JP3608121B2 - Mechanical desorption mechanism of substrate and desorption method using the mechanism - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a mechanism for mechanically removing a substrate held on a base. More specifically, the present invention relates to a mechanism for mechanically detaching a substrate that is still clamped to an electrode by a residual charge. Furthermore, the present invention relates to a desorption method using a substrate mechanical desorption mechanism.
[0002]
[Prior art]
Conventionally, an electrostatic chuck (or electrostatic clamp) as shown in FIG. 9 is known in order to hold a substrate to be processed in a plasma processing apparatus, for example, a dry etching apparatus, such as a semiconductor wafer, on an electrode.
[0003]
In FIG. 9, 101 is a disk-shaped substrate, 102 is a substrate up / down pin facing the center of the substrate 101, 103 is a table, 104 is an electrode, 105 is a processing chamber, and 106 is an electrode 104 that moves the electrode 104 up and down. A support post 107 is a frame. Reference numeral 125 denotes a cover for the peripheral edge of the upper surface of the electrode 104.
[0004]
The base 103 is a metal base that is made of a dielectric material or is coated with a dielectric thin film. Therefore, the substrate 101 is clamped to the electrode 104 by using the electrostatic adsorption force due to static electricity accumulated in the dielectric. If a dielectric film, for example, a SiO ₂ film is formed on the back side of the substrate 101, the substrate 101 can be clamped to the electrode 104 by electrostatic attraction even if the base 103 is made of metal.
[0005]
When the electrode 104 is lowered through the support 106, the stopper 108 at the lower end of the shaft 106 a connected to the pin 102 hits the frame 107. When the electrode 104 is further lowered, the pins 102 protrude from the holding surface (upper surface in the drawing) of the base 103, so that the substrate 101 can be detached from the base 103 by pushing up the pins 102.
[0006]
[Problems to be solved by the invention]
In the conventional substrate detachment mechanism, when the substrate 101 is slightly lifted by the pins 102 due to static electricity remaining on the table 103, the portion of the substrate 101 that hits the pins 102 is slightly separated from the table 103. However, the portion where the pin 102 does not contact, particularly the edge of the substrate 101, is still attached to the table 103. Further, when the substrate 101 is lifted, the substrate 101 is raised while a part of the edge of the substrate 101 remains attached to the base 103 as shown in FIG. A so-called substrate 101 goes up. In order to take out the substrate 101 from the processing chamber 105, when the push-up of the pin 102 is stopped, the substrate 101 remains inclined obliquely. When the substrate robot 101 is tilted and the hand 30 of the transfer robot enters between the substrate 101 and the base 103 and tries to put the substrate 101 on the hand 30, the substrate 101 moves along the four claws 31 and 31. Does not fit (position marked with a dotted line). Such an accident has a problem in that the delivery of the substrate 101 is hindered. If the substrate 101 is in a horizontal position when the substrate 101 is delivered, such an accident will not occur.
[0007]
The present invention has been made in view of the above-described problems, and uses a substrate mechanical detachment mechanism and a mechanism that can completely detach the substrate 101 from the base 103 and correct it to a horizontal posture. It is an object to provide a desorption method.
[0008]
[Means for Solving the Problems]
The present invention, which has achieved the above object, includes a base, a base smaller than the substrate disposed on the base for holding the substrate, pins protruding from the base, and a substrate disposed around the base. In the substrate detachment mechanism consisting of a ring that moves up and down facing the back surface of the edge, the thickness of the ring portion facing the edge of the substrate is made thinner than the thickness of the base, and after the pins lift the substrate The substrate is a mechanical detachment mechanism having a driving means for lifting the edge of the substrate.
[0009]
The driving means raises or lowers the base or raises and lowers the pin and the ring together. The driving means for raising and lowering the base includes a nut connected to a column supporting the base, a screw screwed to the nut, a motor for rotating the screw, a stopper for lifting the pin against the frame, and a ring. Has a stopper fixed around the base for lifting. The driving means for raising and lowering the pin and the ring together is a stopper for lifting the pin, a stopper for lifting the ring, a plate for lifting the stopper, a nut connected to the plate, and a screw to the nut. And a motor for rotating the screw.
[0010]
In addition, the present invention, which has achieved the above object, is arranged around a base, a base smaller than the board arranged on the base for holding the board, a pin protruding from the base, and the circumference of the base. A ring that moves up and down facing the back of the edge of the substrate, wherein the thickness of the portion of the ring that faces the edge of the substrate is thinner than the thickness of the base, and driving means for lifting the pins, and A mechanical detachment mechanism of a substrate having a driving means for lifting the ring.
[0011]
The pin driving means includes a stopper for lifting the pin, a circular plate for lifting the stopper, a nut connected to the plate, a screw coupled to the nut, and a motor for rotating the screw. Have. The ring driving means includes a stopper for lifting the ring, a horseshoe plate for lifting the stopper, a nut connected to the plate, a screw coupled to the nut, and a motor for rotating the screw. Have.
[0012]
The base of the mechanical desorption mechanism of the substrate for plasma processing is an electrode. Furthermore, the base of the mechanical detachment mechanism having a mechanism for holding the substrate by electrostatic attraction is a dielectric base or a metal base on which a dielectric thin film is coded.
[0013]
The pins of the mechanical detachment mechanism are arranged in the base at a position where the central portion of the substrate can be pushed up.
[0014]
Further, according to the present invention which has achieved the above object, the substrate held on the base is pushed up with a pin, the substrate is tilted obliquely, and the edge of the substrate is lifted with a ring while lifting the substrate with the pin. Desorption method.
[0015]
Furthermore, the present invention which has achieved the above object further includes the step of pushing up the substrate held on the base stand with pins, tilting the substrate obliquely, and lifting the edge of the substrate with a ring while fixing the pins. This is a desorption method.
[0016]
In this detachment method, the substrate is pushed up by about 1 mm with a pin.
[0017]
[Action]
According to the mechanical detachment mechanism of the present invention, a force for releasing the edge of the substrate attached to the corner of the table on which the substrate is placed can be applied to the edge of the substrate. FIG. 11 shows a state where the ring 9 lifted upward contacts the edge of the substrate 1 after the substrate 1 electrostatically attracted by the pins 2 is lifted and the substrate 1 is inclined obliquely. Under this state, the force acting on the substrate 1 is the force F1 that the ring 9 lifts the edge of the substrate 1 upward at the point a that is in contact with the annular step 9a of the ring 9, and At point b that is in contact with the corner, electrostatic attraction force F2 due to static electricity remaining on the table 3, at point c that is in contact with the pin 2, the force F3 that the pin 2 lifts the substrate 1 upward, and further, the substrate 1 There is a weight W of the substrate 1 at the center of gravity d. How these forces act on the substrate 1 through the detachment of the substrate 1 will be described with reference to FIG.
[0018]
In the stage (1) in FIG. 12, the substrate 1 is lifted by F3 at the point c, but the substrate 1 is inclined obliquely by the action of F2 at the point b. However, at this stage, since the annular step 9a is not in contact with the edge of the substrate 1 (FIG. 11), F1 has not yet acted at the point a. What should be noted at this stage is that the electrostatic attractive force acting on the entire substrate acts only on the point b. By removing the electrostatic attraction force F2 acting only on the point b from the substrate 1, the detachment of the substrate 1 is achieved.
[0019]
In the stage (2), the annular step 9a comes into contact with the edge of the substrate 1, and F1 acts at point a. Here, for this invention, it is important that F1 acts at point a after F3 acts on the substrate 1. In other words, for detachment of the substrate 1, it is important to lift the edge of the substrate 1 with the ring 9 after lifting the substrate 1 with the pins 2. This is because, as shown in FIG. 12, if the pins 2 and the ring 9 lift the substrate 1 at the same time in a short time in a state where the electrostatic adsorption is uniformly applied to the entire substrate, the substrate 1 jumps. is there. The jumped substrate 1 may fall and collide with the table 3 to break the substrate 1. Further, at the stage (1), in order for the substrate 1 to tilt obliquely, it is necessary to make the thickness of the base 3 thinner than the thickness of the annular step portion 9a. If the thickness of the base 3 and the thickness of the annular step 9a are the same, the substrate 1 jumps in the same manner when the substrate 1 is lifted by the pins 2 without lifting the edge of the substrate 1 by the ring 9. As shown in FIG. 14, since the edge of the substrate 1 hits the annular step portion 9a at the same time as the substrate 1 is lifted by the pins 2, the edge of the substrate 1 is apparently lifted by the annular step portion 9a. Therefore, in order to prevent the substrate 1 from splashing, the thickness of the annular step must be smaller than the thickness of the table 3.
[0020]
In step (3), the substrate 1 is lifted while acting F1 and F3 on the substrate 1 against the electrostatic attraction force F2 applied to the substrate 1 at the point b (direction of arrow 35). While the substrate 1 is being lifted, the ring 9 (F1) and the pin 2 (F2) are lifted at the same time, and further, the lifting speed of the ring 9 (F1) and the lifting speed of the pin 2 (F2) are the same. Lifts up while tilting diagonally. The electrostatic attracting force F2 acting on the substrate 1 disappears at the moment when the edge of the substrate 1 leaves the base 3, that is, the point b.
[0021]
In the stage (4), the substrate 1 inclined obliquely naturally moves in the direction of the arrow 36 due to the weight W of the substrate 1 acting on the center of gravity d of the substrate 1. As a result of this movement, the substrate 1 is placed on all the pins 2, so that the substrate 1 becomes horizontal. When the substrate 1 becomes horizontal, the edge of the substrate 1 is separated from the ring 9, so that F 1 does not act on the substrate 1.
[0022]
According to another method in the stage (3), the substrate can be detached from the table 3 and further leveled. That is, the lifting of the pins 2 is stopped, and the edge of the substrate 1 is lifted only by the ring 9. According to this method, the point c acts as a fulcrum, the point a acts as a force point, and the point b acts as an action point. By the lever principle, the substrate 1 inclined obliquely moves in the direction of the arrow 36, and the substrate 1 is horizontal on all pins.
[0023]
【Example】
Hereinafter, an embodiment in which the substrate held on an electrode by an electrostatic chuck is detached will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing a mechanical detachment mechanism of a preferred first embodiment. This mechanical desorption mechanism is incorporated in the parallel plate etching chamber 5 of the multi-chamber dry etching system “ANELVA-4100” manufactured by Nidec Anelva. In the chamber 5, in addition to a pipe for introducing an etching gas (not shown) into the chamber 5 and a vacuum pump for evacuating the chamber 5, an electrode 4 for installing the semiconductor wafer 1 and an electrode 40 facing the electrode 4 are installed. Is offered. A dielectric circular base 3 on which the semiconductor wafer 1 is placed is disposed on a circular electrode 4. Since the circular platform 3 is smaller than the semiconductor wafer 1, the edge of the semiconductor wafer 1 protrudes from the circular platform 3. A ring 9 is disposed around the circular platform 3. The ring 9 has an annular step 9a formed inside. A part of the annular step 9 a faces the back surface of the edge of the semiconductor wafer 1 protruding from the circular platform 3. An annular flange 9 b is formed outside the ring 9. As shown in FIG. 2, a part of the head of the stopper 10 provided on the outer surface of the electrode 4 faces the back surface of the annular flange 9b. The four stoppers 10 are arranged at equal intervals outside the electrode 4. Connected to the electrode 4 is an rf power source 41 for generating plasma, a variable DC power source 42 and a power supply 45 for electrostatic attraction comprising a filter 44 for cutting off the rf power source.
[0024]
Four holes 3 a are formed at equal intervals in the center of the circular platform 3. The pin 2 protrudes or immerses from the electrode 4 through the hole 3a. In order to lift the semiconductor wafer with the pins 2, at least three pins are required. However, in this embodiment, the substrate 1 is lifted by the four pins 2. The four pins 2 stand on the circular support plate 12 in accordance with the holes 3a. The shaft 6a connected to the lower side of the support plate 12 is held by the bearings 11a and 11b so as to be slidable in the vertical direction. The lower end of the shaft 6a is connected to the piston 33 in the cylinder 14. By allowing the pressurized fluid (oil or air) to flow into and out of the cylinder 14, the shaft 6a can be independently moved up and down independently of the up and down movement of the support column 6 described later. A stopper 8 is disposed at the lower end of the cylinder 14. The stopper 8 stops against the frame 7 to stop the shaft 6a from being lowered.
[0025]
A column 6 is provided on the lower side of the electrode 4. The column 6 protrudes outside the chamber 5. In the portion where the wall surface of the chamber 5 and the support 6 are in contact with each other, two O-rings 43 and 43 are provided via the grease 46, so that the inside of the chamber 5 can be kept airtight and the support 6 can slide. . An arm 15 is provided on the side wall of the column 6 provided on the lower side of the electrode 4. A nut 16 is provided at the tip of the arm 15. The nut 16 is screwed with a screw 17 installed in the frame 7. By rotating the screw 17 by the motor 18, the support 6 is moved up and down as indicated by an arrow 19, and at the same time, the electrode 4 is moved up and down in the same direction as the support 6.
[0026]
When the semiconductor wafer 1 is clamped on the circular platform 3, the pin 2 is immersed in the central recess 4 a of the electrode 4 so that the tip of the pin 2 does not protrude from the upper surface (clamp surface) of the circular platform 3. In a state where the semiconductor wafer 1 is clamped, the stopper 8 does not hit the frame 7. At the same time, the piston 33 in the cylinder 14 moves to the lowest side. Further, the lower surface of the annular flange 9b of the ring 9 does not contact the stopper 10 (FIG. 1).
[0027]
Next, the operation of the column 6, the pin 2 and the ring 9 when the semiconductor wafer 1 is detached will be described.
[0028]
(1) First, the support 6 is lowered by driving the motor 18. When the support 6 is lowered, the stopper 8 hits the frame 7, and the lowering of the shaft 6a that has been lowered simultaneously with the support 6 stops. When the support 6 is further lowered, the shaft 6a is relatively raised. Due to the relative rise of the shaft 6a, the pin 2 projects through the hole 3a to the upper surface of the circular platform 3. When the surface of the tip of the pin 2 and the upper surface of the circular base 3 are flush with each other, the distance between the annular flange 9b and the stopper 10 is about 1 mm. In particular, the distance between the annular flange 9b and the stopper 10 is not limited to 1 mm. However, even if this distance is in the range of 0.5 to 10 mm, the semiconductor semiconductor wafer 1 can be completely detached from the table 3 in a horizontal posture.
[0029]
(2) Next, when the support column 6 is further lowered, the annular flange 9b and the stopper 10 come into contact with each other. At this time, the pin 2 protrudes from the upper surface of the circular base 3 by about 1 mm. At this time, a part of the edge of the semiconductor wafer 1 remains stuck to the corner of the circular table 3 due to static electricity remaining on the circular table 3. The semiconductor wafer 1 has an inclined posture as shown in FIG.
[0030]
(3) Further, when the support 6 is further lowered, the pin 2 protrudes beyond 1 mm. At the same time, as shown in FIG. 3, the ring 9 hitting the stopper 10 is lifted. The annular step portion 9a of the ring 9 that rises hits the edge of the semiconductor wafer 1 to which the circular base 3 is stuck. Further, when the ring 9 is lifted, the semiconductor wafer 1 is pulled away from the corner of the circular platform 3 and lifted, and the semiconductor wafer 1 is placed on all the pins 2. As shown in FIG. 4, the semiconductor wafer 1 is completely detached from the circular platform 3 and held in a horizontal state.
[0031]
(4) Subsequently, as shown in FIG. 5, pressurized fluid is supplied to the cylinder 14 from the direction of the arrow 34, and the shaft 6 a is lifted in the direction of the arrow 20. When the shaft 6 a is lifted, the pins 2 protrude beyond the floating ring 9 and the semiconductor wafer 1 is lifted onto the ring 9. A transfer robot hand 30 enters between the semiconductor wafer 1 and the ring 9, and stores the semiconductor wafer 1 along the four claws 31.
[0032]
For reasons other than the residual charge, for example, when the semiconductor wafer 1 lifted by the pins 2 due to vibration slides down from the pins 2 or when the semiconductor wafer 1 displaced from the table 3 is lifted by vibrations, the semiconductor wafer 1 is inclined obliquely. Sometimes. Even in such a trouble, the wafer 1 inclined obliquely can be returned to a horizontal posture by the above method.
[0033]
The ring 9 may be made of metal or insulating material. In order to make the material of the portion in contact with the semiconductor wafer 1 and the portion in contact with the stopper 10 different, as shown in FIG. 6A, separate members of the inner ring 21a and the outer ring 21b may be used. Further, as shown in FIGS. 6B and 6C, the pin 2 can be provided with a circular plate 22 at the tip.
[0034]
Further, the annular step portion 9a does not necessarily need to be annular. At least three projecting pieces may be provided at equal intervals inside the ring 9. Concavities and convexities may be formed on the surface of the annular step portion 9a that contacts the semiconductor wafer 1 so that the contact area with the semiconductor wafer 1 is as small as possible.
[0035]
The annular flange 9b is not necessarily required to be annular. For example, as shown in FIG. 7, four (at least three) protruding pieces may be formed on the ring 9 on the outside. In this case, a stopper 10 is provided so as to face each of the projecting pieces. The stopper 10 is erected on the bottom wall of the chamber 5 in the above embodiment, but may be provided on the side wall of the chamber 5. The stopper 10 may be a cylinder 23 as shown in FIG.
[0036]
In the first embodiment, the electrode 4 is lowered and the pin 2 and the ring 9 are relatively raised. However, the electrode 2 can be fixed and the pin 2 and the ring 9 can be raised.
[0037]
FIG. 7 shows a preferred second embodiment in which the circular base 3 side is fixed in the chamber 5 so that the pin 2 and the ring 9 can be raised and lowered.
[0038]
A plate 26 connected to the nut 16 is provided at the lower end of the elevating shaft 24 connected to the stopper 8 and the stopper 10. The pin 2 and the ring 9 are moved up and down by a drive mechanism including the stopper 8, the stopper 10, the plate 26, the nut 16, the screw 17 and the motor 18.
[0039]
When the motor 18 is driven to raise the plate 26, it first hits the stopper 8 and lifts the stopper 8. When the stopper 8 is lifted, the pin 2 protrudes from the circular platform 3. On the way, the plate 26 hits the lifting shaft 24 and lifts the lifting shaft 24. When the pin 2 protrudes about 1 mm from the circular platform 3, the stopper 10 connected to the lifted lifting shaft 24 hits the annular flange 9 b of the ring 9. Further, when the plate 26 rises, the pin 2 hits and the ring 9 rises. When the plate 26 continues to rise, the annular step 9a of the ring 9 hits the tilted edge of the semiconductor wafer 1, lifts the edge, and places the semiconductor wafer 1 on all the pins 2. In this way, the obliquely inclined semiconductor wafer 1 can be brought into a horizontal state. After the semiconductor wafer 1 is leveled, the pressurized fluid is supplied to the cylinder 14 and the semiconductor wafer 1 is lifted onto the ring 9 as in (4) of the first embodiment. A circular stopper 27 is attached to the inside of the chamber 5 in the lifting shaft 24. The stopper 27 plays a role of allowing the elevating shaft 24 to contact the plate 6 after the plate 26 contacts the stopper 8 when the plate 26 moves up.
[0040]
FIG. 15 shows a preferred third embodiment in which the pin 2 and the ring 9 can be moved up and down separately. A unique drive mechanism for lifting the ring 9 is added to the third embodiment. The drive mechanism includes a stopper 10, a plum hoof plate 52, a nut 50, a screw 53, and a motor 51. A horseshoe plate 52 connected to the nut 50 is provided at the lower end of the lifting shaft 24 connected to the stopper 10. As shown in FIG. 16, the circular plate 26 can lift the pin 2 connected to the stopper 8, and the horseshoe-shaped plate 52 can lift the ring 9 separately through the stopper 10.
[0041]
According to the third embodiment, the substrate can be detached by the above-described method, but the substrate can also be detached by another separation method. This other detachment method is characterized in that the pins 2 are fixed when the semiconductor wafer 1 is lifted by the ring 9. The operation of the pin 2 and the ring 9 by this different detachment method will be described.
[0042]
(1) The motor 18 is driven to project the pin 2 from the upper surface of the circular platform 3 by about 1 mm. With the protrusion of the pin 2, the semiconductor wafer 1 tilts obliquely while a part of the edge of the semiconductor wafer 1 is stuck to the corner of the circular platform 3. Then, the drive of the motor 18 is stopped and the raising of the pin 2 is stopped.
[0043]
(2) Next, the motor 51 is driven to lift the ring 9. The nine annular steps 9a that are lifted hit the edge of the semiconductor wafer 1 and pull the edge of the semiconductor wafer 1 away from the corner of the circular base. Further, the annular step 9 a lifts the semiconductor wafer 1, and the semiconductor wafer 1 tilted obliquely with the pin 2 in contact with the semiconductor wafer 1 as a fulcrum becomes horizontal. When the semiconductor wafer 1 becomes horizontal, the driving of the motor 51 is stopped and the ascent of the ring 9 is stopped.
[0044]
(3) In order to take out the semiconductor wafer 1 from the chamber 5, the motor 18 is driven to further lift the semiconductor wafer 1.
[0045]
In the present invention, other conditions may be used as long as the action described above, that is, the action that the ring lifts the edge of the substrate after the pin lifts the substrate can be applied to the substrate detachment. . Even a substrate holding method other than the electrostatic adsorption method, for example, a vacuum adsorption method, or a helicon wave plasma processing chamber described in US Pat. Nos. 4,990,229 and 5,122,251, The present invention can be applied.
[0046]
【The invention's effect】
As described above, according to the present invention, the substrate can be completely detached from the table, and the substrate can be corrected horizontally before the substrate is delivered. As a result, the trouble at the time of delivery of a board | substrate can be eliminated.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view in which a part of a first embodiment of the present invention is omitted.
FIG. 2 is a plan view in which a part of the first embodiment is omitted.
FIG. 3 is a cross-sectional view in which a part of the state in which the pin starts to rise is omitted in the first embodiment.
FIG. 4 is a cross-sectional view in which a part of the state in which the ring acts is omitted in the first embodiment.
FIG. 5 is a cross-sectional view in which a part of the state during delivery of the substrate is omitted in the first embodiment.
6A and 6B are views of another embodiment of the present invention, in which FIG. 6A is a partial cross-sectional view of a ring, FIG. 6B is a cross-sectional view of a pin portion, and FIG.
FIG. 7 is a plan view of another embodiment of the present invention in which a part of a ring and a stopper is omitted.
FIG. 8 is a cross-sectional view in which a part of a second embodiment of the present invention is omitted.
FIG. 9 is a configuration diagram of a conventional substrate removal mechanism.
FIG. 10 is also a diagram of a conventional substrate detachment mechanism, showing a state in which pins act.
FIG. 11 is an explanatory diagram showing a state of force exerted on the substrate when pins and rings act on the substrate in the mechanical detachment mechanism of the present invention.
FIG. 12 is an explanatory view showing the force acting on the substrate until the substrate is detached.
FIG. 13 is an explanatory diagram showing forces acting on a substrate when pins and rings lift the substrate at the same time.
FIG. 14 is an explanatory diagram showing a force acting on a substrate when the substrate is lifted by a pin under the same thickness of the base and the annular stepped portion of the ring.
FIG. 15 is a cross-sectional view in which a part of a third embodiment of the present invention is omitted.
16 is a cross-sectional view taken along the line AA in FIG. 15 in the third embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Pin 3 Circular base 3a Hole 4 Electrode 4a Recess 5 Chamber 6 Support | pillar 6a Shaft 7 Frame 8 Stopper 9 Ring 9a Annular step 9b Annular collar 10 Stopper 11a, 11b Bearing 12 Plate 14 Cylinder 15 Arm 16 Nut 17 Screw 18 motor

Claims (14)

A base, a base smaller than the board arranged on the base to hold the board, a pin protruding from the bottom of the base, and the back surface of the edge of the board arranged around the base move up and down. In the detaching mechanism of the substrate composed of the ring, the thickness of the ring portion facing the edge of the substrate is made thinner than the thickness of the base, and further, the ring lifts the edge of the substrate after the pins lift the substrate. A mechanical detachment mechanism for a substrate, comprising a driving means. 2. The mechanical detachment mechanism for a substrate according to claim 1, wherein the driving means moves the base up and down. 2. The mechanical detachment mechanism for a substrate according to claim 1, wherein the driving means raises and lowers the pin and the ring together. The driving means includes a nut connected to a column supporting the base, a screw screwed to the nut, a motor for rotating the screw, a stopper for lifting the pin against the frame, and a base for lifting the ring. 2. The mechanical detachment mechanism for a substrate according to claim 1, further comprising a stopper fixed around the substrate. The driving means includes a stopper for lifting the pin, a stopper for lifting the ring, a plate for lifting the stopper, a nut connected to the plate, a screw screwed to the nut, and 2. The mechanical detachment mechanism for a substrate according to claim 1, further comprising a motor for rotating the screw. A base, a smaller platform disposed on the base to hold the substrate, a pin protruding from the platform, and a ring that moves up and down opposite the back of the edge of the substrate disposed around the platform; The thickness of the portion of the ring facing the edge of the substrate is smaller than the thickness of the base, and the substrate is provided with driving means for lifting the pins and driving means for lifting the rings Mechanical detachment mechanism. The pin drive means includes a stopper for lifting the pin, a circular plate for lifting the stopper, a nut connected to the plate, a screw screwed to the nut, and a motor for rotating the screw. The mechanical detachment mechanism for a substrate according to claim 6, wherein: The ring driving means includes a stopper for lifting the ring, a horseshoe plate for lifting the stopper, a nut connected to the plate, a screw screwed to the nut, and a motor for rotating the screw. The mechanical detachment mechanism for a substrate according to claim 6, wherein: 7. The substrate mechanical detachment mechanism according to claim 1, wherein the base is an electrode. 7. The mechanical detachment mechanism according to claim 1, wherein the pedestal is a dielectric pedestal or a metal pedestal coated with a dielectric thin film. 7. The mechanical detachment mechanism for a substrate according to claim 1, wherein the pin is disposed in the base at a position where the center of the substrate can be pushed up. Using a mechanical detachment mechanism of the board, which pushes up the board held on the base on the base with a pin, tilts the board diagonally, then lifts the edge of the board with a ring while lifting the board with the pin The desorption method that was. Using a mechanical detachment mechanism of the substrate, the substrate held on the base on the base is pushed up with a pin, the substrate is tilted obliquely, and then the edge of the substrate is lifted with a ring while fixing the pin Desorption method. 14. The method according to claim 12, wherein the substrate is pushed up by about 1 mm with a pin.

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