JPH0343724Y2 - - Google Patents
Info
- Publication number
- JPH0343724Y2 JPH0343724Y2 JP1983084639U JP8463983U JPH0343724Y2 JP H0343724 Y2 JPH0343724 Y2 JP H0343724Y2 JP 1983084639 U JP1983084639 U JP 1983084639U JP 8463983 U JP8463983 U JP 8463983U JP H0343724 Y2 JPH0343724 Y2 JP H0343724Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- tongue piece
- printed wiring
- wiring board
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 60
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 210000005182 tip of the tongue Anatomy 0.000 claims description 2
- 238000000034 method Methods 0.000 description 6
- 239000013039 cover film Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Description
【考案の詳細な説明】
本考案は、フレキシブルプリント配線板に関す
るものである。[Detailed Description of the Invention] The present invention relates to a flexible printed wiring board.
近来、フレキシブルプリント配線板は、その用
途の多様性および電子機器実装の高密度化によ
り、パターンの密度も高くなる傾向にある。これ
に応える従来技術として、両面回路パターンを形
成したフレキシブルプリント配線板にスルーホー
ル構造を設け、これにより表面回路パターンと裏
面回路パターンとの導通をとる方法がある。しか
し、この方法はスルーホール構造による導通をと
るために製品のコスト高を招く。また、導体ライ
ン間を銅のジヤンパ線によつて接続し、導通をと
る方法もある。しかし、この方法は、フレキシブ
ルプリント配線板とジヤンパ線の材質が異なるな
どの理由によつて、実装時に導体ラインのランド
とジヤンパ線との接合部に応力が集中するおそれ
があり、それによつて、接合部が剥れたり、導体
パターンやフレキシブルプリント配線板が損傷す
ることがある。また、フレキシブルプリント配線
板の実質的な厚さが増すので、実装不可能な場合
がおこり、フレキシブルプリント配線板の適用範
囲を狭めるという問題があつた。 In recent years, flexible printed wiring boards have tended to have higher pattern densities due to the diversity of their uses and the higher density of electronic equipment packaging. As a conventional technique in response to this problem, there is a method in which a through-hole structure is provided in a flexible printed wiring board on which a double-sided circuit pattern is formed, thereby establishing conduction between the front side circuit pattern and the back side circuit pattern. However, this method increases the cost of the product because conduction is achieved through a through-hole structure. Another method is to connect the conductor lines with a copper jumper wire to establish continuity. However, with this method, stress may be concentrated at the joint between the land of the conductor line and the jumper wire during mounting due to the difference in the materials of the flexible printed wiring board and the jumper wire. Joints may peel off, and conductor patterns and flexible printed wiring boards may be damaged. Furthermore, since the substantial thickness of the flexible printed wiring board increases, there are cases where it is impossible to mount the flexible printed wiring board, resulting in a problem that the range of application of the flexible printed wiring board is narrowed.
本考案はこのような実状に鑑みてなされたもの
であつて、その目的は、上述の如き欠点を解消し
得るフレキシブルプリント配線板を提供すること
にある。 The present invention has been made in view of the above circumstances, and its purpose is to provide a flexible printed wiring board that can eliminate the above-mentioned drawbacks.
上記従来技術の有する課題を解決するために、
本考案においては、互いに接続されるべき複数の
導体ラインが表面に形成されたフレキシブルプリ
ント配線板において、前記導体ラインに近接して
透孔およびスリツトにより区切られた舌片を併設
する一方、該舌片に、前記導体ラインと別個に形
成したジヤンパ線用の導体部を少なくとも１個配
設すると共に粘着剤を塗布し、前記導体部が設け
られていない舌片の基端部を折曲して前記プリン
ト配線板の裏面側から前記舌片の先端部を前記透
孔に挿通することにより前記導体ラインの接合部
と前記導体部の接合部とを対向配置すると共に、
前記舌片を粘着剤にて表面側に仮着し、この状態
で前記導体ラインと前記舌片の導体部とを半田に
より加熱接着し、これによつて前記複数の導体ラ
インを接続するように構成している。 In order to solve the problems of the above conventional technology,
In the present invention, in a flexible printed wiring board in which a plurality of conductor lines to be connected to each other are formed on the surface, tongue pieces separated by through holes and slits are provided adjacent to the conductor lines, and the tongue pieces are provided adjacent to the conductor lines. At least one conductor portion for a jumper wire formed separately from the conductor line is provided on the piece, and an adhesive is applied thereto, and the proximal end of the tongue piece where the conductor portion is not provided is bent. By inserting the tip of the tongue piece into the through hole from the back side of the printed wiring board, the joint part of the conductor line and the joint part of the conductor part are arranged to face each other,
The tongue piece is temporarily attached to the surface side with adhesive, and in this state, the conductor line and the conductor part of the tongue piece are heat-bonded with solder, thereby connecting the plurality of conductor lines. It consists of
以下、本考案を図示の実施例に基づいて詳細に
説明する。 Hereinafter, the present invention will be explained in detail based on illustrated embodiments.
第１図および第２図は本考案の一実施例を示し
たものである。図において、１はフレキシブルプ
リント配線板、２は舌片である。フレキシブルプ
リント配線板１は、ベースフイルム３と、ベース
フイルム３上に形成した導体パターン４と、導体
パターン４の表面を絶縁保護するために被覆した
カバーフイルム５とからなる。プリント配線板１
には、スリツト６が設けられ、スリツト６により
区切られて、上記舌片２が形成されている。ま
た、プリント配線板１には、舌片２を挿通させる
ための透孔７が穿設されている。導体パターン４
を構成する導体ライン８，８′の端子部には、ラ
ンド９，９′が設けられている。舌片２には、導
体ライン８間を接続するためのジヤンパ線用の導
体部１０が配設され、導体部１０の両端には、ラ
ンド１１，１１′が設けられている。導体部１０
は導体ライン８，８′と別個に形成され、その長
さは接続する導体ライン８，８′間の長さと同じ
寸法に形成されている。また、舌片２の導体部１
０のランド１１，１１′間におけるカバーフイル
ム５の表面に粘着剤１２が貼着されている。舌片
２は、接続する導体ライン８′に近接して併設さ
れている。カバーフイルム５には、導体ライン
８，８′のランド９，９′および導体部１０のラン
ド１１，１１′と対応する位置にカバーフイルム
孔１３が穿設されている。 1 and 2 show an embodiment of the present invention. In the figure, 1 is a flexible printed wiring board, and 2 is a tongue piece. The flexible printed wiring board 1 includes a base film 3, a conductor pattern 4 formed on the base film 3, and a cover film 5 covering the surface of the conductor pattern 4 for insulation protection. Printed wiring board 1
A slit 6 is provided in the slit 6, and the tongue piece 2 is formed by being separated by the slit 6. Further, the printed wiring board 1 is provided with a through hole 7 through which the tongue piece 2 is inserted. Conductor pattern 4
Lands 9, 9' are provided at the terminal portions of the conductor lines 8, 8' that constitute the conductor lines 8, 8'. A conductor portion 10 for a jumper wire for connecting the conductor lines 8 is disposed on the tongue piece 2, and lands 11, 11' are provided at both ends of the conductor portion 10. Conductor part 10
are formed separately from the conductor lines 8, 8', and have the same length as the length between the conductor lines 8, 8' to which they are connected. In addition, the conductor portion 1 of the tongue piece 2
An adhesive 12 is adhered to the surface of the cover film 5 between the lands 11 and 11'. The tongue piece 2 is placed adjacent to the conductor line 8' to be connected. Cover film holes 13 are bored in the cover film 5 at positions corresponding to the lands 9, 9' of the conductor lines 8, 8' and the lands 11, 11' of the conductor portion 10.
導体ライン８，８′間を導通させるため、導体
ライン８，８′とジヤンパ線用の導体部１０とを
接続する方法を以下に説明する。 A method for connecting the conductor lines 8, 8' and the jumper wire conductor section 10 in order to establish continuity between the conductor lines 8, 8' will be described below.
まず、導体ライン８，８′の接合部分であるラ
ンド９，９′に半田処理等を施す。次に、第１図
で仮想線で示すように、導体部１０が設けられて
いない舌片２の基端部を折曲してベースフイルム
３の裏面側から舌片２の先端部を透孔７に挿通す
ることにより、導体ライン８，８′のランド９，
９′と導体部１０のランド１１，１１′とを対向さ
せる。この状態で、ランド９と１１および９′と
１１′の位置を合せ、粘着剤１２によつて、フレ
キシブルプリント配線板１に舌片２を仮着する。
そののち、舌片２の裏側から半田ゴテ等によつて
リフローするか、あるいは、赤外線等を使用して
マスターミネーシヨンによつて加熱接着して、導
体ライン８，８′と導体部１０とを接合する。舌
片２を半田実装する際、舌片２は、粘着剤１２お
よび透孔７によつて保持されるので、移動するこ
とがない。なお、舌片２は接続されるべき導体ラ
インの数に応じて複数個設けることも可能であ
り、また１個の舌片２には複数の導体部１０を設
けることもできる。 First, the lands 9 and 9', which are the joint portions of the conductor lines 8 and 8', are subjected to a soldering process or the like. Next, as shown by the imaginary line in FIG. 7, the lands 9 and 7 of the conductor lines 8 and 8'
9' and lands 11, 11' of the conductor portion 10 are made to face each other. In this state, the lands 9 and 11 and the lands 9' and 11' are aligned, and the tongue piece 2 is temporarily attached to the flexible printed wiring board 1 using the adhesive 12.
After that, the conductor lines 8, 8' and the conductor portion 10 are connected by reflowing from the back side of the tongue piece 2 with a soldering iron or the like, or by heat bonding by master-mation using infrared rays or the like. Join. When the tongue piece 2 is soldered and mounted, the tongue piece 2 is held by the adhesive 12 and the through hole 7, so that it does not move. Note that a plurality of tongue pieces 2 can be provided depending on the number of conductor lines to be connected, and one tongue piece 2 can also be provided with a plurality of conductor parts 10.
本考案に係るフレキシブルプリント配線板に
は、ジヤンパ線用の導体部を配設した舌片が、導
体ライン間を接続可能に併設されているので、フ
レキシブルプリント配線板を製造すると同時にジ
ヤンパ線用部材を作ることができる。また、ジヤ
ンパ線がフレキシブルプリント配線板と別体であ
る場合におこるその粉末がなく、作業者が誤つて
他の導体ライン間を接続するおそれもない。それ
に加えて、本考案のフレキシブルプリント配線板
は、ジヤンパ線用の導体部を配設した舌片が透孔
および粘着剤によつて位置決めされかつ保持され
るから、接合するための各種部材を用いたり穴明
け加工する必要がなく容易かつ確実に導体部を導
体ラインに接合することができ、作業能率の向上
が図れる。また本考案のフレキシブルプリント配
線板では、舌片に複数個の導体部を設けることが
可能である一方、加熱接着による舌片の導体部と
導体ラインとの接合には厚さ方向の取付スペース
や作業スペースが不要であるので、電子機器など
の実装密度を格段に高めることができる。しか
も、舌片における屈曲部には、補強板などを設け
て導体部の断線を防止する必要がないので、部品
コストを低減でき、経済的に極めて有利である。 The flexible printed wiring board according to the present invention is provided with a tongue piece on which conductor parts for jumper wires are arranged so that the conductor lines can be connected, so that the flexible printed wiring board can be manufactured simultaneously with jumper wire members. can be made. Further, there is no powder generated when the jumper wire is separate from the flexible printed wiring board, and there is no risk of the operator accidentally connecting other conductor lines. In addition, the flexible printed wiring board of the present invention uses various members for joining because the tongue piece on which the conductor part for the jumper wire is arranged is positioned and held by the through hole and the adhesive. The conductor portion can be easily and reliably joined to the conductor line without the need for drilling or drilling, and work efficiency can be improved. In addition, in the flexible printed wiring board of the present invention, while it is possible to provide a plurality of conductor parts on the tongue piece, it is possible to connect the conductor part of the tongue piece and the conductor line by heat bonding, which requires a mounting space in the thickness direction. Since no work space is required, the packaging density of electronic devices and the like can be significantly increased. Furthermore, since there is no need to provide a reinforcing plate or the like at the bent portion of the tongue to prevent the conductor from breaking, component costs can be reduced, which is extremely advantageous economically.
第１図は本考案の第１実施例に係るフレキシブ
ルプリント配線板の一部を示す平面図、第２図は
第１図におけるＡ−Ａ線矢視断面図である。
１……フレキシブルプリント配線板、２……舌
片、６……スリツト、８……導体ライン、１０…
…ジヤンパ線用の導体部。
FIG. 1 is a plan view showing a part of a flexible printed wiring board according to a first embodiment of the present invention, and FIG. 2 is a sectional view taken along the line A--A in FIG. 1... Flexible printed wiring board, 2... Tongue piece, 6... Slit, 8... Conductor line, 10...
...Conductor part for jumper wire.
Claims (1)
に形成されたフレキシブルプリント配線板におい
て、前記導体ラインに近接して透孔およびスリツ
トにより区切られた舌片を併設する一方、該舌片
に、前記導体ラインと別個に形成したジヤンパ線
用の導体部を少なくとも１個配設すると共に粘着
剤を塗布し、前記導体部が設けられていない舌片
の基端部を折曲して前記プリント配線板の裏面側
から前記舌片の先端部を前記透孔に挿通すること
により前記導体ラインの接合部と前記導体部の接
合部とを対向配置すると共に、前記舌片を粘着剤
にて表面側に仮着し、この状態で前記導体ライン
と前記舌片の導体部とを半田により加熱接着し、
これによつて前記複数の導体ラインを接続するよ
うに構成したことを特徴とするフレキシブルプリ
ント配線板。 In a flexible printed wiring board in which a plurality of conductor lines to be connected to each other are formed on the surface, a tongue piece separated by a through hole and a slit is provided adjacent to the conductor line, and the tongue piece is provided with a tongue piece separated by a through hole and a slit. At least one conductor portion for the jumper wire formed separately from the line is provided, an adhesive is applied, and the proximal end of the tongue piece where the conductor portion is not provided is bent to form the printed wiring board. By inserting the tip of the tongue piece into the through hole from the back side, the joint part of the conductor line and the joint part of the conductor part are arranged to face each other, and the tongue piece is temporarily attached to the front side with adhesive. and in this state heat bond the conductor line and the conductor portion of the tongue piece with solder,
A flexible printed wiring board characterized in that the plurality of conductor lines are connected by this.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8463983U JPS59189261U (en) | 1983-06-03 | 1983-06-03 | flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8463983U JPS59189261U (en) | 1983-06-03 | 1983-06-03 | flexible printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59189261U JPS59189261U (en) | 1984-12-15 |
| JPH0343724Y2 true JPH0343724Y2 (en) | 1991-09-12 |
Family
ID=30214599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8463983U Granted JPS59189261U (en) | 1983-06-03 | 1983-06-03 | flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59189261U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4831959B2 (en) * | 2004-04-09 | 2011-12-07 | 三洋電機株式会社 | Pickup and pickup for notebook personal computer |
| JP6131702B2 (en) * | 2013-05-08 | 2017-05-24 | 株式会社リコー | Flexible wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5759476B2 (en) * | 1976-02-18 | 1982-12-15 | Hitachi Ltd |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5930552Y2 (en) * | 1980-09-26 | 1984-08-31 | 矢崎総業株式会社 | printed wiring board |
-
1983
- 1983-06-03 JP JP8463983U patent/JPS59189261U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5759476B2 (en) * | 1976-02-18 | 1982-12-15 | Hitachi Ltd |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59189261U (en) | 1984-12-15 |
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