JPS61205808A - Shape detection apparatus - Google Patents

Shape detection apparatus

Info

Publication number
JPS61205808A
JPS61205808A JP4657785A JP4657785A JPS61205808A JP S61205808 A JPS61205808 A JP S61205808A JP 4657785 A JP4657785 A JP 4657785A JP 4657785 A JP4657785 A JP 4657785A JP S61205808 A JPS61205808 A JP S61205808A
Authority
JP
Japan
Prior art keywords
spot
optical system
sensor
image
minute
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4657785A
Other languages
Japanese (ja)
Inventor
Shigemi Mio
美尾 恵己
Takashi Hiroi
高志 広井
Yasuo Nakagawa
中川 泰夫
Takanori Ninomiya
隆典 二宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4657785A priority Critical patent/JPS61205808A/en
Publication of JPS61205808A publication Critical patent/JPS61205808A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

PURPOSE:To make it possible to detect the minute three-dimensional shape of a minute object to be inspected, by improving resolving power by enlarging the magnification of an image forming optical system in an X-direction. CONSTITUTION:When laser beam 13 is irradiated around a fillet part 17, the spot image formed onto a unidimensional image sensor 6 corresponds to that the resolving power in an X-direction was relatively reduced by inclining the sensor 6 to the X-direction and the image of the edge part 16 of a lead 10 formed on the sensor 6 heretofore is issued to the outside of the sensor 6 to be formed and only the image of the fillet part 17 appears in the output of the unidimensional image sensor 6 as a peak 15 and the position of the fillet part 17 in a Z-direction can be detected without error. By this method, the shape of even the minute fillet of a solder connection part can be accurately detected.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は、プリント板上に、実装した電気部品のはんだ
付は接続部の微小立体形状を検出するのに係り、特に、
険しい微小立体形状の検出に好適な形状検出装置に関す
る。
[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to detecting minute three-dimensional shapes of connections in soldering of electrical components mounted on a printed circuit board, and in particular,
The present invention relates to a shape detection device suitable for detecting steep minute three-dimensional shapes.

〔発明の背景〕[Background of the invention]

従来装置の問題点について、第1図及び第2図にて説明
する。
Problems with the conventional device will be explained with reference to FIGS. 1 and 2.

第1図は、従来のはんだ付外観検査装置の検出部の構成
図である。レーザ光源1より出たレーザ光を集光光学系
2にて、XYテーブル4に置かれた被検査対象物3上に
スポット状に集光する。そのスポットを、斜め検出し、
2方向に配列した一次元イメージセンサ6上に結像する
結像光学系5より構成されている。
FIG. 1 is a configuration diagram of a detection section of a conventional soldering appearance inspection device. A laser beam emitted from a laser light source 1 is focused into a spot by a focusing optical system 2 onto an object to be inspected 3 placed on an XY table 4. Detect the spot diagonally,
It is comprised of an imaging optical system 5 that forms images on one-dimensional image sensors 6 arranged in two directions.

動作原理は、XYテーブル4をX方向罠移動させること
により、被検査対象物3のX方向、Z方向の2次元検出
像を得る。通常、この検出方法はレーザースポット光に
よる光切断法と呼ばれている。
The operating principle is to obtain two-dimensional detected images of the object to be inspected 3 in the X and Z directions by moving the XY table 4 in the X direction. This detection method is usually called a light cutting method using laser spot light.

第2図は、従来のはんだ付外観装置で、検出できない微
小な立体形状の例である。最近、電子部品の小形化が進
み、プリント板上のランド12と電子部品のリード1o
間のはんだ封部11のフィレットが小さくなりてきて、
レーザービーム13のスポット径と同程度の大きさとな
ってきた。
FIG. 2 is an example of a minute three-dimensional shape that cannot be detected by a conventional soldering appearance device. Recently, with the progress of miniaturization of electronic components, land 12 on the printed board and lead 1o of electronic components
The fillet of the solder sealing part 11 between them becomes smaller,
The spot diameter has become approximately the same as the spot diameter of the laser beam 13.

レーザービーム13のスポット径は、被検査対象物3の
Z方向の有効検出範囲で定まる焦点深度の関係で制限さ
れ、小さくすることはできない。
The spot diameter of the laser beam 13 is limited by the depth of focus determined by the effective detection range of the object to be inspected 3 in the Z direction, and cannot be made smaller.

従って、一次元イメージセンサ6上には、スボ、ット像
18が結像され、その走査出力は、リード10のエツジ
部分16で正反射する為に表われるビーク14と、レー
ザービーム13の中心となるフィレット部17での反射
光によるビーク15が表ゎゎる。本来、出力のピーク位
置を検出して、被検査対象物3の2方向の位置を検出し
ている為、2つのピークが表われると、どちらが本当の
ピーク位置かわからなくなってしまう。従って、このよ
うな場合、正しく形状検出できなくなる。
Therefore, a spot image 18 is formed on the one-dimensional image sensor 6, and the scanning output is divided into the beak 14 that appears due to regular reflection at the edge portion 16 of the lead 10, and the center of the laser beam 13. A beak 15 due to the reflected light at the fillet portion 17 appears. Originally, since the peak position of the output is detected and the position of the object to be inspected 3 in two directions is detected, when two peaks appear, it becomes difficult to know which is the true peak position. Therefore, in such a case, the shape cannot be detected correctly.

なお、この種の装置として関連するものに1例えば特開
昭55−39023号[光学的変位測定装置」、特開昭
56−18707号「光学式形状測定方法およびその装
置」、特開昭56−100306号「物体断面形状解析
装置」等が挙げられる。
Related devices of this type include JP-A-55-39023 [Optical Displacement Measuring Device], JP-A-56-18707 ``Optical Shape Measuring Method and Apparatus'', JP-A-56 -100306 "Object cross-sectional shape analysis device" etc.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、従来、形状検出できなかった微小な被
検査対象物の微小立体形状を検出する手段を提供するこ
とである。
An object of the present invention is to provide a means for detecting the minute three-dimensional shape of a minute object to be inspected, whose shape could not be detected conventionally.

〔発明の概要〕[Summary of the invention]

微小な立体形状を検出する為には、レーザスポットのス
ポット径を小さくすれば可能であるが、焦点深度の関係
で、有効な検出範囲を確保する為に小さくできない。本
発明は、結像光学系のX方向の倍率を大きくして、分解
能を改善するようにしたことを特徴とするものである。
Although it is possible to detect minute three-dimensional shapes by reducing the spot diameter of the laser spot, this cannot be done in order to ensure an effective detection range due to the depth of focus. The present invention is characterized in that the magnification of the imaging optical system in the X direction is increased to improve resolution.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の一実施例を第3図、第5図により説明す
る。第3図の構成は、従来の実施例の第2図と同じ構成
であるが、一次元イメージセンサ6の置き方がX方向に
傾けである違いがある。
An embodiment of the present invention will be described below with reference to FIGS. 3 and 5. The configuration shown in FIG. 3 is the same as that of the conventional embodiment shown in FIG. 2, but the difference is that the one-dimensional image sensor 6 is placed tilted in the X direction.

前記一次元イメージセンサ6をX方向に傾けることによ
り、得られる効果を第5図で説明する。
The effect obtained by tilting the one-dimensional image sensor 6 in the X direction will be explained with reference to FIG.

レーザビーム13をフィレット部17を中心に照射した
場合、前記一次元イメージセンサ6上に結像されるスポ
ット像17は、一次元イメージセンサ6をX方向に傾け
ることにより、相対的にX方向の分解能が小さくなった
ことに相当し、従来一次元イメージセンサ6上に結像さ
れていたリード10のエツジ部分16の儂が、一次元イ
メージセンサ6から外に出て結像され、一次元イメージ
センサ出力にはフィレット部17の儂のみがピーク15
としてあられれ、フィレット部17の2方向の位置を誤
りなく検出することができる次に別な実施例を第4図に
ついて説明する。
When the laser beam 13 is irradiated centered on the fillet portion 17, the spot image 17 formed on the one-dimensional image sensor 6 can be formed by tilting the one-dimensional image sensor 6 in the X direction. Corresponding to the reduction in resolution, the edge portion 16 of the lead 10, which was conventionally imaged on the one-dimensional image sensor 6, is imaged outside the one-dimensional image sensor 6, and a one-dimensional image is created. The sensor output has a peak 15 only at the fillet portion 17.
Next, another embodiment in which the positions of the fillet portion 17 in two directions can be detected without error will be described with reference to FIG.

本実施例では、従来の実施例を示す第2図に比べて、結
像光学系5としてX方向の結像倍率を定め石Xシリンド
リカルレンズ7と、Z方向の結像倍率を定めるZシリン
ドリカルレンズ8とから構成され、各々、被検査対象物
3のスポット像を一次元イメージセンサ6上に結像する
ように構成させである。2方向の結像倍率は、Z方向の
有効検出範囲及び、所要分解能を満たすように定め、X
方向の結像倍率は、X方向の所要分解能を満すように(
具体的には一次元イメージセンサ6のアパーチャー幅と
、所要分解能が一致するように結像倍率を定める)定め
る。
In this embodiment, compared to FIG. 2 showing the conventional embodiment, the imaging optical system 5 includes a stone X cylindrical lens 7 that determines the imaging magnification in the 8, each of which is configured to form a spot image of the object to be inspected 3 on the one-dimensional image sensor 6. The imaging magnification in the two directions is determined to satisfy the effective detection range in the Z direction and the required resolution, and
The imaging magnification in the direction is set to satisfy the required resolution in the X direction (
Specifically, the imaging magnification is determined so that the aperture width of the one-dimensional image sensor 6 matches the required resolution.

このようにすれば、X方向の分解能をZ方向倍率に関係
なく小さくでき、前記実施例と同様に微小なフィレット
部17のZ方向位置を正しく検出するごとができる。
In this way, the resolution in the X direction can be made small regardless of the magnification in the Z direction, and the position of the minute fillet portion 17 in the Z direction can be detected correctly as in the previous embodiment.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、従来、正しく形状検出できなかった微
小なはんだ接続部のフィレットでも正しく形状検出する
ことが可能となる。
According to the present invention, it is possible to accurately detect the shape of even a minute fillet of a solder joint, which could not be accurately detected in the past.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、従来装置の検゛出光学系構成図、第2図は、
従来装置で正しく形状検出できない場合の原理図、第3
図は、本発明の一実施例を示す斜視図、第4図は他の実
施例を示す斜視図、wJ5図は本発明で正しく形状検出
できる原理図である。 1・・・レーザー光源  2・・・集光光学系3・・・
被検査対象物  4・・・XYテーブル5・・・結像光
学系  ′10・・・リード11・・・はんだ封部  
 12・・・ランド13・・・レーザービーム 17・
・・フィレット部才 2図 オ 3 l 第4砧
Figure 1 is a configuration diagram of the detection optical system of the conventional device, and Figure 2 is:
Principle diagram when shape cannot be detected correctly with conventional equipment, Part 3
The figure is a perspective view showing one embodiment of the present invention, Fig. 4 is a perspective view showing another embodiment, and Fig. wJ5 is a diagram showing the principle by which shape can be correctly detected by the present invention. 1...Laser light source 2...Condensing optical system 3...
Object to be inspected 4...XY table 5...Imaging optical system '10...Lead 11...Solder sealing part
12... Land 13... Laser beam 17.
...Fillet Department Sai 2 Figure O 3 l 4th Kinuta

Claims (1)

【特許請求の範囲】[Claims] 1、対象物上にレーザーをスポット状に集光する集光光
学系と、そのレーザー光源と、対象物上のスポットを斜
めに検出して、集光光学系の光軸と同一平面方向に配列
した1次元イメージセンサ上にスポット像を結像する結
像光学系とからなる検出ヘッドと、対象物を保持するワ
ークテーブルより成り、検出ヘッド又は、ワークテーブ
ルを移動させて、対象物上のスポットを走査し、対象物
上のスポット位置を検出する装置であり、特に、結像光
学系に、シリンドリカルレンズを用いて、スポット走査
方向の分解能を小さくし、あるいは一次元イメージセン
サを、スポット走査方向に対して斜めに置くことで、分
解能を小さくしたことを特徴とする形状検出装置。
1. A focusing optical system that focuses the laser into a spot on the object, the laser light source, and the spot on the object that is detected diagonally and arranged in the same plane as the optical axis of the focusing optical system. It consists of a detection head consisting of an imaging optical system that forms a spot image on a one-dimensional image sensor, and a work table that holds an object. It is a device that scans and detects the spot position on the target object.In particular, it uses a cylindrical lens in the imaging optical system to reduce the resolution in the spot scanning direction, or a one-dimensional image sensor A shape detection device characterized by reducing resolution by placing it at an angle to the object.
JP4657785A 1985-03-11 1985-03-11 Shape detection apparatus Pending JPS61205808A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4657785A JPS61205808A (en) 1985-03-11 1985-03-11 Shape detection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4657785A JPS61205808A (en) 1985-03-11 1985-03-11 Shape detection apparatus

Publications (1)

Publication Number Publication Date
JPS61205808A true JPS61205808A (en) 1986-09-12

Family

ID=12751153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4657785A Pending JPS61205808A (en) 1985-03-11 1985-03-11 Shape detection apparatus

Country Status (1)

Country Link
JP (1) JPS61205808A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166753A (en) * 1989-07-17 1992-11-24 Matsushita Electric Industrial Co., Ltd. Method for inspecting electronic devices mounted on a circuit board
US5206705A (en) * 1989-12-13 1993-04-27 Matsushita Electric Industrial Co., Ltd. Method of checking external shape of solder portion
CN105388157A (en) * 2015-12-08 2016-03-09 苏州索力旺新能源科技有限公司 Device capable of stably detecting tin plating amount
TWI741098B (en) * 2017-01-24 2021-10-01 日商迪思科股份有限公司 Point shape detection device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166753A (en) * 1989-07-17 1992-11-24 Matsushita Electric Industrial Co., Ltd. Method for inspecting electronic devices mounted on a circuit board
US5206705A (en) * 1989-12-13 1993-04-27 Matsushita Electric Industrial Co., Ltd. Method of checking external shape of solder portion
CN105388157A (en) * 2015-12-08 2016-03-09 苏州索力旺新能源科技有限公司 Device capable of stably detecting tin plating amount
TWI741098B (en) * 2017-01-24 2021-10-01 日商迪思科股份有限公司 Point shape detection device

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