JPS6250167A - Thermal head - Google Patents

Abstract

PURPOSE:To avoid corrosion and to make printing normal, by covering the part which is not covered with an oxidation preventing layer, of the pattern comprising an electric good conductor other than gold formed on a heat generating substrate with a material consisting of a metal and SiO2. CONSTITUTION:A conductor lead 2 composed of an electric good conductor other than Au such as Al, Cu, Ag, Ni or Sn is formed on a heat-generating substrate 1 and a heat-generating resistor 3 is provided thereon. Further, a resistor-protecting layer 4 and an oxidation-preventing layer 5 are successively formed and the exposed part of the conductor lead 2 is covered with a material layer 6 consisting of a metal having high corrosion resistance and SiO2 to form a thermal head. Because the material layer 6 consisting of the metal and SiO2 of this thermal head is not corroded under a practical use environment by the synergistic action of a current and humidity, the conductor lead 2 is not also corroded and normal printing can be kept.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a thermal head and relates to the prevention of oxidation of a conductor pattern formed of a metal having 1% oxidation resistance.

[Conventional technology]

FIG. 2 is a cross-sectional side view for explaining a conventional thermal head. In FIG. 1, (1) is a heat generating board.

+21 is a conductor lead formed on the heat generating board, (3) is a heat generating resistor formed between the heat generating board (1) and the conductor lead (2) layer, and configured between the conductor leads (2), and (4) is a heat generating resistor formed between the conductor leads (2). The resistor protective layer [5] is for protecting the heating resistor (3) from wear and oxidation, and is an anti-oxidation layer for preventing the conductor lead (2) from being oxidized.

In the conventional thermal head configured as described above, power, signals, etc. are supplied from an external circuit (not shown) to the conductor leads (2) that are not covered with the anti-oxidation layer (5), and between the conductor leads (2). The heating resistor (3) configured to generate heat and print on thermal paper or transfer paper (not shown) held between a platen (not shown) [Problems to be Solved by the Invention] ] The conventional thermal head has two conductor leads as described above.
) are made of good electrical conductors other than gold, such as aluminum, copper, silver, nickel, and tin, so they corrode due to the synergistic effect of current and humidity in the actual environment, and were initially good electrical conductors. The problem was that the material gradually became a poor conductor and could no longer be printed by the thermal head. Corrosion can be prevented by covering that part by extending the anti-oxidation layer (5), but in that case, since the anti-oxidation layer (5) is an insulator, it will not be possible to connect the conductor lead to the external circuit.
This is one inconvenience.

In view of the above points, it is an object of the present invention to provide a thermal head that can always maintain good conductivity and perform printing without causing the conductor leads to become poor conductors due to humidity.

[Means for solving problems]

The thermal head of the present invention is made of aluminum and copper.

The exposed portion of a conductor lead made of silver, nickel, tin, etc. is covered with a material made of metal and SiO2.

[For production]

The exposed portion of the conductor lead in the present invention is made of metal and S10.
．． Since it is covered with a material made of a heat generating resistor, it can prevent corrosion due to humidity, and the power window and signals can always be supplied from an external circuit, allowing normal 1J printing with the heating resistor.

[Embodiments of the invention]

Hereinafter, the present invention will be explained with reference to the embodiment of FIG. 1, in which parts corresponding to the conventional ones are given the same reference numerals. In FIG. and 5le2, and the configuration other than the above is the same as the conventional one, so a description thereof will be omitted.

In the thermal head of the present invention configured as described above, the conductor lead (2) connects the surface of a good electrical conductor other than gold such as aluminum, copper, silver, nickel, or tin with a highly corrosion-resistant metal or S to! Since it is covered with a material layer (6) consisting of metal and S tO, the material layer (6) consisting of metal and S tO will not be corroded due to the synergistic effect of current and humidity in the actual environmental conditions. Since the conductor lead (2) may also be corroded, it will not cause a serious defect that would prevent normal printing.

2. In the above embodiment, the conductor lead (21'J3) and the material layer (6) consisting of metal g and SiO are connected to the heat generating substrate (1).
) is shown only on the surface of the heat generating substrate (1
) may be formed on the side surface 2 and the back surface.

Rough heat generating board (1) Provide one hole, and the side of the hole ≦
It may also be formed in this way. As a method for forming a material layer made of metal and 5102, printing methods, vapor deposition methods, sputtering methods, ion blating methods, etc. can be used. [Effects of the Invention] As described above, according to the present invention, metal and 810° A material layer consisting of is provided on the surface of the conductor lead.

Due to the synergistic effect of current and humidity in the actual environment, the conductor leads are covered with a highly corrosion-resistant material layer made of gold There is an effect that can be done0

[Brief explanation of drawings]

FIG. 1 is a sectional side view showing a thermal head according to an embodiment of the present invention, and FIG. 2 is a sectional side view showing a conventional thermal head. In the figure, (1) is a heat generating board, (2) is a conductor leat,
(3) is a heating resistor, and (4) is a resistor! ! layer, (5)
(6) is a material layer consisting of metal 2 and SiO. The same reference numerals in Figure S1 indicate the same or equivalent parts.

Claims (5)

[Claims] (1) A heat generating substrate and a pattern made of a good electrical conductor other than gold formed on the heat generating substrate, and the portion of the conductive pattern not covered with the anti-oxidation layer is covered with a material made of metal and SiO_2. Thermal head is characterized by a shank. (2) The thermal head according to claim 1, wherein the material made of metal and SiO_2 is formed by a printing method. (3) The thermal head according to claim 1, wherein the material made of metal and SiO_2 is formed by a vapor deposition method. (4) The thermal head according to claim 1, wherein the material made of metal and SiO_2 is formed by a sputtering method. (5) The thermal head according to claim 1, wherein the material made of metal and SiO_2 is formed by an ion plating method.