JPS61194844A - Wafer attaching and detaching mechanism of susceptor - Google Patents

Wafer attaching and detaching mechanism of susceptor

Info

Publication number
JPS61194844A
JPS61194844A JP3566785A JP3566785A JPS61194844A JP S61194844 A JPS61194844 A JP S61194844A JP 3566785 A JP3566785 A JP 3566785A JP 3566785 A JP3566785 A JP 3566785A JP S61194844 A JPS61194844 A JP S61194844A
Authority
JP
Japan
Prior art keywords
wafer
susceptor
wirings
grooves
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3566785A
Other languages
Japanese (ja)
Inventor
Takashi Araki
荒木　尊志
Hiroshi Nishida
寛 西田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP3566785A priority Critical patent/JPS61194844A/en
Publication of JPS61194844A publication Critical patent/JPS61194844A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Abstract

PURPOSE:To prevent a wafer from cracking or damaging due to a heat shock at a wafer attaching or detaching time by opening a groove on a wafer placing unit of a susceptor and providing wafer supporting means freely telescoped with the groove. CONSTITUTION:A plurality of grooves 12 narrower than the diameter of a wafer 11 are formed on the surface of a wafer placing unit of a susceptor 10 such as a CVD device, and wafer supporting wirings 13 are provided to freely telescope with the grooves 12. When a wafer attaching and detaching mechanism 30 which is thus constructed is used to place the wafer 11 on the susceptor 10, a supporting base 14 is lifted to move the wirings 13 on the grooves 12, the wafer is placed thereon, the base 14 is moved down to insert the wirings 13 into the grooves 12. When the wafer 11 is removed, the base 14 is lifted in the state that the wafer 11 is placed on the wirings 13, and the wafer 11 is temporarily removed from the susceptor 10 together with the wirings 13. Then, the wafer 11 on the wirings 13 is recovered by a vacuum tweezers.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、サセプタのウェハ着脱機構に関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a wafer attachment/detachment mechanism for a susceptor.

〔発明の技術的背景〕[Technical background of the invention]

従来、半導体ウェハ（以下、単にウェハと記１）の表面
に所定の薄膜等を形成するためにウェハをＣＶＤ　（ｃ
ｈｅｍｉｃａｌ　ｖａｐｏｒ　ｄａｐｏａｌＮｏｎ）装
置等のサセプタ上に設置して所定の処理を施している。Conventionally, in order to form a predetermined thin film etc. on the surface of a semiconductor wafer (hereinafter simply referred to as wafer 1), the wafer is subjected to CVD (c
The wafer is placed on a susceptor such as a chemical vapor dapoal (Non) device and subjected to predetermined processing.

而して、サセプタ上へのウニへの着脱を行うものとして
第３図に示すようなバキュームピンセット１を使用して
いる。バキュームピンセット１は、その内部を減圧状態
にしてウェハ２を固着するようＫなっている。ウェハ２
を固着すると直接サセプタ３のウェハ載置部にウェハ２
を移送し、処理後にサセプタ３の表面から吸引作用を利
用して直接ウェハ２を回収するようになっている。Vacuum tweezers 1 as shown in FIG. 3 are used to attach and detach the sea urchin onto the susceptor. The vacuum tweezers 1 are designed to hold the wafer 2 in place while the inside of the vacuum tweezers 1 is in a reduced pressure state. wafer 2
When the wafer 2 is fixed, the wafer 2 is directly placed on the wafer placement part of the susceptor 3.
After processing, the wafer 2 is directly recovered from the surface of the susceptor 3 using suction.

〔背景技術の問題点〕[Problems with background technology]

このようなバキュームピンセット１でサセプタ３へのウ
ェハ２の着脱操作を行うものでは、バキュームピンセッ
ト１側の温度が通常常温であるのに対してサセプタ３側
は高温状態に設定されているため、□ウェハ２をサセプ
タ３上に載置した際に急激なヒートショックが加わり、
ウェハ２に割れやひびが発生する。また、バキュームピ
ンセット１で直接サセプタ３上にウニノミ２を載置する
ため、サセプタ３の表面を傷つけやすい。更に、この傷
によって発生したごみ等によりウェハ２を汚染する問題
があった。When the wafer 2 is attached to and removed from the susceptor 3 using the vacuum tweezers 1, the temperature on the side of the vacuum tweezers 1 is usually room temperature, whereas the temperature on the susceptor 3 side is set to a high temperature state. When the wafer 2 is placed on the susceptor 3, a sudden heat shock is applied,
Breaks and cracks occur in the wafer 2. Furthermore, since the sea urchin chisel 2 is placed directly on the susceptor 3 with the vacuum tweezers 1, the surface of the susceptor 3 is likely to be damaged. Furthermore, there is a problem in that the wafer 2 is contaminated by dust and the like generated by the scratches.

〔発明の目的〕[Purpose of the invention]

本発明は、ヒートショ、りによるウニノーの割れ等を防
止すると共に、ウニノ・の汚染及びサセプタ表面の傷の
発生を防止してウニノ１の着脱操作を容易に行うことが
できるサセプタのウニノ１着脱機構を提供することをそ
の目的とするものである。The present invention provides a mechanism for attaching and detaching Unino 1 to a susceptor, which prevents cracking of Unino due to heat shock and scratches, as well as contamination of Unino and generation of scratches on the surface of the susceptor, and facilitates attachment and detachment of Unino 1. Its purpose is to provide.

〔発明の概要〕[Summary of the invention]

本発明は、サセプタのウニノ１載置部に溝を穿設し、こ
の溝に自在に出入するウェハ支持手段を設けたことによ
り、ヒートショックによるウェハの割れ等を防止すると
共に、ウニノ１の汚染及びサセプタ表面の傷の発生を防
止してウニノ１の着脱操作を容易に行うことができるサ
セプタのウェハ着脱機構である。The present invention prevents cracking of the wafer due to heat shock and prevents contamination of the unicorn 1 by providing a groove in the susceptor 1 placement part and providing a wafer support means that can freely move in and out of this groove. and a susceptor wafer attachment/detachment mechanism that can easily perform attachment/detachment operations of UNINO 1 while preventing the occurrence of scratches on the susceptor surface.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の実施例について図面を参照して説明する
。第１図は、本発明の一実施例の概略構成を示す斜視図
である。図中１０は、平板状をなすサセプタである。サ
セプタ１００表面は、ウェハ１ノの載置部罠なっている
。この表面領域には、ウェハ１１の直径よりも狭い幅で
並列状態で穿設された溝１２の対が複数個設けられてい
る。この溝１２内に自在に出入できるようにしてウェハ
支持手段であるワイヤ１３が設けられている。すなわち
、ワイヤ１３の一端部は、サセプタ１０を収容するよう
にその下部に設けられた支持台１４の側壁の上縁部に♂
ルト１５で固定されている。ワイヤ１３の他端部は、前
記側壁に対向する側壁上に設けられた溝付きベアリング
１６を経た後ばね１７を介して支持台１４に取付けられ
ている。支持台１４は、その裏面中央部圧設けられたエ
アシリンダー１８と両端部に支持台１４の床部を貫挿す
るように設けられた支柱１９によって昇降自在に支持さ
れている。つまり、エアシリンダー１８の駆動により支
持台１４が昇降動し、両端部が支うになっている。なお
、支持台１４０床部に突出した支柱１９Ｖｃは、上限ス
トツノ！−ＩＱ及びリニアモーシ璽ンベアリング２１が
取付けらｈ４床部の裏面側の支柱１９の部分には、下限
ストッパー２２が取付けられている。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a schematic configuration of an embodiment of the present invention. In the figure, 10 is a flat susceptor. The surface of the susceptor 100 serves as a trap for placing a wafer 1 on it. This surface area is provided with a plurality of pairs of grooves 12, which are bored in parallel and have a width narrower than the diameter of the wafer 11. A wire 13 serving as wafer support means is provided so as to be able to freely move in and out of this groove 12 . That is, one end of the wire 13 is attached to the upper edge of the side wall of the support base 14 provided at the lower part of the support base 14 to accommodate the susceptor 10.
It is fixed with bolt 15. The other end of the wire 13 is attached to the support base 14 via a grooved bearing 16 provided on the side wall opposite to the above-mentioned side wall and a rear spring 17. The support stand 14 is supported so as to be movable up and down by an air cylinder 18 provided at the center of the rear surface thereof, and pillars 19 provided at both ends so as to penetrate through the floor of the support stand 14. That is, the support stand 14 moves up and down by the drive of the air cylinder 18, and both ends support it. Note that the support column 19Vc protruding from the floor of the support stand 140 has an upper limit! - A lower limit stopper 22 is attached to the support 19 on the back side of the h4 floor where the IQ and linear motor bearings 21 are attached.

このように構成されたサセプタのウェハ着脱機構ＳＯに
よれば、ウェハ１１をサセプタ１０上に載置する場合は
、先ず第２図（ホ）に示す如く、エアシリンダー１８に
より支持台１４を上昇させ、ワイヤ１３を溝１２から外
しておく。この状態でワイヤ１３上にウェハ１１をパキ
、−ムピンセット等により一旦載置する。次いで、第２
ロー）に示す如く、支持台１４を降下してワイヤ１３を
溝１２内に挿入することにより、サセプタ１０上にウェ
ハ１１を載置する。サセプタ１０上から処理後のウェハ
１１を除去する場合は、逆にワイヤ１３上にウェハ１１
を載せた状態で支持台１４を上昇させることにより、ワ
イヤ１３と共にウェハ１１をサセプタ１０から一旦外す
。次いで、第２図（４）に示す如（、ワイヤ１３上のウ
ェハ１１をバキュームピンセット等にて回収することに
より除去操作を完了する。According to the susceptor wafer attachment/detachment mechanism SO configured as described above, when placing the wafer 11 on the susceptor 10, the support table 14 is first raised by the air cylinder 18, as shown in FIG. 2(E). , remove the wire 13 from the groove 12. In this state, the wafer 11 is temporarily placed on the wire 13 using tweezers or the like. Then the second
As shown in FIG. 1, the wafer 11 is placed on the susceptor 10 by lowering the support base 14 and inserting the wire 13 into the groove 12. When removing the processed wafer 11 from above the susceptor 10, conversely, place the wafer 11 on the wire 13.
The wafer 11 and the wires 13 are temporarily removed from the susceptor 10 by raising the support stand 14 with the wafer 11 placed thereon. Next, as shown in FIG. 2(4), the wafer 11 on the wire 13 is recovered using vacuum tweezers or the like to complete the removal operation.

このようにワイヤ１３上でのウニノＳｌｌの載置工程を
経てから間接的にサセプタ１０上へのウェハ１）の着脱
を行うため、サセプタ１０が高温状態に設定されていて
もウニノ１１１に及ぶヒートショックによる影響を十分
に小さく抑えることができる。その結果、ヒートン、、
りによってウェハ１１に割れやひびが発生するのを防止
することができる。また、パキーームピンセット等の手
段が直接サセプタ１００表面に接触しないので、サセプ
タ１０に傷等ができるのを防止できる。その結果、この
ような傷等によって発生するごみｋよりウェハ１１が汚
染するのを防止することができる。In this way, since the wafer 1) is indirectly attached to and removed from the susceptor 10 after passing through the process of placing the Unino Sll on the wire 13, even if the susceptor 10 is set to a high temperature state, the heat reaching the Unino 111 can be avoided. The influence of shock can be suppressed to a sufficiently small level. As a result, Heaton...
It is possible to prevent cracks or cracks from occurring in the wafer 11 due to this. Further, since the means such as pachyme tweezers do not directly contact the surface of the susceptor 100, it is possible to prevent the susceptor 10 from being damaged. As a result, it is possible to prevent the wafer 11 from being contaminated by dust k generated by such scratches and the like.

ヤ１３を所定ピッチ分だけ前後進させて行うよ５にして
も良い。また、サセプタ１０上へのウェハ１１の着脱操
作を行う手段としては、ワイヤ１３に限らず、サセプタ
１０のウニノ・載置部にウェハ１１を支持し得る突起を
複数本昇降自在に設けて、この突起の昇降動作にて行う
ものであっても良い。5 may be performed by moving the wheel 13 back and forth by a predetermined pitch. In addition, the means for attaching and detaching the wafer 11 to and from the susceptor 10 is not limited to the wire 13, but a plurality of protrusions capable of supporting the wafer 11 are provided on the mounting part of the susceptor 10 so as to be able to rise and fall. It may be performed by raising and lowering the protrusion.

〔発明の効果〕〔Effect of the invention〕

以上説明した如く、本発明に係るサセプタのウェハ着脱
機構によれば、ヒートショックによるウェハの割れ等を
防止すると共に、ウェハの汚染及びサセプタ表面の傷の
発生を防止してウェハの着脱操作を容易に行うことがで
きるものである。As explained above, the susceptor wafer attachment/detachment mechanism according to the present invention prevents wafer cracking due to heat shock, prevents wafer contamination and scratches on the susceptor surface, and facilitates wafer attachment/detachment operations. This is something that can be done.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本発明の一実施例の概略構成を示す斜視図、
第２図（４）（Ｂ）は、同実施例の作用を示す説明図、
第３図は、従来のウェハ着脱機構を示す断面図である。 １０・・・サセプタ、１１・・・ウェハ、１２・・・溝
、１３・・・ワイヤ、１４・・・支持台、１５−・・ざ
ルト、１６・・・ベアリング、１７・・・ばね、１８・
・・エアシリンダー、１９−・・支柱、２０・・・上限
ストッパー、２１・・・リニアモーションベアリング、
２２・・・下限ストッパー、３０・・・サセプタのウェ
ハ着脱機構。 出願人代理人　　弁理士　鈴　江　武　彦第１図 第２図 第３図FIG. 1 is a perspective view showing a schematic configuration of an embodiment of the present invention;
FIG. 2 (4) (B) is an explanatory diagram showing the effect of the same embodiment;
FIG. 3 is a sectional view showing a conventional wafer attachment/detachment mechanism. DESCRIPTION OF SYMBOLS 10... Susceptor, 11... Wafer, 12... Groove, 13... Wire, 14... Support stand, 15-... Zaruto, 16... Bearing, 17... Spring, 18・
...Air cylinder, 19--Strut, 20--Upper limit stopper, 21--Linear motion bearing,
22... Lower limit stopper, 30... Wafer attachment/detachment mechanism of susceptor. Applicant's representative Patent attorney Takehiko Suzue Figure 1 Figure 2 Figure 3

Claims (1)

【特許請求の範囲】[Claims] 　サセプタのウェハ載置部の表面領域に所定間隔を置い
て並列に穿設された溝と、該溝内に自在に出入するよう
に設けられたウェハ支持手段と、該ウェハ支持手段を前
記溝内に出入させる駆動機構とを具備することを特徴と
するサセプタのウェハ着脱機構。Grooves are formed in parallel at predetermined intervals in the surface area of the wafer mounting portion of the susceptor, wafer support means is provided to freely move in and out of the grooves, and the wafer support means is inserted into the grooves. A wafer attachment/detachment mechanism for a susceptor, comprising a drive mechanism for moving a wafer in and out of the susceptor.
JP3566785A 1985-02-25 1985-02-25 Wafer attaching and detaching mechanism of susceptor Pending JPS61194844A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3566785A JPS61194844A (en) 1985-02-25 1985-02-25 Wafer attaching and detaching mechanism of susceptor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3566785A JPS61194844A (en) 1985-02-25 1985-02-25 Wafer attaching and detaching mechanism of susceptor

Publications (1)

Publication Number Publication Date
JPS61194844A true JPS61194844A (en) 1986-08-29

Family

ID=12448223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3566785A Pending JPS61194844A (en) 1985-02-25 1985-02-25 Wafer attaching and detaching mechanism of susceptor

Country Status (1)

Country Link
JP (1) JPS61194844A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7771538B2 (en) 2004-01-20 2010-08-10 Jusung Engineering Co., Ltd. Substrate supporting means having wire and apparatus using the same
KR101196197B1 (en) * 2004-01-20 2012-11-02 주성엔지니어링(주) Substrate supporting Member, Deposition Apparatus Having the Member and Method of Transferring Substrate Using the Same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7771538B2 (en) 2004-01-20 2010-08-10 Jusung Engineering Co., Ltd. Substrate supporting means having wire and apparatus using the same
US7942623B2 (en) 2004-01-20 2011-05-17 Jusung Engineering Co. Ltd. Substrate supporting means having wire and apparatus using the same
KR101196197B1 (en) * 2004-01-20 2012-11-02 주성엔지니어링(주) Substrate supporting Member, Deposition Apparatus Having the Member and Method of Transferring Substrate Using the Same

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