TWM565398U - Wafer fixing device, wafer fixing base and wafer vacuum chuck - Google Patents

Abstract

A wafer fixing device includes a wafer fixing base and a jack-up device. The wafer fixing base includes a spin shaft seat, a chuck seat and a wafer vacuum chuck. The chuck seat is disposed on the spin shaft seat. The wafer vacuum chuck is made of resilient material and is disposed on the chuck seat. The wafer vacuum chuck has a chuck body, an annular supporting flange and a vacuum slot. The annular supporting flange protrudes axially upward from a periphery of the chuck body. The vacuum slot is formed in a top surface of the chuck body and is surrounded by the annular supporting flange. The jack-up device is connected to the wafer fixing base and has at least one lifting pin. The annular supporting flange of the wafer vacuum chuck can hermetically contact and support a periphery of a wafer and thus prevent a bottom surface of the wafer from scraping.

Description

Wafer fixture, wafer mount pedestal, and wafer vacuum chuck

The present invention relates to a wafer base assembly, and more particularly to a wafer fixture and a fixed base and wafer vacuum chuck. The wafer fixture provides stable and continuous vacuum suction during the wafer debonding process to securely hold the wafer from accidental detachment of the wafer from the wafer fixture.

In the field of semiconductor wafer fabrication, the wafer debonding process is mainly to separate the wafer (Wafer) from the carrier so that the wafer can be subsequently processed. In the wafer debonding process, the mutually adhered wafers and carriers are fixed together on a wafer pedestal, and then subjected to Laser Debonding, Thermal Slide or mechanical force stripping. The adhesive between the wafer and the carrier is lost or damaged, and then the carrier is removed from above the wafer through the suction device. In the process of removing the carrier, if the wafer base is a general vacuum chuck or a Clamp Chuck, it is difficult to firmly fix the wafer to the base. Causes the wafer to slip or loose on the pedestal.

The creators of the present invention have created a wafer fixture, its fixed base and wafer vacuum in view of the problem that the wafer is easily accidentally loosened or slipped from the existing wafer pedestal, thereby improving its deficiencies and shortcomings. Suction cup.

The main purpose of the present invention is to provide a wafer fixture that provides stable and continuous vacuum suction to securely hold the wafer during the wafer debonding process, preventing the wafer from accidentally falling out of the wafer fixture.

To achieve the above objective, the novel wafer fixing device comprises: a wafer fixing base and a lifting device; wherein the wafer fixing base comprises a rotating shaft seat, a suction cup holder and a wafer vacuum chuck, a vacuum air hole is formed in the rotating shaft seat; the suction cup seat is fixedly disposed on the rotating shaft seat, and a vacuum air passage communicating with the vacuum air hole is formed in the suction cup base, and at least one is formed through the suction cup base The vacuum air passage is connected to the lower vacuum suction hole, and at least the through hole is formed through the suction cup holder; the wafer vacuum chuck is made of an elastic material and is fixedly disposed on the suction cup holder, the wafer vacuum suction cup Having a suction cup body, an annular support flange and a vacuum groove; at least one upper vacuum suction hole is formed in the suction cup body, the upper vacuum suction hole corresponding to the lower vacuum suction hole, and the suction cup body Further forming at least one upper through hole corresponding to the lower through hole; the annular support flange projecting upward from the peripheral edge of the suction cup body; An empty groove is formed on a top surface of the suction cup body, surrounded by the annular support flange, and communicates with the upper vacuum suction hole and the lower vacuum suction hole; and wherein the lifting device is connected to the wafer fixing base, And has a drive group a support arm, a support arm, and at least one thimble; the support arm is disposed on the drive assembly, and is driven by the drive assembly to move up and down relative to the wafer fixing base; the thimble is fixedly disposed on the support arm, so as to be The movable mode extends through the lower through hole and the upper through hole, and the top end of the thimble can be retracted downward into the vacuum groove or protrudes out of the vacuum groove.

By the above technical means, the novel wafer fixing device can be connected to a vacuum pump that provides vacuum suction to be capable of adsorbing and fixing the wafer. When the wafer debonding process is performed, a wafer adhered under a carrier is placed on the annular support flange of the wafer vacuum chuck, and vacuum suction is outputted into the vacuum chamber, and the wafer and the vacuum chamber are utilized. A vacuum chamber is formed between them to firmly adsorb the wafer, forcing the wafer to be tightly fixed to the wafer vacuum chuck. The wafer vacuum chuck is entirely made of an elastic material and can be moderately deformed under pressure. Since the wafer vacuum chuck only contacts the periphery of the bottom surface of the wafer with the annular support flange, the contact area is small, so that a large pressure can be generated at the contact portion and the top end of the annular support flange is deformed to be more airtight. The periphery of the bottom surface of the wafer, so that the annular support flange of the wafer vacuum chuck can contact the lower surface of the wafer in a good airtight manner to avoid a gap between the wafer and the annular support flange, thereby enabling When the wafer fixture outputs vacuum suction, the wafer and the carrier are firmly adsorbed, and the wafer is accidentally detached from the wafer fixture when the unbonding is performed. Especially when the bottom surface of the wafer has a pattern, or the wafer is a thin wafer, a warped wafer or a wafer having an uneven surface, the wafer vacuum chuck contacts the wafer only by the annular support flange. The periphery of the bottom surface can effectively prevent the wafer from being loosened from the wafer vacuum chuck.

In addition, since the wafer vacuum chuck only contacts the periphery of the bottom surface of the wafer with the annular support flange, instead of contacting the bottom surface of the wafer with a large area, the space of the vacuum chamber allows the bottom surface of the wafer to be suspended without being in contact with any object. Therefore, the bottom surface of the wafer can be prevented from being accidentally scratched or injured by an object. The problem of damage.

The elastic material of the wafer vacuum chuck is selected from the group consisting of natural rubber, elastomer, silicone, and mixtures thereof.

The plurality of lower vacuum suction holes are plural, and the plurality of vacuum suction holes are evenly distributed on the suction cup holder; the upper vacuum suction holes are plural, and the plurality of upper vacuum suction holes are evenly distributed on the wafer vacuum suction cup. .

The rotating shaft seat has a shaft and a fixing plate; the fixing plate is formed at a top end of the shaft; the vacuum air hole penetrates the shaft and the fixing plate.

The suction cup holder has a body and an air passage cover; the seat body is disposed on the fixing plate of the rotating shaft seat, the vacuum air passage is formed on the bottom surface of the suction cup base, and the vacuum air passage is airtightly and partially by the fixing plate Covering, the lower vacuum suction hole is formed in the seat body, the lower through hole is formed in the seat body; the air passage cover is disposed on the bottom surface of the suction cup seat and airtightly and partially covers the vacuum air passage, wherein the vacuum air passage is disposed The fixed plate and the airway cover completely cover the vacuum air passage in a gas-tight manner.

At least one plate through hole is formed through the fixing plate for the thimble to pass through.

The fixing plate is fixed to the seat body of the suction cup holder through a plurality of fixing members, and the air passage cover is fixed on the bottom surface of the seat body.

The vacuum gas prop of the seat body has an annular air passage and a plurality of radial air passages, the plurality of radial air passages are connected to the annular air passage, and are connected at a center of the seat body; the air passage cover has an annular cover plate and a plurality of radial directions a cover plate that hermetically covers the annular air passage, the plurality of radial cover plates projecting from the annular cover plate toward the center, and respectively airtightly and partially covering the outer portion of the plurality of radial air passages; The fixing plate of the rotating shaft seat airtightly and partially covers the complex The inner part of the radial airway.

Elastic contact pads are respectively disposed on the top ends of the ejector pins.

The elastic contact pad has a cylindrical shape.

The driving component is a pneumatic cylinder, and an operating rod is disposed on the pneumatic cylinder in a telescopic manner; the supporting arm is fixed on the operating rod.

Another object of the present invention is to provide a wafer fixing base, comprising: a rotating shaft seat, a vacuum air hole is formed in the rotating shaft seat; a suction cup seat fixedly disposed on the rotating shaft seat, and the suction cup base Forming a vacuum air passage communicating with the vacuum air hole, wherein at least one lower vacuum suction hole communicating with the vacuum air passage is formed in the suction cup base, and at least a through hole is formed through the suction cup seat; and The wafer vacuum chuck is made of an elastic material and is fixedly disposed on the chuck holder. The wafer vacuum chuck has a suction cup body, an annular support flange and a vacuum groove; at least one is formed through the suction cup body. a vacuum suction hole corresponding to the lower vacuum suction hole, wherein at least one upper through hole is formed through the suction cup body, the upper through hole corresponding to the lower through hole; the annular support flange Extending upwardly from the peripheral edge of the suction cup body; the vacuum groove is formed on the top surface of the suction cup body, surrounded by the annular support flange, and the upper vacuum suction hole and the lower vacuum suction Communicating.

The elastic material of the wafer vacuum chuck of the present invention is selected from the group consisting of natural rubber, artificial rubber, silicone, and mixtures thereof.

The vacuum suction hole of the present invention is plural, and the plurality of vacuum suction holes are evenly distributed on the suction cup holder; the upper vacuum suction holes are plural, and the plurality of upper vacuum suction holes are evenly distributed on the crystal Round vacuum suction cup.

The rotating shaft seat of the present invention has a shaft rod and a fixing plate; the fixing plate is formed at the top end of the shaft; the vacuum air hole penetrates the shaft rod and the fixing plate.

The suction cup holder of the present invention has a body and an air passage cover; the seat body is disposed on the fixing plate of the rotating shaft seat, the vacuum air passage is formed on the bottom surface of the suction cup base, and the vacuum air passage is airtightly fixed by the fixing plate And partially covering, the lower vacuum suction hole is formed in the seat body, and the lower through hole is also formed in the seat body; the air passage cover is disposed on the bottom surface of the suction cup seat and airtightly and partially covers the vacuum air passage Wherein the fixing plate and the airway cover completely cover the vacuum air passage in a gas-tight manner.

The fixing plate of the present invention is formed with at least one plate through hole for the thimble to pass through.

The fixing plate of the present invention is fixed to the seat body of the suction cup holder through a plurality of fixing members, and the air passage cover is fixed on the bottom surface of the seat body.

The vacuum gas prop of the seat body of the present invention has an annular air passage and a plurality of radial air passages, and the plurality of radial air passages communicate with the annular air passage and are connected at a center of the seat body; the air passage cover has an annular cover plate and a plurality of radial cover plates, the annular cover plate hermetically covers the annular air passage, the plurality of radial cover plates projecting from the annular cover plate toward the center, and respectively airtightly and partially covering the outer side of the plurality of radial air passages The fixing plate of the rotating shaft seat airtightly and partially covers the inner side portion of the plurality of radial air passages.

A further object of the present invention is to provide a wafer vacuum chuck which is made of an elastic material and includes: a suction cup body on which at least one upper vacuum is formed. a hole, and at least one upper through hole is formed in the suction cup body; an annular support flange protrudes upward from the peripheral edge of the suction cup body; and a vacuum groove is formed on the top surface of the suction cup body, Surrounded by the annular support flange and in communication with the upper vacuum suction hole.

1‧‧‧ wafer fixture

2‧‧‧Fabric fixed base

10‧‧‧Sucker seat

100‧‧‧vacuum airway

101‧‧‧ ring airway

103‧‧‧radial airway

11‧‧‧

110‧‧‧low through hole

112‧‧‧ Vacuum suction hole

15‧‧‧airway cover

151‧‧‧Ring cover

153‧‧‧radial cover

20‧‧‧Wafer vacuum chuck

200‧‧‧vacuum tank

21‧‧‧Sucker body

210‧‧‧Upper through hole

212‧‧‧Upper vacuum suction hole

23‧‧‧Ring support flange

30‧‧‧Rotary shaft seat

300‧‧‧vacuum pores

31‧‧‧ shaft

33‧‧‧ fixed plate

330‧‧‧ plate through hole

40‧‧‧ lifting device

41‧‧‧Drive components

42‧‧‧acting rod

43‧‧‧Support arm

45‧‧‧ thimble

451‧‧‧elastic contact pads

80‧‧‧ Vehicles

90‧‧‧ wafer

Figure 1 is a perspective view of the present invention.

Figure 2 is another perspective view of the present invention.

FIG. 3 is an enlarged perspective view of the suction cup holder and the wafer vacuum chuck of the present invention.

4 is another enlarged perspective view of the suction cup holder and the wafer vacuum chuck of the present invention.

Figure 5 is an enlarged perspective view of the drive assembly of the present invention.

Figure 6 is an exploded perspective view of the present invention omitting the drive assembly.

Fig. 7 is another perspective exploded view of the present invention omitting the drive assembly.

Figure 8 is an exploded perspective view of the suction cup holder of the present invention.

Figure 9 is a side cross-sectional view of the present invention.

Figure 10 is a partial enlarged side cross-sectional view of the present invention.

Figure 11 is a schematic side view of the operation of the present invention.

Figure 12 is a partially enlarged side cross-sectional view showing the operation of Figure 11 of the present invention.

Referring to FIG. 1 and FIG. 2 , the novel wafer fixing device 1 includes a wafer fixing base 2 and a lifting device 40 .

Referring to FIG. 6, the wafer fixing base 2 includes a rotating shaft base 30 and a suction cup base. 10 and a wafer vacuum chuck 20.

Referring to FIG. 7 and FIG. 9, the rotating shaft base 30 can be connected to an external motor and driven to rotate by the motor. A vacuum air hole 300 is formed in the rotating shaft base 30. Preferably, the rotating shaft seat 30 has a shaft 31 and a fixing plate 33. The fixing plate 33 is formed at the top end of the shaft 31. The vacuum air hole 300 penetrates the shaft 31 and the fixing plate 33. Preferably, at least one plate through hole 330 is formed in the fixing plate 33. Preferably, the fixing plate 33 is fixed to the seat body 11 of the suction cup holder 10 through a fixing member such as a plurality of bolts or rivets.

Referring to FIG. 4 and FIG. 8 , the suction cup holder 10 is fixedly disposed on the rotating shaft seat 30 . A vacuum air passage 100 communicating with the vacuum air hole 300 is formed in the suction cup base 10 . At least one lower vacuum suction hole 112 communicating with the vacuum air passage 100 is formed in the suction cup holder 10. At least a through hole 110 is formed in the suction cup holder 10 .

The chuck holder 10 can be made of stainless steel or polyetheretherketone (PEEK) to have both rigidity and corrosion resistance. The suction cup holder 10 has a body 11 and an air passage cover 15. The seat body 11 is disposed on the fixing plate 33 of the rotating shaft base 30. The vacuum air passage 100 is formed on the bottom surface of the suction cup base 10, and the vacuum air passage 100 is airtightly and partially covered by the fixing plate 33. The suction hole 112 is formed in the seat body 11 , and the lower through hole 110 is formed in the seat body 11 . Preferably, the lower vacuum suction holes 112 are plural, and the plurality of vacuum suction holes 112 are evenly distributed on the suction cup base 10. The air passage cover 15 is disposed on the bottom surface of the suction cup base 10 to hermetically and partially cover the vacuum air passage 100, and is fixed to the bottom surface of the base body 11 by the fixing plate 33. In addition, the fixing plate 33 and the airway cover 15 collectively and completely cover the vacuum air passage 100 in a gas-tight manner.

Preferably, the vacuum air passage 100 of the seat body 11 has an annular air passage 101 and a complex The plurality of radial air passages 103 communicate with the annular air passage 101 and are connected at the center of the seat body 11. The air passage cover 15 has an annular cover plate 151 and a plurality of radial cover plates 153. The annular cover plate 151 airtightly covers the annular air passage 101. The plurality of radial cover plates 153 protrude from the annular cover plate 151 toward the center. The outer side portion (the portion close to the annular cover plate 151) of the plurality of radial air passages 103 is hermetically and partially covered. The fixing plate 33 of the rotating shaft seat 30 airtightly and partially covers the inner side portion of the plurality of radial air passages 103 (near the center of the seat body 11).

Referring to FIG. 3, the wafer vacuum chuck 20 is made of an elastic material. Preferably, the elastic material of the wafer vacuum chuck 20 is selected from the group consisting of natural rubber, elastomer, silicone, and mixtures thereof, but Not limited to this. The wafer vacuum chuck 20 is fixedly disposed on the chuck holder 10. The wafer chuck 20 has a chuck body 21, an annular support flange 23, and a vacuum chamber 200. At least one upper vacuum suction hole 212 is formed in the suction cup body 21, and the upper vacuum suction hole 212 corresponds to the lower vacuum suction hole 112. Preferably, the upper vacuum suction holes 212 are plural, and the plurality of upper vacuum suction holes 212 are evenly distributed on the suction cup body 21 of the wafer vacuum chuck 20. At least one upper through hole 210 is formed in the suction cup body 21, and the upper through hole 210 corresponds to the lower through hole 110. The annular support flange 23 projects axially upward from the peripheral edge of the chuck body 21. The vacuum chamber 200 is formed on the top surface of the chuck body 21, surrounded by the annular support flange 23, and communicates with the upper vacuum suction hole 212 and the lower vacuum suction hole 112.

The lifting device 40 is connected to the wafer fixing base 2, and has a driving assembly 41, a supporting arm 43, and at least one thimble 45. The support arm 43 is disposed on the drive assembly 41 and is moved up and down relative to the wafer fixed base 2 by the drive assembly 41. The ejector pin 45 is fixedly disposed on the support arm 43 and movably penetrates the lower through hole 110 , the upper through hole 210 and the plate through hole 330 , and the top end of the thimble 45 can be retracted downwardly to the vacuum slot 200 . Extend inside or up It is outside the vacuum chamber 200. Preferably, the driving assembly 41 can be a pneumatic cylinder, and an operating rod 42 is telescopically disposed on the pneumatic cylinder; the supporting arm 43 is fixed to the operating rod 42. Preferably, a resilient contact pad 451 is respectively disposed on the top end of each of the thimbles 45. The elastic contact pad 451 is made of an elastic material. Preferably, the elastic material of the elastic contact pad 451 is selected from the group consisting of natural rubber, elastomer, silicone, and a mixture thereof, but is not limited thereto. The elastic contact pad 451 may have a cylindrical shape. Alternatively, the drive assembly 41 can be a stepper motor on which the actuating lever 42 is telescopically disposed.

The novel wafer fixing device 1 can be connected to a vacuum pump that provides vacuum suction to adsorb and fix the wafer to perform a wafer debonding process. The following description of the operation of the wafer fixing device 1 for performing the wafer debonding process is performed.

Referring to FIG. 9 and FIG. 10, when the wafer debonding process is performed, the wafer 90 under the carrier 80 is placed on the annular support flange 23 of the wafer vacuum chuck 20, and the vacuum pump outputs vacuum suction. In the vacuum chamber 200, the wafer 90 is firmly adsorbed by a vacuum chamber formed between the wafer 90 and the vacuum chamber 200, forcing the wafer 90 to be tightly fixed to the wafer vacuum chuck 20.

Referring to FIG. 11 , after the wafer 90 and the carrier 80 are adsorbed, the carrier 80 and the wafer 90 are separated by laser debonding, thermal slide or mechanical force stripping. And remove the carrier 80.

Referring to FIG. 12, after the carrier 80 is removed and the debonding process of the wafer 90 and the carrier 80 is completed, the vacuum pump stops outputting vacuum suction, and the ejector pin 45 is driven by the driving assembly 41 to protrude upward. The wafer 90 is ejected from the wafer vacuum chuck 20 out of the vacuum chamber 200 for additional robots to move the wafer 90 to another location for subsequent processing. this The novel wafer fixture 1 can also be applied to processes such as cleaning and etching that require the wafer 90 to be tightly fixed.

The novel wafer fixture 1 has at least the following advantages:

1. The wafer vacuum chuck 20 is entirely made of an elastic material and can be moderately deformed under pressure. Since the wafer vacuum chuck 20 only contacts the peripheral edge of the bottom surface of the wafer 90 with the annular support flange 23, the contact area is small, so that a large pressure can be generated at the contact portion and the top end of the annular support flange 23 is deformed. The inner peripheral edge of the wafer 90 is hermetically bonded, so that the annular support flange 23 of the wafer vacuum chuck 20 can contact the lower surface of the wafer 90 in a good airtight manner to avoid the wafer 90 and the annular support protrusion. A gap is formed between the edges 23, so that the wafer 90 and the carrier 80 can be firmly adsorbed when the wafer holding device 1 outputs vacuum suction, thereby preventing the wafer 90 from accidentally falling off from the wafer fixing device 1 when the debonding is performed. Especially when the bottom surface of the wafer 90 has a pattern, or the wafer 90 is a thin wafer, a warped wafer or a wafer having an uneven surface, the wafer vacuum chuck 20 only has the annular support flange 23 Contacting the periphery of the bottom surface of the wafer 90 can effectively prevent the wafer 90 from coming loose from the wafer vacuum chuck 20.

2. Since the wafer vacuum chuck 20 contacts the bottom surface of the wafer 90 only with the annular support flange 23, instead of contacting the bottom surface of the wafer 90 with a large area, the space of the vacuum chamber 200 allows the bottom surface of the wafer 90 to be suspended. Without contacting any object, the problem that the bottom surface of the wafer 90 is damaged by accidental scratching or crushing of the object can be avoided.

3. The thimble 45 can assist in moving the wafer 90 out of the vacuum chamber 200 of the wafer vacuum chuck 20 to facilitate subsequent processing of the wafer 90, and the elastic contact pad 451 of the thimble 45 can contact the wafer. 90 simultaneously avoids damage to the wafer 90.

Claims (20)

A wafer fixing device includes: a wafer fixing base and a lifting device; wherein the wafer fixing base comprises a rotating shaft seat, a suction cup holder and a wafer vacuum chuck, wherein the rotating shaft seat is formed through a vacuum air hole; the suction cup holder is fixedly disposed on the rotating shaft seat, and a vacuum air passage communicating with the vacuum air hole is formed in the suction cup base, and at least one vacuum communication passage is formed in the suction cup holder a vacuum suction hole is formed, and at least a through hole is formed through the suction cup holder; the wafer vacuum chuck is made of an elastic material and is fixedly disposed on the suction cup holder, the wafer vacuum suction cup has a suction cup body and a An annular support flange and a vacuum groove; at least one upper vacuum suction hole is formed in the suction cup body, the upper vacuum suction hole corresponding to the lower vacuum suction hole, and at least one upper surface is formed on the suction cup body a through hole corresponding to the lower through hole; the annular support flange protrudes upward from an axial direction of the suction cup body; the vacuum groove is formed on the top of the suction cup body Surrounding the annular support flange and communicating with the upper vacuum suction hole and the lower vacuum suction hole; and wherein the lifting device is connected to the wafer fixing base and has a driving assembly and a supporting arm And at least one thimble; the support arm is disposed on the driving component, and is driven to move up and down relative to the wafer fixing base by the driving component; the thimble is fixedly disposed on the supporting arm and is movablely extended through the The lower through hole and the upper through hole, the top end of the thimble can be retracted downward into the vacuum groove or protrude upwardly outside the vacuum groove. The wafer fixture of claim 1, wherein the elastic material of the wafer vacuum chuck is selected from the group consisting of natural rubber, elastomer, silicone, and mixtures thereof. The wafer fixing device of claim 1, wherein the lower vacuum suction holes are plural, and the plurality of vacuum suction holes are evenly distributed on the suction cup holder; the upper vacuum suction holes are plural, and the plurality of upper vacuum suction holes are Vacuum suction holes are evenly distributed on the wafer vacuum chuck. The wafer fixing device according to any one of claims 1 to 3, wherein the rotating shaft seat has a shaft and a fixing plate; the fixing plate is formed at a top end of the shaft; the vacuum air hole runs through the shaft and the Fixed plate. The wafer fixing device of claim 4, wherein the chuck holder has a body and an air passage cover; the seat body is disposed on the fixing plate of the rotating shaft seat, the vacuum air passage is formed on a bottom surface of the suction cup seat, and The vacuum air passage is hermetically and partially covered by the fixing plate, the lower vacuum suction hole is formed in the seat body, and the lower through hole is formed in the seat body; the air passage cover is disposed on the bottom surface of the suction cup seat and is gas The vacuum air passage is densely and partially covered, wherein the fixed plate and the air passage cover completely cover the vacuum air passage in a gas-tight manner. The wafer fixing device of claim 5, wherein the fixing plate is formed with at least one plate through hole for the thimble to pass through. The wafer fixing device of claim 6, wherein the fixing plate is fixed to the seat body of the suction cup holder through a plurality of fixing members, and the air passage cover is fixed on the bottom surface of the seat body. The wafer fixing device of claim 7, wherein the vacuum gas prop of the seat has an annular air passage and a plurality of radial air passages, the plurality of radial air passages communicating with the annular air passage and being connected at a center of the seat body The airway cover has an annular cover plate and a plurality of radial cover plates, the annular cover plate hermetically covers the annular air passage, and the plurality of radial cover plates protrude from the annular cover plate toward the center, respectively, and are airtight and partially Covering the outer portion of the plurality of radial air passages; the fixed plate of the rotating shaft seat airtightly and partially covers the inner side portion of the plurality of radial air passages. The wafer holder of any one of claims 1 to 3, wherein a resilient contact pad is disposed on each of the top ends of the pins. The wafer fixing device of claim 9, wherein the elastic contact pad has a cylindrical shape. The wafer fixture of any one of claims 1 to 3, wherein the drive assembly is a a pneumatic cylinder on which an actuating lever is telescopically disposed; the support arm is fixed to the actuating lever. A wafer fixing base comprises: a rotating shaft seat, a vacuum air hole is formed in the rotating shaft seat; a suction cup seat is fixedly disposed on the rotating shaft seat, and a vacuum air hole is formed in the suction cup base a vacuum air passage connected to the suction cup seat, at least one lower vacuum suction hole communicating with the vacuum air passage is formed, and at least a through hole is formed in the suction cup seat; and a wafer vacuum chuck is used for elasticity The material is manufactured and fixedly disposed on the chuck holder, the wafer vacuum chuck has a suction cup body, an annular support flange and a vacuum groove; at least one upper vacuum suction hole is formed in the suction cup body, the upper portion a vacuum suction hole corresponding to the lower vacuum suction hole, wherein at least one upper through hole is formed through the suction cup body, the upper through hole corresponding to the lower through hole; the annular support flange is from the peripheral axis of the suction cup body The vacuum groove is formed on the top surface of the suction cup body, surrounded by the annular support flange, and communicates with the upper vacuum suction hole and the lower vacuum suction hole. The wafer fixing base of claim 12, wherein the elastic material of the wafer vacuum chuck is selected from the group consisting of natural rubber, elastomer, silicone, and mixtures thereof. The wafer fixing base according to claim 12, wherein the lower vacuum suction holes are plural, and the plurality of vacuum suction holes are evenly distributed on the suction cup holder; the upper vacuum suction holes are plural, and the plurality The upper vacuum suction holes are evenly distributed on the wafer vacuum chuck. The wafer fixing base according to any one of claims 12 to 14, wherein the rotating shaft seat has a shaft and a fixing plate; the fixing plate is formed at a top end of the shaft; the vacuum air hole runs through the shaft and The fixing plate. The wafer fixing base according to claim 15, wherein the suction cup holder has a body and an air passage cover; the seat body is disposed on the fixing plate of the rotating shaft seat, and the vacuum air passage is formed at the suction a bottom surface of the disk holder, and the vacuum air passage is airtightly and partially covered by the fixing plate, the lower vacuum suction hole is formed in the seat body, and the lower through hole is formed in the seat body; the air passage cover is disposed on the suction cup The vacuum air passage is airtightly and partially covered on the bottom surface of the seat, wherein the fixed plate and the air passage cover completely cover the vacuum air passage in a gas-tight manner. The wafer fixing base according to claim 16, wherein the fixing plate is formed with at least one plate through hole. The wafer fixing base according to claim 17, wherein the fixing plate is fixed to the seat body of the suction cup holder through a plurality of fixing members, and the air passage cover is fixed on the bottom surface of the seat body. The wafer fixing base of claim 18, wherein the vacuum gas prop of the base has an annular air passage and a plurality of radial air passages, the plurality of radial air passages communicating with the annular air passage, and at a center of the seat body The airway cover has an annular cover plate and a plurality of radial cover plates, the annular cover plate hermetically covers the annular air passage, and the plurality of radial cover plates protrude from the annular cover plate toward the center, respectively, and are airtight and The outer portion of the plurality of radial air passages is partially covered; the fixed plate of the rotating shaft seat airtightly and partially covers the inner side portion of the plurality of radial air passages. A wafer vacuum chuck, which is made of an elastic material, and includes: a suction cup body, at least one upper vacuum suction hole is formed in the suction cup body, and at least one upper through hole is formed through the suction cup body; a support flange projecting upwardly from the peripheral edge of the suction cup body; and a vacuum groove formed on the top surface of the suction cup body surrounded by the annular support flange and communicating with the upper vacuum suction hole.