JPS61194196A - 電気錫−鉛合金メツキ法 - Google Patents
電気錫−鉛合金メツキ法Info
- Publication number
- JPS61194196A JPS61194196A JP3415685A JP3415685A JPS61194196A JP S61194196 A JPS61194196 A JP S61194196A JP 3415685 A JP3415685 A JP 3415685A JP 3415685 A JP3415685 A JP 3415685A JP S61194196 A JPS61194196 A JP S61194196A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- lead alloy
- plating
- bath
- alloy plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3415685A JPS61194196A (ja) | 1985-02-22 | 1985-02-22 | 電気錫−鉛合金メツキ法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3415685A JPS61194196A (ja) | 1985-02-22 | 1985-02-22 | 電気錫−鉛合金メツキ法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61194196A true JPS61194196A (ja) | 1986-08-28 |
| JPH0549760B2 JPH0549760B2 (enrdf_load_stackoverflow) | 1993-07-27 |
Family
ID=12406339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3415685A Granted JPS61194196A (ja) | 1985-02-22 | 1985-02-22 | 電気錫−鉛合金メツキ法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61194196A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63118093A (ja) * | 1986-11-05 | 1988-05-23 | Tanaka Electron Ind Co Ltd | 電子部品の錫めつき方法 |
| JPH04280993A (ja) * | 1991-03-11 | 1992-10-06 | Electroplating Eng Of Japan Co | メッキ方法 |
| EP0825281A1 (en) * | 1996-08-21 | 1998-02-25 | Lucent Technologies Inc. | Tin electroplating process |
| JP2006257492A (ja) * | 2005-03-17 | 2006-09-28 | Nec Corp | 合金めっき方法および合金めっき装置 |
| JP2009249640A (ja) * | 2008-04-01 | 2009-10-29 | Mitsubishi Materials Corp | はんだめっき用アノード材 |
| EP1430166B1 (en) * | 2001-03-13 | 2017-02-08 | MacDermid Limited | Method for depositing tin alloys |
-
1985
- 1985-02-22 JP JP3415685A patent/JPS61194196A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63118093A (ja) * | 1986-11-05 | 1988-05-23 | Tanaka Electron Ind Co Ltd | 電子部品の錫めつき方法 |
| JPH04280993A (ja) * | 1991-03-11 | 1992-10-06 | Electroplating Eng Of Japan Co | メッキ方法 |
| EP0825281A1 (en) * | 1996-08-21 | 1998-02-25 | Lucent Technologies Inc. | Tin electroplating process |
| US5750017A (en) * | 1996-08-21 | 1998-05-12 | Lucent Technologies Inc. | Tin electroplating process |
| EP1430166B1 (en) * | 2001-03-13 | 2017-02-08 | MacDermid Limited | Method for depositing tin alloys |
| JP2006257492A (ja) * | 2005-03-17 | 2006-09-28 | Nec Corp | 合金めっき方法および合金めっき装置 |
| JP2009249640A (ja) * | 2008-04-01 | 2009-10-29 | Mitsubishi Materials Corp | はんだめっき用アノード材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0549760B2 (enrdf_load_stackoverflow) | 1993-07-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |