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Priority to JP1980001166UpriorityCriticalpatent/JPS6119483Y2/ja
Publication of JPS56104134UpublicationCriticalpatent/JPS56104134U/ja
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Publication of JPS6119483Y2publicationCriticalpatent/JPS6119483Y2/ja
Process for the double-sided exposure of a semiconductor or substrate plates, especially wafers, as well as apparatus for the purpose of parallel and rotational alignment of such a plate