JPS61198797A - Connection of fabric flexible substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of connecting a cloth flexible substrate having a novel conductive path and a rigid substrate.

[Summary of the invention]

The present invention provides a method for connecting a rigid substrate to a cloth flexible substrate having a conductive path in a portion thereof, in which the conductive path of the cloth flexible substrate is aligned with the through hole position of the rigid substrate having through holes. After bonding with an adhesive, the through-hole portion is connected and fixed by sewing conductive thread, soldering, etc., so that the connection can be easily made.

[Conventional technology]

As a wiring board, the present applicant has previously proposed a circuit board in which a conductive pattern made of conductive fibers is formed on a predetermined part of a cloth flexible board made of cloth (Japanese Patent Application No. 1983-16).
No. 9,863, etc.). For example, as shown in FIG. 4, this cloth flexible substrate has warp threads (7
) and weft threads (8) to form a substrate (2), and predetermined areas are etched to remove the conductive metal to form insulating parts (
2b) is formed, and as shown in the fifth factor, a wiring pattern is formed using the remaining conductive portion (2a). This cloth flexible substrate (2) has the advantage of having flexibility against bending compared to a flexible substrate made of synthetic resin or the like.

In order to establish electrical continuity between such a cloth flexible board and a rigid wiring board, for example, through-hole plating may be used to provide electrical continuity.

This through-hole plating is used, for example, in Japanese Patent Publication No. 57-11.
As shown in Japanese Patent No. 160, through holes are formed in both substrates a and d in order to establish conduction between conductive patterns b and c on both sides of the first substrate a and conductive pattern e on one side of the second substrate d. After opening f and aligning the positions of both through-holes f, bonding both boards a and d with adhesive, through-hole plating g is performed to ensure mutual conduction between conductive patterns b, c, and e. It is something to measure.

[Problems to be Solved by the Invention] However, the above-mentioned cloth flexible substrate is difficult to connect by through-hole plating because it is not easy to plate the cloth flexible substrate. For this reason, the connection is made using a connecting member such as a connector or a connecting bottle, but the use of the connecting member complicates the structure, increases weight and cost, and has five problems. In addition, since the connectors and connection bins become quite large in number, they take up a lot of space and are unsuitable for connecting a large number of conductive patterns. Furthermore, when it is necessary to pass through the through-holes of both boards with a connecting member, such as when connecting with a connecting bottle, it is necessary to align the positions of the through-holes of both boards with high precision. The problem was that the work was time-consuming.

In view of the above-mentioned points, the present invention provides a connection method that allows easy connection between a cloth flexible board and a rigid board.

[Means for solving problems]

The cloth flexible board connection method of the present invention has through holes (6) and patterns (la), (lb
) is formed on the rigid board (1), and the through hole (
6) Prepare a cloth flexible board (2) having a conductive path (2a) as wide as the width of the back body, and place the cloth flexible board (2) at the position of the through hole (6) of the rigid board (1).
Align the position of the conductive path (2a) and attach them via adhesive (3), and then use the conductive thread (4) to pass through the through hole (6) from above the cloth flexible substrate (2) to the end. sew in such a way that it protrudes below the through hole (6), and then apply conductive adhesive or solder (5) to at least this end to the conductive pattern (1a) provided on the other side of the rigid board (1). The connection is fixed by using the

[Effect]

The present invention involves sewing in conductive thread (4) and soldering (5).
Alternatively, the rigid substrate (1) and the cloth flexible substrate (2) can be easily connected and fixed by fixing with a conductive adhesive.

〔Example〕

Hereinafter, an embodiment of the method for connecting cloth flexible substrates according to the present invention will be described with reference to FIGS. 1 and 2.

In this example, conductive patterns (la) l (lb
) on which the rigid substrate (1) is formed, and the rigid substrate (1) on which the
A conductive pattern (1a) is connected and fixed to a fabric flexible substrate (2) on which a conductive path (2a) shown in the figure is formed.

(1b) and the conductive path (2a).

First, conductive patterns (1a) on both sides of the rigid board (1)
) and (1b) overlap in the predetermined part with through hole (6), through hole plating (lc)
is applied to bring both conductive patterns (1a) and (1b) into electrical continuity. Note that, as shown in FIG. 2, the resist (ld) used as a protective coating when forming a conductive pattern does not need to be removed.

Next, a fabric flexible board (2a) is attached to one side of the rigid board (1) facing the through hole (6) via an adhesive layer (3) so that the conductive path (2a) is located above the through hole (6). 2) Glue. And cloth flexible substrate (2
) A conductive thread (4) is sewn in using a sewing machine or the like from directly above the through hole on the opposite side of the rigid board (1) from the adhesive side. This sewing is carried out on the conductive wire (turn) on the opposite side of the rigid board (1) to the adhesive surface of the fabric flexible board (2).
It is sewn so that it hangs down slightly from the end of the through hole (6) on the side 1a). In addition, conductive thread (4
) may be constructed by applying metal plating around a thread made of normal non-conductive fibers, or may be constructed from a thread whose fiber itself is conductive, such as carbon fiber fiber. .

Next, the end of the through hole (6) on the conductive pattern (la) side is soldered with solder (5). At this time,
The solder (5) is connected to the hanging conductive thread (4) and the conductive pattern (L
a) It solidifies in the state where it is connected.

With this connection, the conductive path (2a) of the cloth flexible board (2) is electrically connected to the conductive pattern (1a) of the rigid board (1) via the conductive thread (4) and the solder (5), and the conductive pattern (la) is connected to the through-hole plating (lc) and also to the conductive pattern (1b), so the conductive path (
2a) and the conductive pattern (1b) are also electrically connected.

By connecting as above, the rigid board (
Since electrical conduction between the 11 side and the cloth flexible board (2) side is achieved only by sewing the conductive thread (4) and soldering the solder (5), some kind of connection member such as a connector or connection pin is used. The weight and cost are reduced accordingly. Further, since only the through holes take up space, multiple connections between substrates on which a large number of conductive patterns and conductive paths are formed can be made in a small area. Furthermore, since the through holes are provided only on the rigid board, all that is needed to align both boards is to align the conductive path (2a) over the through hole (6). High-precision positioning between the two is no longer necessary, and work efficiency is improved accordingly. Moreover, since both the sewing work and the soldering work can be easily performed by a machine, the connection work can be easily mechanized, that is, automated, and in this case, the workability is significantly improved and the work time is significantly shortened. Note that the sewing machine can be obtained by making slight modifications to a general industrial sewing machine.

In the above embodiment, the rigid substrate (1) was assumed to have conductive patterns (la), Qb) formed on both sides, but the rigid substrate (1) without the conductive pattern (1b) on one side was
1) and the fabric flexible board (2) can be connected in the same manner as in the above embodiment, and in this case, through-hole plating (I
C) becomes unnecessary. On the contrary, it is possible if two or more layers of conductivity (even if the turns are formed on a rigid substrate, each conduction is performed by through-hole plating, etc.) (turn 1sll17) are made conductive. Further, although solder was used in the above embodiment, a conductive adhesive may be used instead. Furthermore, it goes without saying that the present invention is not limited to the above-mentioned embodiments, and can take various other configurations without departing from the gist of the present invention.

〔Effect of the invention〕

As is clear from the above embodiments (according to the method for connecting cloth flexible substrates of the present invention), connection and fixation are performed by sewing with conductive thread and fixing with solder or Lt conductive adhesive, so that rigidity can be easily achieved. The connection and fixation between the board and the cloth flexible board is performed.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a connection part according to the method of connecting cloth flexible boards of the present invention, FIG. 4 and 5 are diagrams for explaining the cloth flexible substrate. (1) is a rigid wiring board, (la), (lb) are conductive (turn), (2) is a cloth flexible board, (2a)
) is a conductive path, (3) is an adhesive layer, (4) is a conductive thread, (
5) is solder, and (6) is a through hole. ↑Concubine Tong Guo's T4 Peak" Concave Figure 1 The first page of Sai Concubine Section Figure 2 The first page of Lamai's edition I The first page of Death and Evil Figure 3 Cloth 7LN Schiff 1 black plate plan view Figure 5

Claims (1)

[Scope of Claims] A rigid substrate having a through hole and a pattern formed thereon, and a cloth flexible substrate having a conductive path having a width equal to or larger than the diameter of the through hole are prepared. Align the conductive path portions of the cloth flexible substrates and attach them with adhesive, and use conductive threads to pass from above the cloth flexible substrate through the through holes so that the end portions protrude below the through holes. A method for connecting a cloth flexible substrate, characterized in that the fabric flexible substrate is sewn into the fabric flexible substrate, and furthermore, at least the end portion is connected and fixed to a conductive pattern provided on the other surface of the rigid substrate using a conductive adhesive or solder.