JPS6119117B2 - - Google Patents
Info
- Publication number
- JPS6119117B2 JPS6119117B2 JP12611479A JP12611479A JPS6119117B2 JP S6119117 B2 JPS6119117 B2 JP S6119117B2 JP 12611479 A JP12611479 A JP 12611479A JP 12611479 A JP12611479 A JP 12611479A JP S6119117 B2 JPS6119117 B2 JP S6119117B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- shaped molded
- mold
- lead frame
- molded product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000047 product Substances 0.000 claims description 69
- 239000004065 semiconductor Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 15
- 238000005304 joining Methods 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000012768 molten material Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 9
- 238000002788 crimping Methods 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 4
- 239000012467 final product Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 238000003860 storage Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12611479A JPS5648155A (en) | 1979-09-27 | 1979-09-27 | Package forming method for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12611479A JPS5648155A (en) | 1979-09-27 | 1979-09-27 | Package forming method for semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5648155A JPS5648155A (en) | 1981-05-01 |
| JPS6119117B2 true JPS6119117B2 (enrdf_load_stackoverflow) | 1986-05-15 |
Family
ID=14926974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12611479A Granted JPS5648155A (en) | 1979-09-27 | 1979-09-27 | Package forming method for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5648155A (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5919359A (ja) * | 1982-07-23 | 1984-01-31 | Hitachi Chem Co Ltd | 半導体類のパツケ−ジ成形方法 |
| JPS62224949A (ja) * | 1986-03-27 | 1987-10-02 | S M C:Kk | Ｉｃパツケ−ジ |
| US5156983A (en) * | 1989-10-26 | 1992-10-20 | Digtial Equipment Corporation | Method of manufacturing tape automated bonding semiconductor package |
| JPH06252283A (ja) * | 1993-02-24 | 1994-09-09 | Kyocera Corp | 半導体装置 |
| TW466720B (en) * | 2000-05-22 | 2001-12-01 | Siliconware Precision Industries Co Ltd | Semiconductor package with flash-prevention structure and manufacture method |
| KR100415281B1 (ko) * | 2001-06-29 | 2004-01-16 | 삼성전자주식회사 | 양면 실장형 회로 기판 및 이를 포함하는 멀티 칩 패키지 |
-
1979
- 1979-09-27 JP JP12611479A patent/JPS5648155A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5648155A (en) | 1981-05-01 |