JPS6216163A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS6216163A JPS6216163A JP60156583A JP15658385A JPS6216163A JP S6216163 A JPS6216163 A JP S6216163A JP 60156583 A JP60156583 A JP 60156583A JP 15658385 A JP15658385 A JP 15658385A JP S6216163 A JPS6216163 A JP S6216163A
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- thermal head
- conductor
- nickel layer
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 69
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 34
- 239000004020 conductor Substances 0.000 claims abstract description 30
- 238000007639 printing Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 239000010931 gold Substances 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims abstract description 3
- 238000004544 sputter deposition Methods 0.000 claims abstract description 3
- 238000007740 vapor deposition Methods 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000007598 dipping method Methods 0.000 claims description 2
- 239000011241 protective layer Substances 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 4
- 230000002195 synergetic effect Effects 0.000 abstract description 4
- 239000011135 tin Substances 0.000 abstract description 4
- 229910052718 tin Inorganic materials 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000007654 immersion Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 14
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Non-Adjustable Resistors (AREA)
- Electronic Switches (AREA)
- Details Of Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］ ゛
本発明はサーマルヘッドに係り、特に耐酸化性のない金
属にて形成された導体パターンの酸化防止に関す不もの
である。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a thermal head, and particularly relates to the prevention of oxidation of a conductor pattern formed of a metal with no oxidation resistance.
第２図は従来のサーマルヘッドを説明するための断面側
面図であり、図において、（１）は発熱基板、（２）ｒ
ｊ発熱基板上に形成された導体リード、（３）は発熱基
板（１）と導体リード（２）層間に形成され導体リード
（２）間に構成された発熱抵抗体、（４）はこの発熱抵
抗体（３）を摩耗および酸化から守るための抵抗体保護
層、（５）は導体リード（２〕が酸化するのを防止する
酸化防止層である。FIG. 2 is a cross-sectional side view for explaining a conventional thermal head. In the figure, (1) is a heat generating board, (2) r
j The conductor lead formed on the heat generating board, (3) is the heat generating resistor formed between the heat generating board (1) and the conductor lead (2) layer, and is configured between the conductor leads (2), (4) is this heat generating A resistor protection layer protects the resistor (3) from wear and oxidation, and (5) is an oxidation prevention layer that prevents the conductor lead (2) from oxidizing.
以上のように構成される従来のサーマルヘッドは酸化防
止層（５）で覆われていない導体リード（２）へ外部回
路（図示せず）より電力信号等が縮重され部体リード（
２）間に構成された発熱抵抗体（３）が発熱、 しプ
ラテン（図示せず）との間に挾まれた感熱紙又は転写紙
（図示せず）を印写す６゜
〔発明が解決しようとする問題点〕
従来のサーマルヘッドは以上のように導体リード（２）
がアルミニウム、 銅、 銀、スズ等のニッケルおよび
金以外の電気の良導体で形成されているので実使用での
環境状態で電流と湿度との相乗作用で腐食され初期電気
の良導体であったものが次第に不良導体となりサーマル
ヘッドによって印写できなくな６という欠点があった。In the conventional thermal head configured as described above, a power signal etc. is degenerated from an external circuit (not shown) to the conductor lead (2) not covered with the anti-oxidation layer (5), and the body lead (
2) The heat-generating resistor (3) constructed in between generates heat and prints on thermal paper or transfer paper (not shown) held between the platen (not shown). [Problems with] Conventional thermal heads have conductor leads (2) as described above.
Because it is made of good electrical conductors other than nickel and gold, such as aluminum, copper, silver, and tin, it corrodes due to the synergistic effect of current and humidity in the actual environment, and what was initially a good electrical conductor is destroyed. It gradually became a poor conductor and could no longer be printed by a thermal head.6.
本発明は以上の点に鑑み導体リードがａ度によって不良
導体となるこさなく、常に良導体を維持し印写できるサ
ーマルヘッドを得ることと目的とする。In view of the above points, it is an object of the present invention to provide a thermal head that can always maintain a good conductor and print without causing the conductor lead to become a bad conductor due to a degree.
本発明のサーマルヘッドはアルミニウム、銅、銀、スズ
等で形成された導体リードの露出部をニッケルで覆った
ものである。The thermal head of the present invention has conductor leads made of aluminum, copper, silver, tin, etc., with exposed parts covered with nickel.
本発明における導体リードの露出部はニッケルで覆われ
ているためニッケル自体が耐腐食性が高く湿度による腐
食を防止でき、常に外部回路より電力および信号を給電
できるので発熱抵抗体で正常な印写ができる。In the present invention, the exposed part of the conductor lead is covered with nickel, so nickel itself has high corrosion resistance and can prevent corrosion due to humidity. Power and signals can always be supplied from the external circuit, so the heating resistor ensures normal printing. Can be done.
［発明の実施例］
以下、従来に相当する部分には同−符８を付して示す第
１図の実施例について本発明を説明する。[Embodiments of the Invention] Hereinafter, the present invention will be described with reference to an embodiment shown in FIG. 1, in which parts corresponding to the conventional ones are indicated by the same reference numeral 8.
図において、（ｂ）は導体リード（２）の露出部を覆っ
たニッケル層であり、上記以外の構成は従来と同様であ
るのでその説明を省略する。In the figure, (b) is a nickel layer that covers the exposed portion of the conductor lead (2), and the configuration other than the above is the same as the conventional one, so a description thereof will be omitted.
以上のように構成される本発明のサーマルヘッドは導体
リード（２）がアルミニウム、銅、銀、スズ等のニッケ
ルおよび金以外の電気の良導体の表面を耐腐食性の高い
ニッケル層（６）で覆っであるので実使用での環境状態
で電流と湿度との相乗作用でニッケル層（６）が腐食さ
れることがないため下部の導体リード（２）も腐食され
ることがないため正常な印写ができなくなるという重大
欠陥になることばない。In the thermal head of the present invention constructed as described above, the conductor lead (2) is made of a highly corrosion-resistant nickel layer (6) on the surface of a good electrical conductor other than nickel or gold, such as aluminum, copper, silver, or tin. Because it is covered, the nickel layer (6) will not be corroded due to the synergistic effect of current and humidity under the actual environmental conditions, so the lower conductor lead (2) will not be corroded either, so a normal mark can be obtained. There are no words that can cause a serious defect such as not being able to take pictures.
ニッケル層（６）の形成方法としては、メッキ、印刷、
蒸着、浸漬、スパッタリング等が用いつる。Methods for forming the nickel layer (6) include plating, printing,
Vapor deposition, dipping, sputtering, etc. are used.
なお、上記実施例では導体リード（２）およびニッケル
層（６）を発熱基板（１）の表面だけに形成したものを
示し友が、発熱基板（１）の側面および裏面に形成した
ものでもよい。Note that in the above embodiment, the conductor leads (2) and the nickel layer (6) are formed only on the surface of the heat generating substrate (1), but they may be formed on the side and back surfaces of the heat generating substrate (1). .
さらに、発熱基板（１）に穴を設け、その穴の側面°に
形成したものでもよい。さらにニッケル層（６）の材質
はニラクル系のニッケルが生成分であ３耐腐食性の高い
ものであれば何んであってもよい。Furthermore, a hole may be provided in the heat generating substrate (1) and formed on the side surface of the hole. Furthermore, the material of the nickel layer (6) may be any material as long as it contains nickel of the Niracle type and has high corrosion resistance.
〔発明の効果１
以上のように本発明によればニッケル層を導体リードの
表面に設けたので、実使用での環境状態で電流と湿度と
の相乗作用で導体リードがニッケル層で覆わ八ているた
め、ニッケルの高いｎｔｉｔ腐食性のため腐食されるこ
とがなく正常な印字？常に行うことができる効果がある
。[Effect of the invention 1 As described above, according to the present invention, since the nickel layer is provided on the surface of the conductor lead, the conductor lead is covered with the nickel layer due to the synergistic effect of current and humidity in the actual environment. Because of the high ntit corrosive nature of nickel, is it possible to print normally without being corroded? There is always an effect that can be done.
第１図は本発明の一実施例によるサーマルヘッドを示す
断面側面図、第２図は従来のサーマルヘッドを示す断面
側面図であ 。
図において、（υは発熱基板、（２）は導体リード。
（３）は発熱抵抗体、（４）は抵抗体保護層、（５）は
酸化防止層、（ｂ）はニッケル（Ｎｉ）層でろ 。
なふ・、図中同一符号は同−又は相当部分を示す。FIG. 1 is a cross-sectional side view showing a thermal head according to an embodiment of the present invention, and FIG. 2 is a cross-sectional side view showing a conventional thermal head. In the figure, (υ is the heat generating board, (2) is the conductor lead, (3) is the heat generating resistor, (4) is the resistor protective layer, (5) is the oxidation prevention layer, and (b) is the nickel (Ni) layer. The same reference numerals in the figures indicate the same or equivalent parts.
Claims (6)
電気の良導体で形成された導体パターンを備え、上記導
体パターンが保護層で覆われていない部分をニッケル又
はニッケルを主成分とする金属で覆つたことを特徴とす
るサーマルヘッド。(1) A heat-generating substrate and a conductor pattern formed on the heat-generating substrate made of a good electrical conductor other than gold, with the portion of the conductor pattern not covered with a protective layer containing nickel or nickel as a main component. A thermal head characterized by being covered with metal.
ッキ法により形成したことを特徴とする特許請求範囲第
１項に記載のサーマルヘッド。(2) The thermal head according to claim 1, wherein the nickel and the metal mainly composed of nickel are formed by a plating method.
刷法により形成したことを特徴とする特許請求範囲第１
項記載のサーマルヘッド。(3) Claim 1, characterized in that the nickel and the metal containing nickel as a main component are formed by a printing method.
Thermal head described in section.
着法により形成したことを特徴とする特許請求範囲第１
項記載のサーマルヘッド。(4) Nickel and the metal mainly composed of nickel are formed by a vapor deposition method.
Thermal head described in section.
漬法により形成したことを特徴とする特許請求範囲第１
項記載のサーマルヘッド。(5) Nickel and the metal mainly composed of nickel are formed by a dipping method.
Thermal head described in section.
パッタリング法により形成したことを特徴とする特許請
求範囲第１項記載のサーマルヘッド。(6) The thermal head according to claim 1, characterized in that it is formed by a metal sputtering method containing nickel and nickel as main components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60156583A JPS6216163A (en) | 1985-07-15 | 1985-07-15 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60156583A JPS6216163A (en) | 1985-07-15 | 1985-07-15 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6216163A true JPS6216163A (en) | 1987-01-24 |
Family
ID=15630934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60156583A Pending JPS6216163A (en) | 1985-07-15 | 1985-07-15 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6216163A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0500955A1 (en) * | 1990-09-10 | 1992-09-02 | Kabushiki Kaisha Komatsu Seisakusho | Positive characteristic thermistor and manufacturing method therefor |
| US7304823B2 (en) | 2002-10-29 | 2007-12-04 | Fujitsu Limited | Suspension for head slider having higher resistance to vibration |
| US7726777B2 (en) | 2004-11-15 | 2010-06-01 | Samsung Electronics Co., Ltd. | Inkjet print head and method of fabricating the same |
-
1985
- 1985-07-15 JP JP60156583A patent/JPS6216163A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0500955A1 (en) * | 1990-09-10 | 1992-09-02 | Kabushiki Kaisha Komatsu Seisakusho | Positive characteristic thermistor and manufacturing method therefor |
| US5289155A (en) * | 1990-09-10 | 1994-02-22 | Kabushiki Kaisha Komatsu Seisakusho | Positive temperature characteristic thermistor and manufacturing method therefor |
| US7304823B2 (en) | 2002-10-29 | 2007-12-04 | Fujitsu Limited | Suspension for head slider having higher resistance to vibration |
| US7726777B2 (en) | 2004-11-15 | 2010-06-01 | Samsung Electronics Co., Ltd. | Inkjet print head and method of fabricating the same |
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