JPS61194196A - 電気錫−鉛合金メツキ法 - Google Patents
電気錫−鉛合金メツキ法Info
- Publication number
- JPS61194196A JPS61194196A JP3415685A JP3415685A JPS61194196A JP S61194196 A JPS61194196 A JP S61194196A JP 3415685 A JP3415685 A JP 3415685A JP 3415685 A JP3415685 A JP 3415685A JP S61194196 A JPS61194196 A JP S61194196A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- plating
- lead alloy
- electric conduction
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910001174 tin-lead alloy Inorganic materials 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims description 18
- 238000009713 electroplating Methods 0.000 title abstract 3
- 238000007747 plating Methods 0.000 claims abstract description 36
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims abstract description 11
- 230000002159 abnormal effect Effects 0.000 abstract description 18
- 230000008021 deposition Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract 1
- 238000001556 precipitation Methods 0.000 description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 210000001787 dendrite Anatomy 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000009499 grossing Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- -1 phenolsulfonic acid Chemical class 0.000 description 3
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229940044654 phenolsulfonic acid Drugs 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3415685A JPS61194196A (ja) | 1985-02-22 | 1985-02-22 | 電気錫−鉛合金メツキ法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3415685A JPS61194196A (ja) | 1985-02-22 | 1985-02-22 | 電気錫−鉛合金メツキ法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61194196A true JPS61194196A (ja) | 1986-08-28 |
| JPH0549760B2 JPH0549760B2 (enrdf_load_stackoverflow) | 1993-07-27 |
Family
ID=12406339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3415685A Granted JPS61194196A (ja) | 1985-02-22 | 1985-02-22 | 電気錫−鉛合金メツキ法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61194196A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63118093A (ja) * | 1986-11-05 | 1988-05-23 | Tanaka Electron Ind Co Ltd | 電子部品の錫めつき方法 |
| JPH04280993A (ja) * | 1991-03-11 | 1992-10-06 | Electroplating Eng Of Japan Co | メッキ方法 |
| EP0825281A1 (en) * | 1996-08-21 | 1998-02-25 | Lucent Technologies Inc. | Tin electroplating process |
| JP2006257492A (ja) * | 2005-03-17 | 2006-09-28 | Nec Corp | 合金めっき方法および合金めっき装置 |
| JP2009249640A (ja) * | 2008-04-01 | 2009-10-29 | Mitsubishi Materials Corp | はんだめっき用アノード材 |
| EP1430166B1 (en) * | 2001-03-13 | 2017-02-08 | MacDermid Limited | Method for depositing tin alloys |
-
1985
- 1985-02-22 JP JP3415685A patent/JPS61194196A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63118093A (ja) * | 1986-11-05 | 1988-05-23 | Tanaka Electron Ind Co Ltd | 電子部品の錫めつき方法 |
| JPH04280993A (ja) * | 1991-03-11 | 1992-10-06 | Electroplating Eng Of Japan Co | メッキ方法 |
| EP0825281A1 (en) * | 1996-08-21 | 1998-02-25 | Lucent Technologies Inc. | Tin electroplating process |
| US5750017A (en) * | 1996-08-21 | 1998-05-12 | Lucent Technologies Inc. | Tin electroplating process |
| EP1430166B1 (en) * | 2001-03-13 | 2017-02-08 | MacDermid Limited | Method for depositing tin alloys |
| JP2006257492A (ja) * | 2005-03-17 | 2006-09-28 | Nec Corp | 合金めっき方法および合金めっき装置 |
| JP2009249640A (ja) * | 2008-04-01 | 2009-10-29 | Mitsubishi Materials Corp | はんだめっき用アノード材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0549760B2 (enrdf_load_stackoverflow) | 1993-07-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |