
US5110761A (en) Formed top contact for non-flat semiconductor devices
US2744218A (en) Sealed rectifier unit and method of making the same
US3599057A (en) Semiconductor device with a resilient lead construction
JPS6120759Y2 (enExample)
EP0340466B1 (en) Semiconductor device comprising leads
US3931635A (en) Semiconductor device with a control electrode in pressure contact with the semiconductor disc
US3280383A (en) Electronic semiconductor device
US3188536A (en) Silicon rectifier encapsulation
US3501680A (en) Structural component for housing for semiconductor device
JPH05315467A (ja) 混成集積回路装置
JP3198693B2 (ja) ダイオード
JPS629721Y2 (enExample)
JP3522975B2 (ja) 半導体装置
JPH029507Y2 (enExample)
JPS5854504B2 (ja) 半導体装置
JPH0328518Y2 (enExample)
JPS6020942Y2 (ja) 半導体装置
KR820002122Y1 (ko) 반도체 장치
JPH0129765Y2 (enExample)
JPH0442927Y2 (enExample)
US3381184A (en) Lead termination structure
JPS5846177B2 (ja) 半導体装置