JPS61194177A - Film forming device for small parts - Google Patents

Abstract

PURPOSE:To make the simultaneous formation of uniform films on many small parts possible by putting the many small parts into a meshed rotary barrel and forming the films for rust prevention thereon by an ion plating method in the stage of forming the films for rust prevention having the uniform thickness on the surface of the many small parts. CONSTITUTION:The many small parts to be treated are put into the cylindrical barrel 12 which is formed by working fine wires consisting of a stainless steel into a meshed shape in a vacuum vessel 21 and the barrel is rotated around a shaft 13 in the stage of forming the Ni films for rust prevention by the ion plating method on the surface of the small parts such as imaging hammers made of iron or steel. The inside of the vessel 21 is evacuated to a high vacuum and a crucible 17 contg. Ni 16 is heated to evaporate by an electron beam to ionize the Ni particles by an ionizing electrode 20. The ions are plunged into the barrel 12 to form the Ni films on the surface of the small parts in the barrel. The thickness of the Ni is detected by a sensor 15 in the barrel and a power source 18 for irradiating the electron beam is controlled to adjust the thickness of the Ni film on the surface of the small parts to a specified and uniform thickness.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to an improvement in a coating forming apparatus for small parts.

On the surface of small parts such as printing hammers made of steel,
Generally, in order to prevent the surface from rusting, a wet plating method is used in which the printing hammer is immersed in an electrolytic solution and a coating of nickel (Ni) or the like is formed on the surface.

However, this wet plating method is a complicated process and requires the handling of chemicals such as electrolytes that are harmful and dangerous to the human body, resulting in pollution problems and the particles of the coated film being It has disadvantages such as being large.

Therefore, there is a need for a film forming apparatus that uses a dry plating method to ensure that the film has a uniform thickness and that allows the film to be attached to the surface of minute parts without using chemicals that are dangerous to the human body.

[Conventional technology]

Film forming equipment that uses such a dry plating method generally includes vapor deposition equipment, ion blating equipment, sputtering equipment, etc., but the film forming speed is fast and the film can be formed closely on the surface of minute parts. A conventional device for forming coatings on small parts using an ion plating device will be described.

FIG. 2 is a schematic diagram of an apparatus for forming coatings on small parts using such an ion plating apparatus.

As shown in the figure, a vacuum container 2, which is evacuated by an exhaust pump 1 to a degree of vacuum of approximately -3-r 10 to 10 torr, contains a film forming material such as nickel (Ni) 3. A crucible 4 is installed, and a jig 6 with a small part 5 such as a printing hammer, which is to form a coating, is installed at a position opposite to the crucible 4.

Furthermore, an ionization electrode 7 is provided at the top of the crucible 4 to ionize the evaporated particles of the film-forming material. Further, an electron beam irradiation power source 8 for heating the Ni film forming material in the crucible 4 is provided separately from the film forming apparatus.

Between this ionization electrode 7 and the jig 6, an ionization electrode 7
becomes a positive voltage, and a voltage is applied to the jig 6 that becomes a negative voltage, and the particles of the evaporated film-forming material are attracted in the direction of the jig 6 by the electric field between the jig 6 and the ionization electrode. , a small part 5 such as a printing hammer as shown in FIG.
A film will begin to form on top.

Further, the thickness of this coating is detected by a sensor 9, and the value is fed back and sent to an electron beam irradiation power source 8 using a control circuit 1o, and the coating forming material in the crucible 4 is transferred to an electron beam irradiation device (Fig. It was melted using an electron gun (not shown).

[Problem that the invention seeks to solve]

By the way, the printing hammer has a complicated structure as shown in Figure 3, with a thickness of about 1 fi, a longitudinal dimension of about 30 mm,
It is a fine structure component with a width dimension of approximately 3 fl.

Therefore, there is no suitable jig for installing such small parts, and a method of suspending the small parts from, for example, a flat plate-like member is adopted.

Small parts installed in such jigs are fixed in fixed positions, so the coating does not adhere to a uniform thickness, and the coating only covers certain surfaces of the small parts. There is a problem that it does not stick.

Therefore, after forming a coating on one side of a small part, the apparatus is stopped and the small part is turned over to form a coating on the entire surface.

Therefore, there is a problem in that it takes too many man-hours to form a coating on such small parts.

[Means for solving problems]

The above problem is solved by installing a mesh-like rotatable barrel that stores the small parts to be coated and the coating material in an evacuated container, and rotating the particles of the coating material. This problem is solved by the film forming apparatus of the present invention, which coats the surface of small parts housed in a barrel.

[Effect]

That is, the film forming apparatus of the present invention places the small parts to be coated in a rotating barrel, and forms a film on a large number of small parts at once with a uniform thickness while rotating the barrel. This is how it was done.

〔Example〕

Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a schematic diagram of the film forming apparatus of the present invention. The film forming apparatus of the present invention is different from conventional film forming apparatuses as shown in the figure.
It is located within 2.

The barrel 12 has a cylindrical or barrel shape and is formed by processing a thin stainless steel wire into a mesh shape. A support rod 13 attached to this barrel 12 is attached to a rotating shaft of a rotary motor 14.

A sensor 15 is provided inside the barrel 12 to detect the thickness of the coating applied to the surface.

The information detected by this sensor 15 is obtained from the film forming material 16.
is fed back via a control circuit 19 to an electron beam irradiation power source 18 for heating a crucible 17 containing a crucible.

Further, between the support rod 13 of the barrel 12 and the ionization electrode 20, a negative voltage is applied to the support rod 13 and a positive voltage is applied to the ionization electrode 20, so that the ionization electrode 20 and the barrel An electric field is applied between the support rod 13 and the barrel 12.

With such a device, the inside of the vacuum container 21 is heated by 10 to 10 to
After evacuation using the evacuation pump 22 to about rr, the crucible 17 containing the Ni film forming material 16 is placed.
is heated to evaporate the forming material 16 in the crucible 17.

The evaporated Ni particles are ionized by the ionization electrode 20, and the ionized particles are carried into the barrel 12 by the electric field between the ionization electrode 20 and the barrel 12, and reach the small parts 11 inside the barrel 12. Since this barrel is rotated by a rotary motor 14, the coating adheres to the small parts 11 within the barrel 12 with a uniform thickness. Also, in this way, a large number of small parts can be processed at the same time. Furthermore, since the barrel is mesh-shaped, the disadvantage of forming a coating only on one side of a small part as in the conventional method is eliminated.

Although the above embodiments of the present invention have been explained using an ion plating method, it is a matter of course that the apparatus of the present invention can also be used in other dry plating methods such as a vapor deposition method or a Yubafuta method.

〔Effect of the invention〕

As described above, according to the film forming apparatus for small parts of the present invention, a film is formed with a uniform thickness over the entire surface of the small part, and small parts such as printing hammers can be formed with high quality. There is.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of a coating forming apparatus for small parts according to the present invention; FIG. 2 is a schematic diagram of a conventional coating forming apparatus for small parts; and FIG. 3 is a perspective view of a printing hammer. In the figure, 11 is a small part, 12 is a barrel, 13 is a support rod, 14 is a motor, 15 is a sensor, 16 is a film forming material, 17 is a crucible, 18 is a power source for electron beam irradiation, and 19 is a control circuit. , 20 is an ionization electrode, 21 is a vacuum container, 22
indicates an exhaust pump. Figure 2 Figure 3

Claims (1)

[Claims] A mesh-like rotatable barrel for storing small parts to be coated and a film-forming material are placed in a vacuum-exhausted container, and particles of the film-forming material are stored in the rotating barrel. 1. A device for forming a film on small parts, characterized in that the film is deposited on the surface of the small part.