JPS59226176A - Ion plating device - Google Patents

Abstract

PURPOSE:To prevent dielectric breakdown of a film deposited by evaporation by irradiating an electron ray to the surface of a base plate in the stage of depositing a metal or ceramic by evaporation on the base plate by an ion plating device. CONSTITUTION:Al 3 is evaporated by an evaporating source 2 and oxygen is introduced into a vacuum chamber 1 through a pipe 6 in the case of depositing, for example, Al2O3 on a base plate 4 by evaporation in the chamber 1. The Al is ionized by an ionizing electrode 5 and is deposited on a base plate 4 biased negative. The film is coated on the plate 4 while thermoelectron is irradiated thereto from a filament 11. The electric charge electrified positive on the surface of the film is thus made neutral and the dielectric breakdown of the film is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field The present invention relates to an improvement of an ion blating device, which is one of surface coating methods.

(b) Conventional technology and its problems, vase Conventionally, as surface treatment methods, carburizing treatment, nitriding treatment, sulfurization treatment, boriding treatment, CVD method, sputtering method, ion blating method, ion implantation method, etc. have been used to improve wear resistance. It is used to improve properties such as corrosion resistance, heat resistance, electrical insulation, etc., and has been used to great effect. Among them, the ion spray coating method can be processed at relatively low temperatures and can produce a film with good adhesion, so it is suitable for cutting tools such as high speed steel and cemented carbide, and wear-resistant tools.

It is also widely used as decorative materials. A typical example thereof will be explained with reference to FIG. In Figure 1, 1
2 is an evaporator equipped with a crucible; 6 is a substance to be evaporated; 4 is a substrate connected to a power source 9 via an insulator 7; 5
is an ionizing electrode, which is also connected to a power source 10 via an insulator 8. 6 is a valve for introducing reaction gas. 1st
When coating the substrate 4 using the apparatus shown in the figure, the evaporator 2
While evaporating the substance 6, a reaction gas is introduced, and the substance and gas are ionized by the ionization electrode. This ionized substance and gas are accelerated to the negatively biased substrate and deposited on the surface, making it possible to obtain a very dense film with good adhesion. The substance to be ionized and the reactive gas are ionized and positively charged, which is accelerated by negatively biasing the substrate, and becomes firmly attached to the substrate. However, with this conventional device, if the deposited film has electrical insulating properties, the positive charge of the flying ions cannot be released when the film thickness exceeds a certain level, and the surface of the film becomes positively charged. be done. On the other hand, since the substrate is negatively biased, a capacitor is formed across the film, and when the charge is further accumulated and the withstand voltage is exceeded, dielectric breakdown occurs and the film is locally destroyed. This deteriorates the properties of the film and at the same time becomes a fatal defect when the film is used for insulation.

(C) Disclosure of the Invention An object of the present invention is to provide a device that can overcome these drawbacks and also improve the properties of the epithelial membrane. Hereinafter, the present invention will be explained with reference to the drawings. FIG. 2 shows an embodiment of the invention. In the figure, numerals 1 to 10 refer to the same parts as in FIG. 1, and their explanation will be omitted. 11 is a thermionic emission source such as a W filament, 12 is a power source for heating the filament, 1
6 is an insulator. In this device, an insulating film, for example A? When coating 203 etc., A
7 is evaporated, and oxygen is introduced via a vibrotube along with the reaction gas. This is ionized by the ionization electrode 5 and deposited on the negatively biased substrate 4. At this time, the coating is performed while irradiating the substrate with thermoelectrons from the filament 11. The advantage of coating with this method is that the positively charged charge on the film surface is neutralized by thermionic irradiation, preventing dielectric breakdown of the film, and that the substrate surface is cleaned by the irradiation. In addition, the substrate is heated to obtain a high-quality film, and these superimposed effects have made it possible to obtain a very good film. As described above, according to the present invention, it is possible to coat an electrically insulating film with good quality and good adhesion, but it goes without saying that electron beam irradiation is also effective on electrically conductive films. do not have. Further, when irradiating the electron beam, the effect will be further increased if a magnetic deflection coil or the like is installed so that the substrate can be scanned all over the substrate.

[Brief explanation of drawings]

FIG. 1 shows a conventional ion blating device, and FIG. 2 shows an ion brating device according to the present invention. DESCRIPTION OF SYMBOLS 1... Vacuum chamber, 2... Evaporation source, 3... Vapor deposition substance, 4... Substrate, 5... Ionization electrode, 6... Gas introduction valve. 9.S(plate acceleration power source, 10.ionization power source, 11..
Thermionic emission filament, 12... Heating power supply Figure 1

Claims (1)

[Claims] (1) Metals or carbides, nitrides, oxides, borides. In an ion blating apparatus that is equipped with an evaporation source for evaporating ceramics such as carbonitrides and oxycarbonitrides, and deposits these metals or ceramics on a substrate facing the evaporation source, the surface of the substrate is irradiated with electron beams. An ion brating device characterized by being equipped with a mechanism.