CN111799213A - Wafer conveying device and PVD (physical vapor deposition) machine - Google Patents
Wafer conveying device and PVD (physical vapor deposition) machine Download PDFInfo
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- CN111799213A CN111799213A CN202010717946.5A CN202010717946A CN111799213A CN 111799213 A CN111799213 A CN 111799213A CN 202010717946 A CN202010717946 A CN 202010717946A CN 111799213 A CN111799213 A CN 111799213A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a wafer conveying device and a PVD machine, wherein the wafer conveying device comprises a base, a lifting ring and a positioning pin assembly, the positioning pin assembly is provided with a first axis, and the base and the lifting ring are arranged at intervals along the direction of the first axis; the positioning pin assembly comprises a positioning pin, a fixing piece, a bolt, a positioning hole and a tool hole, the positioning hole and the tool hole are respectively arranged on the base in a penetrating manner along the direction of the first axis, the positioning pin extends along the first axis and is detachably connected with the lifting ring through the fixing piece and the bolt, and the positioning pin is movably arranged in the positioning hole in a penetrating manner; the axis of the bolt is not coincident with the first axis, and the axis of the bolt is within the confines of the tool bore. The dismounting tool extends into the tool hole and is detachably connected with the bolt, and the dismounting tool is rotated to drive the bolt to be unscrewed or screwed so as to lock the positioning pin and the lifting ring or release the locking of the positioning pin and the lifting ring.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a wafer conveying device and a PVD (physical vapor deposition) machine.
Background
In a chamber for conveying and cooling a wafer in a semiconductor device, particles are accumulated below a susceptor of the chamber due to peeling of a wafer product in a long-term running process, and when a wafer processing operation is performed, the pressure in the chamber reaches 3Torr, causing the particles to be raised, so that the wafer is damaged due to impact, and the chamber needs to be cleaned and maintained regularly to reduce the particles accumulated below the susceptor. At present, when a cavity is maintained and cleaned, a positioning pin detachably connected with a lifting ring in semiconductor equipment needs to be detached at first.
Fig. 1 shows a wafer conveying device, which includes a base 01, a lifting ring 02, a positioning pin 03, a fixing member 04, and a bolt 05, wherein the base 01 has a positioning hole 06 through which the positioning pin 03 passes, one end of the positioning pin 03 is detachably connected to the lifting ring 02 through the bolt 05 and the fixing member 04, and the other end of the positioning pin is passed through the positioning hole 06. The space between the base 01 and the lifting ring 02 is narrow, the operation of disassembling and assembling the positioning pin 03 is difficult, the positioning pin 03 is generally a ceramic piece, the diameter is small (generally 5mm), and the positioning pin is easy to damage in the disassembling process. Therefore, when cleaning and maintaining a chamber for transferring and cooling a wafer in a semiconductor device, how to disassemble and assemble the positioning pins to minimize the damage risk of the positioning pins is a problem to be solved.
Disclosure of Invention
The invention aims to provide a wafer conveying device and a PVD (physical vapor deposition) machine to solve the problem that a positioning pin is easy to damage when being assembled and disassembled.
In order to solve the above technical problem, according to one aspect of the present invention, there is provided a wafer transfer apparatus including a base, a lift ring, and a dowel assembly having a first axis, the base and the lift ring being spaced apart in a direction of the first axis; the positioning pin assembly comprises a positioning pin, a fixing piece, a bolt, a positioning hole and a tool hole, the positioning hole and the tool hole are respectively arranged on the base in a penetrating manner along the direction of the first axis, the positioning pin extends along the first axis and is detachably connected with the lifting ring through the fixing piece and the bolt, and the positioning pin is movably arranged in the positioning hole in a penetrating manner; the axis of the bolt is not coincident with the first axis, and the axis of the bolt is within the confines of the tool bore.
Optionally, the wafer transfer device comprises at least three of the dowel assemblies, the first axes of the at least three dowel assemblies being parallel to each other; the base has a second axis parallel to the first axis; at least three of the dowel assemblies are circumferentially distributed about the second axis.
Optionally, the locating pin assembly includes at least two bolts and at least two tool holes, the number of the tool holes is not less than the number of the bolts, and the axis of each bolt is at least within the range of one tool hole.
Optionally, in any of the dowel assemblies, at least two of the tool holes are equidistant from the pilot hole.
Optionally, the axis of the bolt coincides with the axis of the corresponding tool hole.
Optionally, the locating pin assembly comprises two bolts and two tool holes, and each bolt corresponds to one tool hole; all the tool holes and the positioning holes are positioned on the same circumference with the second axis as the center.
Optionally, the wafer conveying device further includes a limiting assembly, the limiting assembly includes a limiting hole and a limiting rod, and the limiting hole is arranged on the base in a penetrating manner along the direction of the first axis; the limiting rod is arranged along the direction of the first axis and comprises a rod body and a limiting head, and the rod body movably penetrates through the limiting hole and is connected with the lifting ring; the limiting head is connected with one side, away from the lifting ring, of the rod body on the base, and the limiting head is used for abutting against the base so as to limit the displacement of the lifting ring away from the base along the direction of the first axis.
Optionally, a distance between the limiting hole and the second axis is greater than a distance between the positioning hole and the second axis.
Optionally, the wafer transfer device includes at least two of the position limiting assemblies.
According to another aspect of the present invention, there is also provided a PVD tool comprising the wafer transfer apparatus as described above.
In summary, in the wafer transferring apparatus and the PVD machine provided in the present invention, the wafer transferring apparatus includes a base, a lift ring, and a dowel assembly having a first axis, wherein the base and the lift ring are disposed at an interval along the first axis; the positioning pin assembly comprises a positioning pin, a fixing piece, a bolt, a positioning hole and a tool hole, the positioning hole and the tool hole are respectively arranged on the base in a penetrating manner along the direction of the first axis, the positioning pin extends along the first axis and is detachably connected with the lifting ring through the fixing piece and the bolt, and the positioning pin is movably arranged in the positioning hole in a penetrating manner; the axis of the bolt is not coincident with the first axis, and the axis of the bolt is within the confines of the tool bore. Through having link up the axis that sets up on the base and the bolt in the within range of instrument hole with the direction of first axis with the instrument hole, can stretch into the assembly and disassembly tools instrument hole and can dismantle with the bolt and be connected, rotatory assembly and disassembly tools drives the bolt and unscrews or screws to locking locating pin and lift ring or removing the locking of the two. Furthermore, when the locking between the positioning pin and the lifting ring is released, the positioning pin can be removed by withdrawing the positioning pin from the fixing piece. The wafer conveying device is simple in structure, and can effectively improve the assembling and disassembling efficiency of the positioning pin and reduce the damage risk of the positioning pin.
Drawings
It will be appreciated by those skilled in the art that the drawings are provided for a better understanding of the invention and do not constitute any limitation to the scope of the invention. Wherein:
FIG. 1 is a schematic view of a wafer transfer apparatus;
FIG. 2 is a side view of a wafer transfer device according to one embodiment of the present invention;
FIG. 3 is a schematic top view of a base according to an embodiment of the invention;
fig. 4 is a schematic view of a detachable positioning pin according to an embodiment of the present invention.
In the drawings:
01-a base; 02-lifting ring; 03-positioning pin; 04-a fixing piece; 05-bolt; 06-positioning holes;
10-a base; 20-a lifting ring; 30-a dowel assembly; 31-a locating pin; 32-a fastener; 33-bolts; 331-screw rod; 332-bolt head; 34-positioning holes; 35-a tool hole;
40-a spacing assembly; 41-limiting holes; 42-a limiting rod; 421-a rod body; 422-a limiting head;
50-a condenser tube; 60-sealing ring; 70-disassembling tool.
Detailed Description
To further clarify the objects, advantages and features of the present invention, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It is to be noted that the drawings are in greatly simplified form and are not to scale, but are merely intended to facilitate and clarify the explanation of the embodiments of the present invention. Further, the structures illustrated in the drawings are often part of actual structures. In particular, the drawings may have different emphasis points and may sometimes be scaled differently.
As used in this application, the singular forms "a", "an" and "the" include plural referents, the term "or" is generally employed in a sense including "and/or," the terms "a" and "an" are generally employed in a sense including "at least one," the terms "at least two" are generally employed in a sense including "two or more," and the terms "first", "second" and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, features defined as "first," "second," and "third" may explicitly or implicitly include one or at least two of the features unless the content clearly dictates otherwise.
The invention provides a wafer conveying device and a PVD (physical vapor deposition) machine, which aim to solve the problem that a positioning pin is easy to damage when being assembled and disassembled.
The following description refers to the accompanying drawings.
Referring to fig. 2 to 4, fig. 2 is a schematic side view of a wafer transfer device according to an embodiment of the invention, fig. 3 is a schematic top view of a base according to an embodiment of the invention, and fig. 4 is a schematic top view of a detachable positioning pin according to an embodiment of the invention.
As shown in fig. 2 and 3, the present embodiment provides a wafer conveying apparatus, which includes a base 10, a lift ring 20, and a positioning pin assembly 30, wherein the positioning pin assembly 30 has a first axis, and the base 10 and the lift ring 20 are disposed at an interval along the direction of the first axis; the positioning pin assembly 30 includes a positioning pin 31, a fixing member 32, a bolt 33, a positioning hole 34 and a tool hole 35, the positioning hole 34 and the tool hole 35 are respectively opened on the base 10 in a penetrating manner along the direction of the first axis, the positioning pin 31 extends along the first axis and is detachably connected with the lifting ring 20 through the fixing member 32 and the bolt 33, and the positioning pin 31 is movably inserted into the positioning hole 34; the axis of the bolt 33 is not coincident with the first axis, and the axis of the bolt 33 is within the confines of the tool bore 35. In an exemplary embodiment, the first axis is oriented perpendicular to the base 10, specifically in the direction perpendicular to the plane of the paper in fig. 2, and in the direction perpendicular to the plane of the paper in fig. 3; the axis of the bolt 33 is not coincident with the first axis, so that the positioning hole 34 is prevented from being coincident with the tool hole 35 or the positioning hole 34 is prevented from being combined with the tool hole 35, and the positioning pin 31 is not convenient to disassemble and assemble. It should be understood that the axis of the bolt 33 includes its extension. It should be noted that the misalignment of the axis of the bolt 33 with the first axis includes, but is not limited to, the axis of the bolt 33 being parallel to the first axis, such as the axis of the bolt 33 being out of plane with the first axis or the axis of the bolt 33 being coplanar with and intersecting the first axis, and in another exemplary embodiment, the first axis is perpendicular to the base 10, the axis of the bolt 33 is disposed at an angle to the base 10, i.e., the bolt 33 is not perpendicularly attached to the lift ring 20, the axis of the bolt 33 is within the range of the tool hole 35, and it may be preferable that the tool hole 35 is open through the base 10 at a corresponding angle to the base 10. Further, the first axis is not limited to being perpendicular to the base 10, but may be arranged at an angle to the base 10.
The wafer transferring apparatus is configured such that the tool hole 35 is opened on the base 10 along the first axis and the axis of the bolt 33 is within the range of the tool hole 35, so that an assembling and disassembling tool (such as a hexagon socket wrench, a screwdriver, etc.) can be inserted into the tool hole 35 and detachably connected to the bolt 33, and the assembling and disassembling tool is rotated to drive the bolt 33 to loosen or tighten, so as to lock or unlock the positioning pin 31 and the lifting ring 20. Further, when the lock between the positioning pin 31 and the lifting ring 20 is released, the positioning pin 31 can be removed by withdrawing the positioning pin 31 from the fixing member 32.
Preferably, the positioning pins 31 are made of a ceramic material to avoid the wafer from being affected when the wafer is carried by the positioning pins 31, so that the wafer is not defective.
Optionally, referring to fig. 2, the positioning pin 31 is inverted "T", a "one" of the "T" is disposed in the lifting ring 20, a "|" of the "T" is movably inserted into the positioning hole 34 and coincides with the first axis, the fixing member 32 is sleeved on the "|", and the "one" of the "T" is pressed on the lifting ring; a bolt 33 passes through the fixing member 32 in the direction of the first axis and is threadedly coupled to the lifting ring 20 to lock the positioning pin 31 with the lifting ring 20.
Further, the wafer transfer device comprises at least three of the positioning pin assemblies 30, first axes of the at least three positioning pin assemblies 30 are parallel to each other, the susceptor 10 has a second axis parallel to the first axes, and the second axis coincides with a central axis of the susceptor 10; at least three of the dowel assemblies 30 are circumferentially distributed about the second axis, i.e., the first axis of each of the at least three dowel assemblies 30 is located about a circumference of the second axis. Preferably, the first axis of each dowel assembly 30 is evenly distributed about a circumference of the second axis, i.e., at least three dowel assemblies 30 are evenly distributed circumferentially about the second axis. At least three of the positioning pin assemblies 30 include at least three positioning pins 31, which can increase the stability of the wafer carried by the positioning pins 31.
In an exemplary embodiment, the base 10 is a circular plate, and the lifting ring 20 is disposed under the base 10 in a direction perpendicular to the second axis, i.e., the lifting ring 20 is disposed coaxially with the base 10.
Still further, the locating pin assembly 30 includes at least two of the bolts 33 and at least two of the tool holes 35, the number of the tool holes 35 is not less than the number of the bolts 33, and the axis of each of the bolts 33 is at least within the range of one of the tool holes 35. So configured, it is possible to realize one tool hole per bolt 33, so as to facilitate the removal of each bolt 33. Preferably, the number of tool holes 35 is equal to the number of bolts 33, one bolt 33 for each tool hole 35.
Referring to fig. 2 and 4, it is preferable that the axis of the bolt 33 coincides with the axis of the corresponding tool hole 35, and the tool hole 35 corresponding to the bolt 33 is the tool hole 35 in the range where the axis of the bolt 33 is located. This arrangement is provided to facilitate quick and accurate abutment of the removal tool 70 with the bolt 33 to unscrew or tighten the bolt 33.
Preferably, in any one of the positioning pin assemblies 30, at least two of the tool holes 35 are equidistant from the positioning hole 34, i.e., the axis of each tool hole 35 is equidistant from the axis of the positioning hole 34. The distance between the tool hole 35 and the positioning hole 34 is the distance between the axes thereof. Preferably, when there are two tool holes 35, the two tool holes 35 and the pilot hole 34 are equal to each other to the second axis; when the tool holes 35 are at least three, the axes of at least three of the tool holes 35 may be circumferentially distributed about the axis of the pilot hole 34, and preferably two of the tool holes 35 and the pilot hole 34 are circumferentially distributed about the second axis.
Optionally, the locating pin assembly 30 includes two of the bolts 33 and two of the tool holes 35, one of the tool holes 35 for each of the bolts 33; all the tool holes 35 and the positioning holes 34 are located on the same circumference centered on the second axis. Each of the locating pins 30 shown in fig. 2 has two tool holes 35 and one locating hole 34, and when the wafer handling device has three locating pin assemblies 30, as shown in fig. 3, the six tool holes 35 and the three locating holes 34 are all equidistant from the second axis.
In one example, the pilot hole 34 and the tool hole 35 are 12cm apart from the second axis, the tool hole has a diameter of 1cm, and the axis of each tool hole 35 is 1cm apart from the axis of the pilot hole 34 in each of the pilot pin assemblies 30. Generally, the diameter of the positioning pin 31 is 5mm, and the diameter of the positioning hole 34 is not less than 5mm, so that the positioning pin 31 is movably inserted into the positioning hole 34.
Referring to fig. 4, the disassembling tool 70 is inserted into the tool hole 35 and detachably connected to the bolt 33, and the bolt 33 is driven to be unscrewed or screwed by rotating the disassembling tool 70, so as to lock or unlock the positioning pin 31 and the lifting ring 20. When the lock between the positioning pin 31 and the lifting ring 20 is released, the positioning pin 31 can be removed by withdrawing the positioning pin 31 from the fixing member 32. Preferably, when the dismounting tool 70 abuts against the bolt 33, the dismounting tool 70 protrudes out of the surface of the base 10, that is, the length of the dismounting tool 70 along the first axis is greater than the length of the positioning pin 31, so that a user can rotate the dismounting tool 70 conveniently, and other instruments (such as a wrench) can be avoided from being used for connecting the dismounting tool 70 and driving the dismounting tool to rotate; the disassembling tool 70 is in clearance fit with the tool hole 35, that is, a clearance is formed between the disassembling tool 70 and the tool hole 35, so that friction between the disassembling tool 70 and the tool hole 35 in the disassembling process can be reduced.
With continuing reference to fig. 4 in conjunction with fig. 2, the bolt 33 includes a bolt head 332 and a threaded rod 331, and the threaded rod 331 passes through the fixing member 32 and is in threaded connection with the lifting ring 20; the bolt head 332 is used to abut against the fixing member 32 to lock the positioning pin 31 and the lifting ring 20. The bolt head 332 includes a polygonal blind hole, or the bolt head 332 includes a polygonal prism. So configured, the bolt head 332 is adapted to the disassembling tool 70, so as to facilitate disassembling the bolt 33 by different disassembling tools 70. Specifically, for example, the bolt head 332 has a polygonal blind hole, and the dismounting tool 70 has a polygonal prism matched with the blind hole; the bolt head 332 has a polygonal prism and the picking tool 70 has a blind hole adapted to the prism, or the picking tool 70 has a through hole adapted to the prism and penetrating the picking tool 70 in the direction of the first axis. It should be noted that the way that the bolt head 332 is adapted to the dismounting tool 70 includes, but is not limited to, the prism being the same as the polygon of the blind hole, for example, the blind hole is hexagonal, the prism is triangular, the prism in the triangle can be clipped into the blind hole in the hexagon, and it can also be understood that the bolt head 332 is adapted to the dismounting tool 70. Of course, the blind holes can be configured into a quincunx shape, a triangular shape, a cross shape or a straight shape according to the prior art.
Preferably, the dismounting tool 70 is an allen key, and the bolt head 332 has a hexagonal blind hole matching with the allen key. The allen key also is called allen key, and its shape is "L" type, and when allen key card gone into the hexagon blind hole rather than the looks adaptation, the effort to bolt 33 was applyed through the moment of torsion, can greatly reduce user's strength of exerting oneself, makes things convenient for bolt 33 to screw in or screw out lifting ring 20. In some other embodiments, the disassembly tool 70 may also be a wrench shaped as a "T" or "Y".
Optionally, referring to fig. 2, the wafer transferring apparatus further includes a limiting component 40, the limiting component 40 includes a limiting hole 41 and a limiting rod 42, the limiting hole 41 is opened on the base 10 along the first axis; the limiting rod 42 is arranged along the direction of the first axis, the limiting rod 42 comprises a rod body 421 and a limiting head 422, and the rod body 421 movably penetrates through the limiting hole 41 and is connected with the lifting ring 20; the limiting head 422 is connected to the rod 421 on a side of the base 10 away from the lifting ring 20, and the limiting head 422 is used to abut against the base 10 to limit the displacement of the lifting ring 20 away from the base 10 along the direction of the first axis. By providing the limiting assembly 40, the positioning pin 31 can be prevented from being withdrawn from the positioning hole 34 due to the lifting ring 20 being lowered by a too large distance in the direction of the first axis. Generally, the length of the stop rod 42 is slightly greater than the length of the positioning pin 31. Preferably, the rod 421 is detachably connected to the lifting ring, and the rod portion near the limiting head 422 is smoothly inserted into the limiting hole 41 to reduce friction between the rod 421 and the limiting hole 41. In addition, when the positioning pin 31 is removed, the rod 421 needs to be withdrawn from the lifting ring 20 first, so that the lifting ring 20 descends a certain distance to withdraw the positioning pin 31 from the fixing member 32.
In an exemplary embodiment, the limiting rod 42 may be a screw, the bottom of the screw is threaded on the lifting ring, the portion of the screw passing through the limiting hole 41 is smooth and has no thread, and the head of the screw is the limiting head 422. In another exemplary embodiment, the stop rod 42 is "T" shaped, and preferably, the stop rod 42 is made of Teflon. Teflon, polytetrafluoroethylene, has a low friction coefficient, and can effectively reduce the friction between the rod 421 and the limiting hole 41. In the wafer processing process, particles are accumulated below the susceptor due to the peeling of the wafer, and the teflon has good non-adhesion property, so that the particles can be prevented from being attached to the limiting rod 42.
Further, the distance between the limiting hole 41 and the second axis is greater than the distance between the positioning hole 34 and the second axis. The arrangement is such that the distance from the position-limiting rod 42 to the second axis is greater than the distance from the positioning pin 31 to the second axis, so as to prevent the wafer from contacting the position-limiting rod 42 when the wafer is carried by the positioning pin 31.
Further, referring to fig. 3 in combination with fig. 2, the wafer transferring apparatus includes at least two limiting assemblies 40, that is, at least two limiting holes 41 (three limiting holes are shown in fig. 3) are formed through the base 10 along the first axis, and the number of the limiting holes 41 is not less than the number of the limiting rods 42, preferably, the number of the limiting holes 41 is equal to the number of the limiting rods 42 and corresponds to one. In addition, the distance between the at least two limiting holes 41 and the second axis is greater than the distance between the positioning hole 34 and the second axis.
Optionally, the wafer transferring apparatus further comprises a condensation duct 50, the condensation duct 50 is disposed on the susceptor 10 along a circumferential direction of the susceptor 10, and the condensation duct 50 surrounds at least 4/5 circumferences of the susceptor 10. The condensation pipe 50 is used for introducing cooling gas to cool the wafer carried on the positioning pin 31, and the condensation pipe 50 at least surrounds 4/5 circumferences of the susceptor 10, so that an effective area for cooling the wafer can be increased. Preferably, referring to fig. 3, the condensation duct 50 is arranged in a "C" shape around the second axis.
Optionally, the wafer transferring apparatus further comprises a sealing ring 60, wherein the sealing ring 60 is disposed on the susceptor 10 and is used to surround the condensation pipe 50. The packing 60 prevents the cooling gas introduced into the condensation duct 50 from leaking. Preferably, referring to FIG. 3, the seal ring 60 is disposed in an "O" shape about the second axis.
The embodiment also provides a PVD tool comprising the wafer transfer device. Since the PVD tool includes the wafer transfer apparatus as described above, the PVD tool also has the advantages of the wafer transfer apparatus. Other components and structures of the PVD tool can be arranged by those skilled in the art, and the arrangement principle and other components of the PVD tool are not described in detail here.
In summary, in the wafer transferring apparatus and the PVD machine provided in the present invention, the wafer transferring apparatus includes a base, a lift ring, and a dowel assembly having a first axis, wherein the base and the lift ring are disposed at an interval along the first axis; the positioning pin assembly comprises a positioning pin, a fixing piece, a bolt, a positioning hole and a tool hole, the positioning hole and the tool hole are respectively arranged on the base in a penetrating manner along the direction of the first axis, the positioning pin extends along the first axis and is detachably connected with the lifting ring through the fixing piece and the bolt, and the positioning pin is movably arranged in the positioning hole in a penetrating manner; the axis of the bolt is not coincident with the first axis, and the axis of the bolt is within the confines of the tool bore. Through having link up the axis that sets up on the base and the bolt in the within range of instrument hole with the direction of first axis with the instrument hole, can stretch into the assembly and disassembly tools instrument hole and can dismantle with the bolt and be connected, rotatory assembly and disassembly tools drives the bolt and unscrews or screws to locking locating pin and lift ring or removing the locking of the two. Furthermore, when the locking between the positioning pin and the lifting ring is released, the positioning pin can be removed by withdrawing the positioning pin from the fixing piece. The wafer conveying device is simple in structure, and can effectively improve the assembling and disassembling efficiency of the positioning pin and reduce the damage risk of the positioning pin.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (10)
1. A wafer transfer apparatus, comprising: the lifting mechanism comprises a base, a lifting ring and a positioning pin assembly, wherein the positioning pin assembly is provided with a first axis, and the base and the lifting ring are arranged at intervals along the direction of the first axis; the positioning pin assembly comprises a positioning pin, a fixing piece, a bolt, a positioning hole and a tool hole, the positioning hole and the tool hole are respectively arranged on the base in a penetrating manner along the direction of the first axis, the positioning pin extends along the first axis and is detachably connected with the lifting ring through the fixing piece and the bolt, and the positioning pin is movably arranged in the positioning hole in a penetrating manner; the axis of the bolt is not coincident with the first axis, and the axis of the bolt is within the confines of the tool bore.
2. The wafer transfer device of claim 1, wherein the wafer transfer device includes at least three of the dowel assemblies, the first axes of the at least three dowel assemblies being parallel to each other; the base has a second axis parallel to the first axis; at least three of the dowel assemblies are circumferentially distributed about the second axis.
3. The wafer transfer device of claim 2, wherein the dowel assembly includes at least two of the bolts and at least two of the tool holes, the number of the tool holes being not less than the number of the bolts, and an axis of each of the bolts being at least within a range of one of the tool holes.
4. The wafer transfer device of claim 2, wherein at least two of said tool holes are equidistant from said pilot hole in any of said dowel assemblies.
5. The wafer transfer device of claim 3, wherein an axis of the bolt coincides with an axis of the corresponding tool hole.
6. The wafer transfer device of claim 3, wherein said dowel assembly includes two said bolts and two said tool holes, one for each said bolt; all the tool holes and the positioning holes are positioned on the same circumference with the second axis as the center.
7. The wafer conveying device according to claim 2, further comprising a limiting component, wherein the limiting component comprises a limiting hole and a limiting rod, and the limiting hole is arranged on the pedestal in a penetrating manner along the direction of the first axis; the limiting rod is arranged along the direction of the first axis and comprises a rod body and a limiting head, and the rod body movably penetrates through the limiting hole and is connected with the lifting ring; the limiting head is connected with one side, away from the lifting ring, of the rod body on the base, and the limiting head is used for abutting against the base so as to limit the displacement of the lifting ring away from the base along the direction of the first axis.
8. The wafer conveying device according to claim 7, wherein the distance between the position-limiting hole and the second axis is greater than the distance between the position-limiting hole and the second axis.
9. The wafer transfer device of claim 7, wherein the wafer transfer device comprises at least two of the retaining assemblies.
10. A PVD tool comprising the wafer transfer apparatus of any of claims 1-9.
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| CN202010717946.5A CN111799213B (en) | 2020-07-23 | 2020-07-23 | Wafer conveying device and PVD (physical vapor deposition) machine |
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| CN202010717946.5A CN111799213B (en) | 2020-07-23 | 2020-07-23 | Wafer conveying device and PVD (physical vapor deposition) machine |
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| CN111799213B CN111799213B (en) | 2022-08-05 |
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| CN111799213B (en) | 2022-08-05 |
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