JPS61195082U - - Google Patents
Info
- Publication number
- JPS61195082U JPS61195082U JP8068285U JP8068285U JPS61195082U JP S61195082 U JPS61195082 U JP S61195082U JP 8068285 U JP8068285 U JP 8068285U JP 8068285 U JP8068285 U JP 8068285U JP S61195082 U JPS61195082 U JP S61195082U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- board
- diameter
- clamping claws
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案に係る電子部品の取付構造を示
す説明図、第２及び３図は同取付構造に用いる鳩
目金具の俯角斜視図、第４図は同金具の基板に対
する嵌着固定状態を示す断面図である。
１：基板、２：鳩目金具、２１，２１…，２２
，２２…：挾圧爪、３：リード線、４：半田、Ｒ
１：リード線の軸径、Ｒ２：鳩目金具の口径。
Fig. 1 is an explanatory diagram showing the mounting structure for electronic components according to the present invention, Figs. 2 and 3 are perspective views of the eyelet fittings used in the mounting structure, and Fig. 4 shows the state in which the fittings are fitted and fixed to the board. FIG. 1: Board, 2: Eyelet fitting, 21, 21..., 22
, 22...: Clamping claw, 3: Lead wire, 4: Solder, R
1 : Shaft diameter of lead wire, R 2 : Diameter of eyelet fitting.
Claims (1)
切り起して上下に各々複数個の挾圧爪を突出成形
し、これら上下の各挾圧爪で相対的に口径の大き
な鳩目金具の径内に挿入する電子部品のリード線
を挾持すると共に、そのリード線の突端側を基板
に半田付け固定してなることを特徴とする基板に
対する電子部品の取付構造。 (2) 上記挾圧爪の各突端が鋸歯状に形成されて
いるところの実用新案登録請求の範囲第１項記載
の電子部品の取付構造。[Scope of Claim for Utility Model Registration] (1) A plurality of clamping claws are formed by cutting and raising the eyelet metal fitting into the diameter of the metal fitting to be fitted and fixed onto the board surface, and a plurality of clamping claws are formed to protrude from the upper and lower sides, and each of these upper and lower clamping claws Mounting of an electronic component to a board, characterized in that the lead wire of the electronic component to be inserted into the diameter of an eyelet fitting having a relatively large diameter is clamped, and the tip end of the lead wire is fixed to the board by soldering. structure. (2) The electronic component mounting structure according to claim 1, wherein each tip of the clamping claw is formed in a sawtooth shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8068285U JPS61195082U (en) | 1985-05-28 | 1985-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8068285U JPS61195082U (en) | 1985-05-28 | 1985-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61195082U true JPS61195082U (en) | 1986-12-04 |
Family
ID=30626765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8068285U Pending JPS61195082U (en) | 1985-05-28 | 1985-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195082U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102480835A (en) * | 2010-11-24 | 2012-05-30 | 三星电机株式会社 | Soldering connecting pin, semiconductor package substrate and method of mounting semiconductor chip using the same |
-
1985
- 1985-05-28 JP JP8068285U patent/JPS61195082U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102480835A (en) * | 2010-11-24 | 2012-05-30 | 三星电机株式会社 | Soldering connecting pin, semiconductor package substrate and method of mounting semiconductor chip using the same |
| KR20120056128A (en) * | 2010-11-24 | 2012-06-01 | 삼성전기주식회사 | Soldering connecting pin, semiconductor package substrate and method of mounting a semiconductor chip using the same |
| JP2012114394A (en) * | 2010-11-24 | 2012-06-14 | Samsung Electro-Mechanics Co Ltd | Soldered connection pin, semiconductor package substrate including the same, and mount method for semiconductor chip |