JPS61200246U - - Google Patents

Info

Publication number
JPS61200246U
JPS61200246U JP8484185U JP8484185U JPS61200246U JP S61200246 U JPS61200246 U JP S61200246U JP 8484185 U JP8484185 U JP 8484185U JP 8484185 U JP8484185 U JP 8484185U JP S61200246 U JPS61200246 U JP S61200246U
Authority
JP
Japan
Prior art keywords
drive circuit
recording device
heat generating
generating element
element array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8484185U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8484185U priority Critical patent/JPS61200246U/ja
Publication of JPS61200246U publication Critical patent/JPS61200246U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Electronic Switches (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す断面図、第２
図、第３図はそれぞれ本考案の他の実施例を示す
断面図、第４図はダイレクトドライブ型サーマル
ヘツドの回路図、第５図は従来例を示す断面図で
ある。 １……発熱素子列、３……リード、４……駆動
回路、１３……基板。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 発熱素子列のリード端と前記発熱素子列を
    駆動する駆動回路とをワイヤボンデイングにより
    接続してなるサーマルヘツドを有する感熱記録装
    置において、前記駆動回路のボンデイング面を前
    記発熱素子列のリード端のボンデイング面とほぼ
    同じ高さ、またはこれより低い位置としたことを
    特徴とする感熱記録装置。 (2) 前記駆動回路が前記発熱素子列の搭載され
    た基板に形成された凹部に搭載されている実用新
    案登録請求の範囲第１項記載の感熱記録装置。 (3) 前記駆動回路と前記発熱素子列とが別個の
    基板に搭載され、かつこれらの基板が他の基板に
    駆動回路のボンデイング面が発熱素子列のリード
    端のボンデイング面と同じ高さ、またはこれより
    低い位置となるよう段差を設けて搭載されている
    実用新案登録請求の範囲第１項記載の感熱記録装
    置。
JP8484185U 1985-06-05 1985-06-05 Pending JPS61200246U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8484185U JPS61200246U (ja) 1985-06-05 1985-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8484185U JPS61200246U (ja) 1985-06-05 1985-06-05

Publications (1)

Publication Number Publication Date
JPS61200246U true JPS61200246U (ja) 1986-12-15

Family

ID=30634690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8484185U Pending JPS61200246U (ja) 1985-06-05 1985-06-05

Country Status (1)

Country Link
JP (1) JPS61200246U (ja)

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