JPS61197577U - - Google Patents
Info
- Publication number
- JPS61197577U JPS61197577U JP8246385U JP8246385U JPS61197577U JP S61197577 U JPS61197577 U JP S61197577U JP 8246385 U JP8246385 U JP 8246385U JP 8246385 U JP8246385 U JP 8246385U JP S61197577 U JPS61197577 U JP S61197577U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- power supply
- inspection device
- conductive tube
- guide body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 claims 3
- 238000005259 measurement Methods 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Description
第１図は本考案の第１実施例を示す長手方向断
面図、第２図は第１図の―線断面図、第３図
は第１図の―線断面図、第４図は第１図の要
部拡大図、第５図は第４図の底面図、第６図は第
５図の―線断面図、第７図はワイヤガイド本
体、給電コネクタおよび給電プラグの接続状態を
示す詳細部分断面図、第８図は第７図の部拡大
図、第９図は第１図の平面図、第１０図は本考案
の第２実施例を示す要部断面図、第１１図は本考
案の第３実施例を示す第１図相当図、第１２図は
第１１図の―線断面図、第１３図は第１
１図の底面図、第１４図は第１３図の―
線断面図、第１５図は第１１図の平面図、第１６
図は第１１図の要部拡大図である。
１…取付ボード、２…孔、３…ワイヤビームユ
ニツト、４，３４…ワイヤガイド本体、５…ワイ
ヤビーム、８…ガイド孔、１６…給電コネクタ、
１７…給電プラグ、２３…導電性チユーブ、２４
…プランジヤ、２６…スプリング、２７…案内孔
、２８…接続ジヤツク、２８ａ…ツイストピン、
２９…給電ケーブル。
Fig. 1 is a longitudinal sectional view showing the first embodiment of the present invention, Fig. 2 is a sectional view taken along the line - - of Fig. 1, Fig. 3 is a sectional view taken along the line - - of Fig. 1, and Fig. 4 is a sectional view taken along the line - Figure 5 is a bottom view of Figure 4. Figure 6 is a cross-sectional view taken along the line - - in Figure 5. Figure 7 is a detail showing the connection state of the wire guide body, power supply connector, and power supply plug. 8 is an enlarged view of a portion of FIG. 7, FIG. 9 is a plan view of FIG. 1, FIG. 10 is a sectional view of a main part showing a second embodiment of the present invention, and FIG. FIG. 1 is a diagram corresponding to FIG. 1 showing the third embodiment of the invention, FIG. 12 is a sectional view taken along the line -- of FIG.
Figure 1 is the bottom view, Figure 14 is the bottom view of Figure 13.
Line sectional view, Fig. 15 is a plan view of Fig. 11, Fig. 16
The figure is an enlarged view of the main part of FIG. 11. DESCRIPTION OF SYMBOLS 1... Mounting board, 2... Hole, 3... Wire beam unit, 4, 34... Wire guide body, 5... Wire beam, 8... Guide hole, 16... Power supply connector,
17... Power supply plug, 23... Conductive tube, 24
...Plunger, 26...Spring, 27...Guide hole, 28...Connection jack, 28a...Twist pin,
29...Power supply cable.
Claims (1)
る取付ボードと、この取付ボードに着脱可能に貫
通固定され絶縁性を有するワイヤガイド本体と、
このワイヤガイド本体に装着される多数本のワイ
ヤビームとを備え、各ワイヤビームの先端を回路
基板の検査点に接触させて電気的な測定検査を行
なうとともに、各ワイヤビームのバツクリングに
より検査点との接触圧を得るようにした回路基板
等の検査装置であつて、前記ワイヤガイド本体の
基端部の背後に、給電コネクタを取付けるととも
に、この給電コネクタに、先端が前記ワイヤビー
ムに接続され基端が給電コネクタから基端側に突
出する導電性チユーブを各ワイヤビームに対応し
て設け、かつ前記給電コネクタの背部に着脱可能
に接続される給電プラグに、前記各導電性チユー
ブの突出部が挿入される案内孔を設け、この案内
孔の基端内部に、導電性チユーブ内に弾圧挿入さ
れるツイストピンを有し測定検査器から引出され
たリード線が結線される接続ジヤツクを組込んだ
ことを特徴とする回路基板等の検査装置。 a mounting board that moves relative to a circuit board to be inspected; a wire guide body that is removably fixed to the mounting board and has an insulating property;
The wire guide body is equipped with a large number of wire beams that are attached to the wire guide body, and the tip of each wire beam is brought into contact with a test point on the circuit board to perform electrical measurement and test. This is an inspection device for circuit boards, etc., which is configured to obtain a contact pressure of A conductive tube whose end protrudes proximally from the power supply connector is provided corresponding to each wire beam, and a protruding portion of each conductive tube is connected to a power supply plug that is detachably connected to the back of the power supply connector. A guide hole is provided for insertion, and a connection jack is built into the base end of the guide hole, which has a twist pin that is forcefully inserted into the conductive tube and connects the lead wire drawn out from the measurement/inspection device. An inspection device for circuit boards, etc., characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985082463U JPH0515109Y2 (en) | 1985-05-31 | 1985-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985082463U JPH0515109Y2 (en) | 1985-05-31 | 1985-05-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61197577U true JPS61197577U (en) | 1986-12-10 |
| JPH0515109Y2 JPH0515109Y2 (en) | 1993-04-21 |
Family
ID=30630202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985082463U Expired - Lifetime JPH0515109Y2 (en) | 1985-05-31 | 1985-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0515109Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008292327A (en) * | 2007-05-25 | 2008-12-04 | Hioki Ee Corp | Probe unit and circuit board inspection device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587835A (en) * | 1981-06-30 | 1983-01-17 | インタ−ナシヨナル・ビジネス・マシ−ンズ・コ−ポレ−シヨン | Probe assembly |
| JPS6011170A (en) * | 1983-06-30 | 1985-01-21 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Buckling pasting test-probe assembly |
-
1985
- 1985-05-31 JP JP1985082463U patent/JPH0515109Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587835A (en) * | 1981-06-30 | 1983-01-17 | インタ−ナシヨナル・ビジネス・マシ−ンズ・コ−ポレ−シヨン | Probe assembly |
| JPS6011170A (en) * | 1983-06-30 | 1985-01-21 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Buckling pasting test-probe assembly |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008292327A (en) * | 2007-05-25 | 2008-12-04 | Hioki Ee Corp | Probe unit and circuit board inspection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0515109Y2 (en) | 1993-04-21 |
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