JPS61202857A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS61202857A JPS61202857A JP4258785A JP4258785A JPS61202857A JP S61202857 A JPS61202857 A JP S61202857A JP 4258785 A JP4258785 A JP 4258785A JP 4258785 A JP4258785 A JP 4258785A JP S61202857 A JPS61202857 A JP S61202857A
- Authority
- JP
- Japan
- Prior art keywords
- common electrode
- electrode line
- chip
- head
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、サーマルヘッドに係り、詳しくは複数個の発
熱抵抗体素子を同一基板上に直線的に配置し、情報に従
いこの発熱抵抗体素子を通電発熱させて感熱記録紙に発
色記録させ、あるいはインクリボンを介して普通紙に転
写記録させるサーマルヘッドに関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a thermal head, and more specifically, a plurality of heating resistor elements are linearly arranged on the same substrate, and the heating resistor elements are arranged in accordance with information. The present invention relates to a thermal head that generates heat by applying electricity to perform color recording on thermosensitive recording paper, or transfers and records onto plain paper via an ink ribbon.
従来のサーマルヘッドは、例えば第2図に示すように、
電気絶縁性のアルミナ基板lの上に薄くグレーズ層2を
設ける。その上にTatNなどからなり発熱して感熱記
録紙(図示せず)等に発色エネルギーを与える発熱抵抗
体層3と、その発熱抵抗体層3に接続されて情報に応じ
て電流を通じるAj!、Niなどからなる導体JI4.
5(Niから成る導体層5は第4図を参照)と、S i
Ozなどからなり前記発熱抵抗体層3を酸化による劣
化から保護する耐酸化層6と、Ta、Osなどからなり
感熱記録紙との接触による摩耗から前記発熱抵抗体層3
および導体層4および耐酸化層6を保護するための耐摩
耗層7とを順次積層した構造を有する。A conventional thermal head, for example, as shown in Fig. 2,
A thin glaze layer 2 is provided on an electrically insulating alumina substrate l. On top of that is a heating resistor layer 3 made of TatN or the like that generates heat and gives coloring energy to a thermal recording paper (not shown), etc., and Aj! connected to the heating resistor layer 3 to conduct current according to information. , Ni, etc. conductor JI4.
5 (see FIG. 4 for the conductor layer 5 made of Ni), and Si
An oxidation-resistant layer 6 made of Oz or the like to protect the heating resistor layer 3 from deterioration due to oxidation; and an oxidation-resistant layer 6 made of Ta, Os, etc. to protect the heating resistor layer 3 from wear due to contact with heat-sensitive recording paper.
It has a structure in which a conductive layer 4 and a wear-resistant layer 7 for protecting the oxidation-resistant layer 6 are sequentially laminated.
そして前記導体層4.5に電流を通じたとき、導体層4
の一部が取り除かれて一段下がって形成された発熱部8
が発熱して、感熱記録紙等に発色記録エネルギーを与え
るようになっている。第3図に示すように上記サーマル
ヘッドは発熱部8の両側に、共通電極ライン9とそれぞ
れの個別電極ライン10a〜10gとが設けられている
。そして、共通および個別の電極ライン9.10a〜1
0gの両者は図中、線Bにより画成された下側の端子部
11の範囲域で、第4図に示すように半田層13がニッ
ケルから成る導体層5を覆って予備半田付されている。When a current is passed through the conductor layer 4.5, the conductor layer 4.
The heat generating part 8 is formed by removing a part of the
generates heat and provides color recording energy to thermal recording paper, etc. As shown in FIG. 3, the thermal head is provided with a common electrode line 9 and individual electrode lines 10a to 10g on both sides of the heat generating section 8. and common and individual electrode lines 9.10a-1
0g are the range of the lower terminal portion 11 defined by line B in the figure, and the solder layer 13 is pre-soldered covering the conductor layer 5 made of nickel as shown in FIG. There is.
この半田層13は、外部回路(図示せず)と、半田付に
より接続されるようになっている。第3図中線Bにより
画成された下側の端子部11以外の上側のヘッド面部1
2は、耐酸化層6および耐摩耗層7によって覆われ保護
されている。なお第2図は、第3図のA−A ’線に沿
って切断した断面図である。This solder layer 13 is connected to an external circuit (not shown) by soldering. Upper head surface portion 1 other than the lower terminal portion 11 defined by middle line B in FIG. 3
2 is covered and protected by an oxidation-resistant layer 6 and a wear-resistant layer 7. Note that FIG. 2 is a sectional view taken along line AA' in FIG. 3.
このような従来のサーマルヘッドにおいて、端子部11
には第4図に示すように半田層13がニッケルから成る
導体層5を覆って予備半田付されているが、その予備半
田付の方法は、例えばサーマルヘッドを直接溶融半田に
浸漬する、又は半田クリームを端子部ll上に印刷して
リフローする場合などがある。In such a conventional thermal head, the terminal portion 11
As shown in FIG. 4, a solder layer 13 is pre-soldered covering the conductor layer 5 made of nickel, and the pre-soldering can be done by, for example, dipping a thermal head directly into molten solder, or There are cases where solder cream is printed on the terminal portion ll and reflowed.
により導体層5上でかまぼこ型に盛上がり、端子幅寸法
の大小により、その厚みと付着量は異なる。This builds up in a semi-cylindrical shape on the conductor layer 5, and its thickness and adhesion amount vary depending on the width of the terminal.
一般にサーマルヘッドの端子間ギャップ寸法は0.2鴎
以内と小さなものであり、そのサーマルヘッドに単なる
半田ディツプによって半田層13を形成した場合、端子
11に外部回路との電気接続を行うフレキシブル・プリ
ント回路(F P C)を位置決めし、加圧、加熱して
、両方の半田を溶かし溶着させた時、半田量が多く互い
の端子間に半田ブリッジが生じ電気的ショート不良を多
発する。Generally, the gap between the terminals of a thermal head is as small as 0.2 mm or less, and if the solder layer 13 is formed on the thermal head by simply dipping the solder, the terminal 11 will have a flexible print that connects the terminal 11 electrically to an external circuit. When the circuit (FPC) is positioned, pressurized and heated to melt and weld both solders, the amount of solder is large and solder bridges occur between the terminals, resulting in frequent electrical short-circuit failures.
このためサーマルヘッドの端子半田デイツプ工程におい
ては、例えばノズルから圧縮空気を吹付けて、表面張力
による盛上がりを押さえているが、それぞれの端子に付
着した半田の厚みのバラツキはチップ内で略10〜20
μmも生じるものがある。このように半田デイツプ法に
よる端子部11の半田層13の形成は、厚みのバラツキ
が根本的に大きくなることはさけられない欠点である。For this reason, in the terminal solder dipping process of the thermal head, for example, compressed air is blown from a nozzle to suppress the swelling due to surface tension, but the variation in the thickness of the solder attached to each terminal within the chip is approximately 10 to 10 mm. 20
In some cases, μm is also generated. As described above, forming the solder layer 13 of the terminal portion 11 by the solder dip method has an unavoidable drawback that the variation in thickness becomes fundamentally large.
例えば第4図に示すように半田層13の厚みのバラツキ
の大きい状態で外部回路接続用のFPC(図示せず)を
溶着するとき、加圧、加熱していくと複数の端子の中で
最も半田層13が盛上がり高(なった部分に集中荷重が
加わり、その部分の半田が多量に溶けて広がり、全体の
端子がFPCに接続されたときには、端子間に半田のブ
リッジが生じ、電気的ショート不良を多発する。そのた
め製造管理が困難となり、かつ、この最終工程において
製品として完全不良となるため、損失額が大きいなどの
重大な欠点があった、
このような欠点を改善する為に、従来の半田デイツプ法
を電気半田メッキにすることが提案されている。For example, when welding an FPC (not shown) for external circuit connection with the solder layer 13 having large variations in thickness as shown in FIG. When a concentrated load is applied to the part where the solder layer 13 has increased in height, a large amount of the solder in that part melts and spreads, and the entire terminal is connected to the FPC, a solder bridge occurs between the terminals, causing an electrical short. Many defects occur.As a result, manufacturing control becomes difficult, and the product becomes completely defective in this final process, resulting in large losses.In order to improve these defects, conventional methods It has been proposed to replace the solder dip method with electric solder plating.
例えば第5図にその一例を示す0図示していないが、こ
のヘッドチップの両側には同一パターンのチップが形成
されており、1枚の基板上に所定数のチップが形成され
ているものである。第5図において15は隣接のヘッド
チップの共通電極ライン9同士を結合している導体パタ
ーンであり、この導体パターン15により、端子部11
に示す共通電極ライン9及び個別電極ライン10a〜1
0gに電気半田メッキ用の電流を流すものである。For example, an example of this is shown in Figure 5.Although not shown, chips with the same pattern are formed on both sides of this head chip, and a predetermined number of chips are formed on one substrate. be. In FIG. 5, reference numeral 15 denotes a conductor pattern that connects the common electrode lines 9 of adjacent head chips.
Common electrode line 9 and individual electrode lines 10a to 1 shown in
A current for electric solder plating is applied to 0g.
このようにして電気半田メッキを行うと、半田層14は
均一な厚みとなり、その膜厚の制御も簡単になる。第6
図は端子部11の断面図であり、14の半田層はNiか
ら成る導体Ji5の上に均一な厚みで形成することがで
きる。When electrical solder plating is performed in this manner, the solder layer 14 has a uniform thickness, and the film thickness can be easily controlled. 6th
The figure is a cross-sectional view of the terminal portion 11, and the solder layer 14 can be formed with a uniform thickness on the conductor Ji5 made of Ni.
しかし、このようなパターンで形成されたヘッドは、1
個ずつに分別した時、15のメッキをするための導体パ
ターンの断面が露出してしまう為、導体にAIl等を使
用した場合には、腐食し易すく、また、発熱部8が導体
パターン15のパターン断面部に近い為、発熱体部8が
導体Aj!の腐食の影響を非常に受は品いという欠点が
あった。However, a head formed with such a pattern has 1
When separated into individual parts, the cross section of the conductor pattern for plating 15 is exposed, so if the conductor is made of Al or the like, it is likely to corrode, and the heat generating part 8 Because it is close to the cross section of the pattern, the heating element part 8 is the conductor Aj! The disadvantage was that it was extremely susceptible to corrosion.
〔発明の目的〕
本発明は以上のような、従来例の欠点に鑑みて為された
ものであり、その目的は、ヘッド端子の電気メッキのた
めの給電の導体パターンの位置を変更することにより、
端子半田厚みのバラツキの少ない、また、発熱体に対す
る導体腐食の影響を低減した、信頼性の高いサーマルヘ
ッドを提供することにある。[Object of the Invention] The present invention has been made in view of the above-mentioned drawbacks of the conventional example, and its purpose is to change the position of the power supply conductor pattern for electroplating of the head terminal. ,
It is an object of the present invention to provide a highly reliable thermal head in which there is little variation in terminal solder thickness and in which the influence of conductor corrosion on a heating element is reduced.
以上のような目的を達成するため、本発明は、サーマル
ヘッドの共通電極ラインをチップの両側に設け、その共
通電極ラインどうしにメッキ用の給電パターンを形成し
たヘッドを構成するものである。In order to achieve the above objects, the present invention constitutes a head in which common electrode lines of a thermal head are provided on both sides of a chip, and a power supply pattern for plating is formed between the common electrode lines.
第1図は本発明の一実施例を示す平面図であり、従来例
の第5図と同様に8は発熱部、9は共通電極ライン、1
0a−10gは個別電極ラインである。ここで、共通電
極ライン9は、一方はチップの一端部から発熱部8の下
方へ伸びて端子部17に接続されており、他方は発熱部
8と個別電極ライン10a〜Logとを囲むようにして
チップの他端部から下方へ形成されている。このように
して、ヘッドチップの両側である両端部に形成された共
通電極ライン9に、メッキの給電用パターン16が接続
形成されており、隣接するヘッドチップの共通電極ライ
ン9に結合されている。FIG. 1 is a plan view showing one embodiment of the present invention, in which 8 is a heat generating part, 9 is a common electrode line, 1
0a-10g are individual electrode lines. Here, the common electrode line 9 has one end extending below the heat generating section 8 and connected to the terminal section 17, and the other extending around the heat generating section 8 and the individual electrode lines 10a to Log on the chip. It is formed downward from the other end. In this way, the plated power supply pattern 16 is connected to the common electrode line 9 formed on both ends of the head chip, and is coupled to the common electrode line 9 of the adjacent head chip. .
このようなパターン形成とすることにより、電気メツキ
形成用の電流は一方の共通電極ライン9から流れ込み、
発熱部8を経由して各個別電橋ライン102〜10gへ
流れる。また他方の共通電極ライン9を経由して隣接の
ヘッドの共通電極ラインへ流れ出していくものである。By forming such a pattern, the current for forming electroplating flows from one common electrode line 9,
It flows through the heat generating part 8 to each individual electric bridge line 102 to 10g. Further, it flows out to the common electrode line of the adjacent head via the other common electrode line 9.
本発明のヘッドをチップに分割した時には、導体の断面
は共通電極ラインに接続されているメッキの給電用パタ
ーン16の部分で生ずるが、この部分は発熱部8から最
も離れた部分であるので、万一、断面から腐食が始まっ
たとしても、発熱部8への影響は軽減されている。When the head of the present invention is divided into chips, the cross section of the conductor occurs at the part of the plated power supply pattern 16 connected to the common electrode line, but this part is the part farthest from the heat generating part 8. Even if corrosion were to start from the cross section, the effect on the heat generating section 8 would be reduced.
また、一般的にヘッドの端子部17にFPCを溶着した
場合には、その端子部17には、耐湿性樹脂をコーティ
ングすることになっており、端子部17に近接して導体
層の断面があっても、腐食する確率は非常に小さいもの
となる。In addition, when an FPC is generally welded to the terminal part 17 of the head, the terminal part 17 is coated with a moisture-resistant resin, and the cross section of the conductor layer is coated in the vicinity of the terminal part 17. Even if there is, the probability of corrosion is very small.
従って本発明は、端子部の電気半田メッキ用の給電パタ
ーンを発熱部から離れた共通電極ラインに設けであるの
で、給電パターンが発熱部の近傍に形成されていた従来
のヘッドに比べ、導体腐食の影響が少なく、信頼性の高
いサーマルヘッドを構成できるという効果がある。特に
導体がAn、Cuのような腐食の進行し易い材質である
時には、その効果は特に大きい。Therefore, in the present invention, the power supply pattern for electrical solder plating of the terminal part is provided on the common electrode line that is distant from the heat generating part, so compared to the conventional head in which the power supply pattern is formed near the heat generating part, conductor corrosion is less likely to occur. This has the advantage that a highly reliable thermal head can be constructed with less influence of heat. This effect is especially great when the conductor is made of a material that is prone to corrosion, such as An or Cu.
第1図は本発明のサーマルヘッドの一実施例を示す平面
図、第2図は第3図のA−A’線に沿って切断した従来
のサーマルヘッドを示す断面図、第、3図は従来のサー
マルヘッドの平面図、第4図は従来の端子部を示す断面
図、第5図は従来の端子部への電気半田メッキ用パター
ンを示す平面図、第6図は第5図による電気半田メッキ
による端子部を示す断面図である。
l・・・・絶縁性基板、2・・・・グレーズ層、3・・
・・発熱抵抗体層、4,5導体層、6・・・・耐酸化層
、7・・・・耐摩耗層、8・・・・発熱部、9・・・・
共通電極ライン、10a−10g・・・・個別電極ライ
ン、12・・・・ヘッド面、14・・・・半田層、16
・・・・メッキ用の給電パターン、17・・・・端子部
。
第7図
第2図
第3図
第4図FIG. 1 is a plan view showing an embodiment of the thermal head of the present invention, FIG. 2 is a sectional view showing a conventional thermal head taken along line AA' in FIG. 3, and FIGS. A plan view of a conventional thermal head, FIG. 4 is a sectional view showing a conventional terminal section, FIG. 5 is a plan view showing a pattern for electrical solder plating on a conventional terminal section, and FIG. FIG. 3 is a cross-sectional view showing a terminal portion formed by solder plating. l...Insulating substrate, 2...Glaze layer, 3...
...Heating resistor layer, 4, 5 conductor layer, 6... Oxidation resistant layer, 7... Wear resistant layer, 8... Heat generating part, 9...
Common electrode line, 10a-10g... Individual electrode line, 12... Head surface, 14... Solder layer, 16
...Power supply pattern for plating, 17...Terminal section. Figure 7 Figure 2 Figure 3 Figure 4
Claims (1)
と、個別電極ラインと、端子部とから成るサーマルヘッ
ドにおいて、前記端子部に電気メッキを形成するための
給電パターンが共通電極ラインに接続されているととも
に、端子部の両端部に形成されていることを特徴とする
サーマルヘッド。In a thermal head formed on an insulating substrate and consisting of a heat generating part, a common electrode line, an individual electrode line, and a terminal part, a power supply pattern for forming electroplating on the terminal part is provided on the common electrode line. A thermal head characterized by being connected and formed at both ends of a terminal part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4258785A JPS61202857A (en) | 1985-03-06 | 1985-03-06 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4258785A JPS61202857A (en) | 1985-03-06 | 1985-03-06 | Thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61202857A true JPS61202857A (en) | 1986-09-08 |
Family
ID=12640192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4258785A Pending JPS61202857A (en) | 1985-03-06 | 1985-03-06 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61202857A (en) |
-
1985
- 1985-03-06 JP JP4258785A patent/JPS61202857A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101268525A (en) | Chip resistor | |
US4446355A (en) | Crossover construction of thermal-head and method of manufacturing same | |
JPS61202857A (en) | Thermal head | |
US7324126B2 (en) | Thermal head including bonding pads having irregular surfaces formed by forming irregularities on underlayer | |
JP4135890B2 (en) | Solder connection method for flat flexible cable to heat resistant circuit board | |
CN110884260A (en) | Thermal printing head and manufacturing method thereof | |
JPS63278867A (en) | Thermal print head | |
JPH0479310B2 (en) | ||
JPH0586346B2 (en) | ||
JPS60183752A (en) | Long electronic device | |
JPH02145354A (en) | Thermal head and manufacture thereof | |
JPS6250166A (en) | Thermal head | |
JPS6216163A (en) | Thermal head | |
JP2516235Y2 (en) | Thermal head | |
JP3323140B2 (en) | Chip resistor | |
JP3702516B2 (en) | Method for manufacturing printed wiring board | |
JPH07192857A (en) | Resistor heater | |
JPS63268663A (en) | Thermal head substrate and manufacture thereof | |
JPH07192847A (en) | Resistor heater | |
JPH0442136Y2 (en) | ||
JPH05229160A (en) | Thermal head | |
JPS61263770A (en) | Thermal head | |
JPH079640Y2 (en) | Thermal head | |
JP3435419B2 (en) | Chip resistor | |
JPS6153060A (en) | Manufacture method of thermal head |