JPS60112462A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS60112462A JPS60112462A JP58220556A JP22055683A JPS60112462A JP S60112462 A JPS60112462 A JP S60112462A JP 58220556 A JP58220556 A JP 58220556A JP 22055683 A JP22055683 A JP 22055683A JP S60112462 A JPS60112462 A JP S60112462A
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- thermal head
- heat
- heating resistor
- multilayer circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
Abstract
Description
【発明の詳細な説明】
発明の技術分野
本発明は電子計算装置等の出力装置として使用されるサ
ーマルプリンタのサーマルヘッドニ関スるものである。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a thermal head of a thermal printer used as an output device for an electronic computing device or the like.
技術の背景
サーマルヘッドは絶縁性基板の上に薄膜又は厚膜による
多数の発熱抵抗体を有し、所望の抵抗体に電気的パルス
を印加することによシ該抵抗体を発熱させ、感熱記録紙
に印字を行なうものである。Background of the Technology A thermal head has a large number of thin-film or thick-film heating resistors on an insulating substrate, and generates heat by applying an electric pulse to a desired resistor, thereby recording heat. It prints on paper.
このサーマルヘッドは機械的可動部分がなく無騒音であ
るという特徴があるためサーマルプリンタに組込まれ事
務用電子機器等に用いられる。而してこれらの事務用電
子機器は近来小型化が進められており、従ってプリンタ
も小型化が要求されている。This thermal head is characterized by having no mechanically moving parts and being noiseless, so it is incorporated into thermal printers and used in electronic office equipment and the like. In recent years, these office electronic devices have been becoming smaller, and printers are also required to be smaller.
従来技術と問題点
第１図は従来のミニプリンタのサーマルヘッドを説明す
るための図であり、同図において、１はグレーズドアル
ミナ基板、２は抵抗体、３は導体、４は樹脂による層間
絶縁層、５は最上層の導体、６は導体を保護するだめの
保護膜、７は印字を行なう発熱抵抗体部、８はその保護
膜、９はプラテンをそれぞれ示している。このサーマル
ヘッドは、ヘッドを小型にして一基板から多数枚のサー
マルヘッドを取ることを可能として、安価としたもので
あり印字を行なう薄膜型のヘッド部Ａと、該ヘッド部を
駆動するための多層回路部Ｂとが同−基板上に形成され
ている。Prior Art and Problems Figure 1 is a diagram for explaining the thermal head of a conventional mini printer. In the figure, 1 is a glazed alumina substrate, 2 is a resistor, 3 is a conductor, and 4 is an interlayer insulation made of resin. 5 is the uppermost conductor layer, 6 is a protective film for protecting the conductor, 7 is a heating resistor section for printing, 8 is the protective film, and 9 is a platen. This thermal head is made small and inexpensive by making it possible to take multiple thermal heads from one substrate. It has a thin film type head section A that performs printing, and a A multilayer circuit section B is formed on the same substrate.
このようなサーマルヘッドにおいて、小型化するため基
板１を小さくシ、ヘッド部Ａと多層回路部Ｂとを接近さ
せると、多層回路部Ｂの最上層の保護膜６にプラテン９
とか印字用紙が接触し易くなり、このため樹脂を用いた
保護膜６が摩耗し導体５が露出して印字用紙から出る水
蒸気によって腐食され、断線、ショートなどの事故が発
生するという欠点があった。In such a thermal head, if the substrate 1 is made smaller in order to reduce the size and the head part A and the multilayer circuit part B are brought closer together, the platen 9 is attached to the uppermost protective film 6 of the multilayer circuit part B.
The printing paper comes into contact easily, which causes the protective film 6 made of resin to wear out and the conductor 5 to be exposed and corroded by the water vapor emitted from the printing paper, resulting in accidents such as wire breakage and short circuits. .
発明の目的
本発明は上記従来の欠点に鑑み、信頼性の高い構造で小
形化したサーマルヘッドを提供することを目的とするも
のである。OBJECTS OF THE INVENTION In view of the above-mentioned conventional drawbacks, it is an object of the present invention to provide a compact thermal head with a highly reliable structure.
発明の構成
そしてこの目的は本発明によれば、多数の発熱抵抗体を
有する発熱抵抗体部と、該発熱抵抗体に電気的パルスを
印加するための回路の多層回路部とが同一絶縁性基板上
に設けられたサーマルヘッドにおいて、前記多層回路部
の最上層の導体の絶縁保護膜を発熱抵抗体部の保護膜と
同一の耐磨耗性のある材料で形成し、さらに該保護膜の
上に耐熱性樹脂を塗布したことを特徴とするサーマルヘ
ッドを提供することによって達成される。According to the present invention, a heating resistor portion having a large number of heating resistors and a multilayer circuit portion of a circuit for applying electrical pulses to the heating resistors are formed on the same insulating substrate. In the thermal head provided above, the insulating protective film of the uppermost conductor of the multilayer circuit section is formed of the same abrasion-resistant material as the protective film of the heating resistor section, and This is achieved by providing a thermal head characterized by coating a heat-resistant resin on the thermal head.
発明の実施例 以下、本発明実施例を図面によって詳述する。Examples of the invention Embodiments of the present invention will be described in detail below with reference to the drawings.
第２図は本発明によるサーマルヘッドを説明するだめの
図であり、１０はグＶ−ズドアルミナ基板、Ａは発熱抵
抗体部、Ｂは多層回路部、１１は発熱抵抗体、１２は１
層目の導体、１３はポリイミド樹脂を用いた層間絶縁層
、１４は最上層の導体、１５は保護膜、１６は耐熱性樹
脂、１７はプラテンをそれぞれ示している。FIG. 2 is a diagram for explaining the thermal head according to the present invention, in which 10 is a grated alumina substrate, A is a heating resistor section, B is a multilayer circuit section, 11 is a heating resistor, and 12 is a 1
13 is an interlayer insulating layer using polyimide resin, 14 is an uppermost conductor, 15 is a protective film, 16 is a heat-resistant resin, and 17 is a platen.
本実施例は第２図に示す如くダレーズドアルミナ基板１
０の上に印字を行なうための多数の発熱抵抗体１１よシ
なる発熱抵抗体部Ａと、該発熱抵抗体を選択して電気的
パルスを印加するための駆動回路の多層回路部Ｂが形成
されており、該発熱抵抗体部Ａと多層回路部Ｂの上に発
熱抵抗体１１の耐磨耗を兼ねた保護膜１５を形成し、（
この場合の保護膜１５の密着は最上層導体１４がＣｒ−
Ｃｕ−Ｃｒの構成なので問題はなく、またＣｕを３〜４
戸と厚く蒸着あるいはスパッタにて形成するため電気抵
抗値も従来のめつき法によるものと差はない。）さらに
その上に耐熱性樹脂１６を塗布したものである。なおこ
の耐熱性樹脂１６の塗布は第３図の如く、保護膜の形成
まで行なった基板２０を低真空のチャンバー２１に入れ
たまま耐熱性樹脂１６（例えばポリイミド樹脂）の中に
浸漬し、その状態でチャンバを常圧に戻したのち引上げ
るのである。In this embodiment, as shown in FIG.
A heating resistor part A including a large number of heating resistors 11 for printing on the 0, and a multilayer circuit part B of a drive circuit for selecting the heating resistors and applying electric pulses are formed. A protective film 15 is formed on the heat generating resistor part A and the multilayer circuit part B, which also serves as wear resistance for the heat generating resistor 11.
In this case, the adhesion of the protective film 15 is such that the uppermost layer conductor 14 is made of Cr-
Since it is a Cu-Cr composition, there is no problem, and if Cu is 3 to 4
Since it is formed thickly by vapor deposition or sputtering, there is no difference in electrical resistance from conventional plating methods. ) A heat-resistant resin 16 is further applied thereon. The heat-resistant resin 16 is applied by immersing the substrate 20, on which the protective film has been formed, in the heat-resistant resin 16 (for example, polyimide resin) while keeping it in a low-vacuum chamber 21, as shown in FIG. After returning the chamber to normal pressure, it is lifted out.
このように形成された本実施例は、耐熱性樹脂１６が保
護膜１５の中にあるピンホールの中にも浸透するため、
保護膜の耐水性が向上する。また耐熱性樹脂１６の下の
保護膜１５は耐磨耗性がある友め、図の如く発熱抵抗体
部Ａと多層回路部Ｂとを近ずけて多層回路部Ｂがプラテ
ン１７と多少接触しても導体１４が露出することはなく
、従って小型化することができる。なお発熱抵抗体部Ａ
上の耐熱性樹脂は使用中にプラテン１７によって削り取
られるが本来耐熱性樹脂は８袈としない部分であるので
差支えない。In this embodiment formed in this way, the heat-resistant resin 16 penetrates into the pinholes in the protective film 15, so
The water resistance of the protective film is improved. In addition, the protective film 15 under the heat-resistant resin 16 is abrasion-resistant, so as shown in the figure, the heating resistor part A and the multilayer circuit part B are brought close together so that the multilayer circuit part B comes into some contact with the platen 17. Even if the conductor 14 is exposed, the conductor 14 is not exposed, so the size can be reduced. Note that the heating resistor part A
The upper heat-resistant resin is scraped off by the platen 17 during use, but this is not a problem since the heat-resistant resin is originally not included in the portion.
第４図は他の実施例を説明するための図であり、第２図
の前実施例と同一部分は同一符号を付して示した。本実
施例が前実施例と異なるところは図の如く先に共通部分
を形成し層間絶縁層１３としてガラスを用い強度を高め
て、その上にファインパターン形成したものである。FIG. 4 is a diagram for explaining another embodiment, and the same parts as in the previous embodiment shown in FIG. 2 are denoted by the same reference numerals. This embodiment differs from the previous embodiment in that, as shown in the figure, a common portion is first formed, glass is used as the interlayer insulating layer 13 to increase the strength, and a fine pattern is formed thereon.
このように形成された本実施例は、前実施例と同様の効
果を有する上、さらにガラス絶縁体上にＩＣやダイオー
ドを搭載できるため、それらの交換が容易となるといっ
た利点がある。This embodiment formed in this manner not only has the same effects as the previous embodiment, but also has the advantage that ICs and diodes can be mounted on the glass insulator, making it easy to replace them.
発明の効果
以上、詳細に説明したように本発明によるサーマルヘッ
ドは、多層回路部の最上層の絶縁保護膜に発熱抵抗体部
の保護膜と同一の耐磨耗性のある材料を用い、さらにそ
の上に耐熱性塗料を塗布して耐水性を付与することによ
り、プラテンあるいは用紙との接触による磨耗と水蒸気
による導体の腐食を防止可能とし、それにより信頼性の
向上と小型化が実現されるといった効果大なるものであ
る。Effects of the Invention As explained in detail above, the thermal head according to the present invention uses the same abrasion-resistant material as the protective film of the heating resistor part for the uppermost insulating protective film of the multilayer circuit part, and further By applying heat-resistant paint on top of it to make it water resistant, it is possible to prevent abrasion caused by contact with the platen or paper and corrosion of the conductor due to water vapor, thereby achieving improved reliability and miniaturization. This is a great effect.
第１図は従来のミニプリンタのサーマルヘッドを説明す
るための図、第２図は本発明によるサーマルヘッドを説
明するための図、第３図は耐熱性樹脂の塗布方法を説明
するための図、第４図は本発明によるサーマルヘッドの
他の実施例を説明するための図である。
図面において、Ａ・・・発熱抵抗体部、Ｂ・・・多層回
路部、１０・・・グレーズドアルミナ基板、１１・・・
発熱抵抗体、１２・・・１層目導体、１３・・・層間絶
縁層、１４・・・最上層の導体、１５・・・保護膜、１
６・・・耐熱性樹脂、１７・・・プラテンをそれぞれ示
す。
特許出願人
富士通株式会社
特許出願代理人
弁理士 青 木 朗
弁理士 西舘和之
弁理士 内田幸男
弁理士 山 口 昭 之
（力
第１図
Ａ Ｂ
第２図
八ＢFig. 1 is a diagram for explaining the thermal head of a conventional mini printer, Fig. 2 is a diagram for explaining the thermal head according to the present invention, and Fig. 3 is a diagram for explaining the method of applying heat-resistant resin. , FIG. 4 is a diagram for explaining another embodiment of the thermal head according to the present invention. In the drawings, A... heating resistor section, B... multilayer circuit section, 10... glazed alumina substrate, 11...
Heat generating resistor, 12... First layer conductor, 13... Interlayer insulating layer, 14... Top layer conductor, 15... Protective film, 1
6... Heat-resistant resin, 17... Platen, respectively. Patent applicant Fujitsu Ltd. Patent agent Akira Aoki Patent attorney Kazuyuki Nishidate Patent attorney Yukio Uchida Patent attorney Akira Yamaguchi (Figure 1A B Figure 2 8B)
Claims (1)
抵抗体に電気的パルスを印加するための多層回路部とが
同一絶縁性基板上に設けられたサーマルヘッドにおいて
、前記多層回路部の最上層の導体の絶縁保護膜を発熱抵
抗体部の保護膜と同一の耐磨耗性のある材料で形成し、
さらに該保護膜の上に耐熱性樹脂を塗布したことｆｔ％
徴とするサーマルヘッド０1. In a thermal head in which a heating resistor section having a large number of heating resistors and a multilayer circuit section for applying electrical pulses to the heating resistors are provided on the same insulating substrate, the multilayer circuit section The insulating protective film of the top layer of the conductor is made of the same abrasion-resistant material as the protective film of the heating resistor part,
Furthermore, a heat-resistant resin is applied on top of the protective film (ft%).
Signal thermal head 0
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58220556A JPS60112462A (en) | 1983-11-25 | 1983-11-25 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58220556A JPS60112462A (en) | 1983-11-25 | 1983-11-25 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60112462A true JPS60112462A (en) | 1985-06-18 |
Family
ID=16752842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58220556A Pending JPS60112462A (en) | 1983-11-25 | 1983-11-25 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60112462A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7990405B2 (en) | 2008-08-29 | 2011-08-02 | Canon Kabushiki Kaisha | Thermal head and thermal printer |
| JP2012061778A (en) * | 2010-09-17 | 2012-03-29 | Toshiba Hokuto Electronics Corp | Thermal print head and thermal printer |
-
1983
- 1983-11-25 JP JP58220556A patent/JPS60112462A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7990405B2 (en) | 2008-08-29 | 2011-08-02 | Canon Kabushiki Kaisha | Thermal head and thermal printer |
| JP2012061778A (en) * | 2010-09-17 | 2012-03-29 | Toshiba Hokuto Electronics Corp | Thermal print head and thermal printer |
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