TWM653285U - Wafer separation equipment for semiconductor manufacturing processes - Google Patents

Abstract

A wafer separation device for semiconductor manufacturing process is used to separate a wafer from a temporary substrate, comprising a support platform for placing the temporary substrate and the wafer and a clamping unit. The clamping unit includes an annular clamping member defining a hollow area, and a holding member arranged on a surface of the annular clamping member opposite to the support platform. The annular clamping member has an annular platform formed downward from a surface opposite to the holding member, and the annular platform and the hollow area together define a receiving area for clamping the temporary substrate. In this case, the annular clamping member is used to clamp the temporary substrate so as to separate the temporary substrate from the wafer along a lateral thrust, and the temporary substrate is subjected to uniform force during the separation process, thereby reducing the probability of the temporary substrate being broken during the separation process.

Description

Wafer separation equipment for semiconductor manufacturing

The invention relates to a separation device, in particular to a wafer separation device used in semiconductor manufacturing process.

In the semiconductor manufacturing process, in order to ensure that the wafer has sufficient mechanical support or to avoid warping or deformation, the industry usually attaches a temporary substrate to the crystal surface of the wafer during the process to provide support, and then separates the temporary substrate from the wafer after the process is completed.

Referring to FIG. 1 , in the process of separating a wafer 101 from a temporary substrate 102, the wafer 101 to be separated is usually fixed on a chuck 103 by vacuum adsorption with a side opposite to the temporary substrate 102. Then, a vacuum fixed suction cup 104 is used to adsorb the temporary substrate 102, and a lateral thrust F is applied to the temporary substrate 102, so that the temporary substrate 102 is pushed out along the lateral thrust F and separated from the wafer 101.

However, the vacuum fixed suction cup 104 is only adsorbed on a part of the surface of the temporary substrate 102, which causes uneven force application when the lateral thrust F is applied to the temporary substrate 102, making the wafer 101 easily broken during the separation process, resulting in a decrease in the yield of wafer separation.

Therefore, the purpose of the present invention is to provide a wafer separation device used in a semiconductor process to improve the yield of the wafer separation process.

Therefore, the novel wafer separation device used in the semiconductor manufacturing process is used to separate a wafer bonded to a temporary substrate from the temporary substrate, and includes a carrying platform and a clamping unit.

The carrying platform has a carrying surface for placing the temporary substrate and the wafer to be separated, and a plurality of suction holes formed in the carrying surface.

The clamping unit includes an annular clamping member defining a hollow area, and a holding member, which is arranged on a surface of the annular clamping member opposite to the supporting platform. The annular clamping member has an annular platform formed downward from a surface opposite to the holding member, and the annular platform and the hollow area jointly define a accommodating area for clamping the temporary substrate.

The effect of the present invention is that the temporary substrate is clamped by the annular clamping member so that the temporary substrate can be separated from the wafer along a lateral thrust under uniform force, thereby reducing the probability of the temporary substrate being broken during the separation process, thereby improving the process yield.

Before the present invention is described in detail, it should be noted that similar components are represented by the same number in the following description. The relevant technical content, features and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the drawings. In addition, it should be noted that the drawings of the present invention only represent the relative relationship between the structure and/or position of the components, and are not related to the actual size of each component.

Referring to Figures 2 and 3, the novel wafer separation device used in the semiconductor process is used to separate a wafer 101 bonded to a temporary substrate 102 from the temporary substrate 102 (the wafer 201 and the temporary substrate 102). The substrate 202 is shown in Figures 5 and 6). The wafer separation device for semiconductor manufacturing includes a carrying platform 2 and a clamping unit 3 .

The support table 2 has a support surface 21 for placing the temporary substrate 202 and the wafer 201 to be separated, a plurality of suction holes 22 formed on the support surface 21, and two guide rails 23 spaced apart on the support surface 21 and extending in the same direction.

The suction holes 22 are distributed at intervals on the bearing surface 21 and are connected to the outside. In this embodiment, the suction holes 22 are arranged in an array and distributed on the bearing surface 21, but in actual implementation, this is not limited to this.

In other embodiments, the supporting platform 2 further has a plurality of grooves (not shown) formed downward from the supporting surface 21, and the suction holes 22 are distributed at the bottom or side walls of the grooves.

The two guide rails 23 are used to place the annular clamp 31 so that the annular clamp 31 can move along the direction of the two guide rails 23 . The spacing distance between the two guide rails 23 is not less than the maximum diameter of the wafer 101 and the temporary substrate 102 .

4 , the clamping unit 3 includes an annular clamping member 31 defining a hollow area 311 , and a gripping member 32 .

The holding part 32 is disposed on a surface of the annular holding part 31 opposite to the carrying platform 2 for an operator to hold. In this embodiment, the holding member 32 has two supporting sections 321 standing upright on opposite sides of the annular holding member 31 , an extending section 322 for connecting the supporting sections 321 , and a covered The heat insulation portion 323 is at least partially formed on the surface of the extension section 322 . The heat insulation part 323 is used to insulate the heat generated during the manufacturing process and is selected from Teflon.

It should be noted that the structural design of the holding member 32 can be varied according to the manufacturing process requirements. For example, the holding member 32 may not need to be provided with the heat insulation part 323, or may only have a single one directly connected to the annular clip. The extension section 322 of the holding member 31 is not limited to the above examples.

The annular clamping member 31 has an annular platform 312 formed downward from a surface opposite to the holding member 32. The annular platform 312 is located at the inner periphery of the annular clamping member 31, and together with the hollow area 311 defines a receiving area 313 for clamping the temporary substrate 102.

In some embodiments, the annular clamping member 31 and the holding member 32 are integrally formed.

Referring to Figures 2, 5 and 6, during use, the wafer 101 to be separated and the temporary substrate 102 are placed on the carrying surface 21 in the direction of the wafer 101 facing the carrying surface 21 and on the two sides. between the guide rails 23. Afterwards, air is pumped out through the suction holes 22 to create a negative pressure state between the suction holes 22 and the wafer 101 , so that the wafer 101 is fixed on the carrying surface 21 . Then, the annular clamping member 31 is placed on the two guide rails 23 with the annular platform 312 facing the temporary substrate 102 , so that the temporary substrate 102 is placed in the accommodating area 313 . Finally, the operator can apply a lateral thrust F through the holding member 32 along the extending direction of the two guide rails 23, so that the annular clamping member 31 moves along the two guide rails 23 to drive the accommodation area. The temporary substrate 102 clamped by 313 separates the temporary substrate 102 from the wafer 101 .

It should be noted that when the operator uses the clamping unit 3 to clamp the temporary substrate 102 to separate the temporary substrate 102 from the wafer 101 , according to the operator's operating habits, the holding member The extension direction of the extension section 322 of 32 can be orthogonal to the extension direction of the two guide rails 23 as shown in Figures 5 and 6, or it can have the same extension direction as the two guide rails 23 as shown in Figure 2, but not Not limited thereto, as long as the annular clamping member 31 is moved along the two guide rails 23 under the action of the lateral thrust F, so as to drive the clamped temporary substrate 102 to separate from the wafer 101. Can.

Compared with the existing wafer separation device that uses a vacuum fixed suction cup (see FIG. 1) to fix the temporary substrate 102, the force range of the temporary substrate 102 during the separation process is limited to a specific area, resulting in the problem of uneven force. The wafer separation device of this case uses the annular clamping member 31 to clamp the temporary substrate 102. The structural design of the annular clamping member 31 can disperse the applied lateral thrust F, so that the overall force of the temporary substrate 102 is more uniform, thereby avoiding the temporary substrate 102 from being broken due to uneven force during the separation process from the wafer 101.

To sum up, the novel wafer separation device for semiconductor processing uses the annular clamping member 31 to clamp the temporary substrate 102 so that the temporary substrate 102 can be separated along the lateral direction under a uniform force. The thrust force F separates the wafer 101 from the wafer 101, thereby reducing the probability of the temporary substrate 102 being broken during the separation process, thereby improving the process yield, so the purpose of the present invention can indeed be achieved.

However, the above are only examples of the present invention, and should not be used to limit the scope of the present invention. All simple equivalent changes and modifications made based on the patent scope of the present invention and the content of the patent specification are still within the scope of the present invention. Within the scope covered by this new patent.

101, 201: Wafer

102, 202: Temporary substrate

103: Carrier

104: Vacuum fixed suction cup

2: Carrier

21: Loading surface

22: Suction hole

23:Guide rail

3: Clamping unit

31: Ring clamp

311: Hollow Area

312: Ring Platform

313: Accommodation Area

32: Grip piece

321: Support section

322: Extension

323:Thermal insulation department

F: lateral thrust

Other features and functions of the present invention will be clearly presented in the implementation method with reference to the drawings, in which: FIG1 is a side view schematic diagram illustrating an existing wafer separation device; FIG2 is a top view schematic diagram illustrating an implementation example of the present invention for use in a semiconductor process wafer separation device; FIG3 is a three-dimensional schematic diagram illustrating the three-dimensional structure of the wafer separation device; FIG4 is a three-dimensional schematic diagram illustrating a clamping unit of the wafer separation device; and FIG5 and FIG6 are side cross-sectional schematic diagrams illustrating the use of the wafer separation device.

2: Carrier platform

21: Loading surface

22:Suction hole

23: Guide rail

3: Clamping unit

31: Ring clamp

311: Hollow area

312: Ring platform

313: Containment area

32: Grip

Claims (5)

A wafer separation device for semiconductor manufacturing process is used to separate a wafer bonded to a temporary substrate from the temporary substrate, comprising: a carrier having a carrier surface for placing the temporary substrate and the wafer to be separated, and a plurality of suction holes formed on the carrier surface; and a clamping unit, comprising an annular clamping member defining a hollow area, and a holding member, the holding member being arranged on a surface of the annular clamping member opposite to the carrier, the annular clamping member having an annular platform formed downward from a surface opposite to the holding member, the annular platform and the hollow area jointly defining a receiving area for clamping the temporary substrate. The wafer separation device for semiconductor manufacturing as claimed in claim 1, wherein the carrying platform also has two guide rails spaced apart from the carrying surface and extending in the same direction, and the two guide rails are used to place the annular The distance between the clamping members is not less than the maximum diameter of the wafer and the temporary substrate. The wafer separation device for semiconductor manufacturing process as described in claim 1, wherein the holding member has two supporting sections standing upright on the annular clamping member, and an extension section for connecting the supporting sections. The wafer separation device for semiconductor processing according to claim 3, wherein the holding member further has a heat insulation portion covering at least part of the surface of the extension section. The wafer separation device for semiconductor processing according to claim 1, wherein the holding member and the annular clamping member are integrally formed.

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