JPS61185904A - Reflow type high frequency coil - Google Patents

Abstract

PURPOSE:To enable to perform stabilized soldering work at all times even when a reflow part is slightly bent upward or downward or there are recesses and projections on a printed substrate by a method wherein a plate-bent terminal, having a groove part on the soldering part of L-type or U-type flat terminal which is bent at right angles, is provided. CONSTITUTION:A groove part 2 is provided at the center part of the soldering part of an L-type terminal. As a result, the solderability of a reflow type high frequency coil and a chip part can be improved, the unsatisfactory mounting generated in the past and the time and labor spent on the correction of the mulfunction of the coil can be removed, a reflow type high frequency coil and a chip part can be obtained, and a remarkable effect in improvement of quality can be accomplished. Also, the groove part and the printed substrate can be fitted properly, and the positioning of the reflow type high frequency coil and the chip part can be performed accurately.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a reflow type high frequency coil used in various electronic devices.

BACKGROUND OF THE INVENTION In recent years, electronic devices have become increasingly lighter, thinner, shorter and smaller, and the electronic components used in these electronic devices have increased component density, so there is a strong demand for reflow parts. In the field of high-frequency coils, reflow-type parts in which flat terminals are bent into an L-shape or a U-shape have come to be provided.

The conventional reflow type high frequency coil mentioned above will be described below with reference to the drawings. Figure 4 shows a perspective view of the conventional reflow type high frequency coil. In FIG. 4, 11 is an L-shaped terminal. 12 is a multiple bobbin, and 13 is a coil portion.

The configuration of the reflow type high frequency coil configured as described above will be explained below.

This L-shaped plate terminal has a structure in which a flat plate terminal is bent at right angles and embedded or insert molded in a multiple bobbin, and the electrode terminal part (to be reflowed (soldered))
Since the part to be soldered to the printed circuit board was bent into an L-shape or a U-shape, some parts of the reflow process were lifted,
Alternatively, there may be cases in which a device is mounted that is easily misaligned, creates air voids, or has low solder strength.

FIG. 6 shows a cross-sectional view of the L-shaped terminal plate implanted in the multi-connection type povi/ shown in FIG. 4 bent by θ in a positive direction from the horizontal direction.

In the figure, numeral 14 indicates a multi-connection type terminal, and numeral 12 indicates a flat plate terminal processed into an L-shape.

FIG. 6 shows a sectional view of the L-shaped slave plate terminal implanted in the multiple bobbin shown in FIG. 4 bent by θ2 in a negative direction from the horizontal direction.

In the figure, 16 indicates a multiple bobbin, and 17 indicates a flat terminal processed into an L shape.

FIG. 7 shows air voids generated between the L-shaped flat terminal and the printed circuit board.

In the figure, 18 shows a flat terminal processed into an L shape, 19 shows a solder part, 20 shows an air void part, and 21 shows a printed circuit board.

As is clear from FIGS. 5, 6, and 7, it is easy to see that a part of the reflow process is bent and air voids are generated, which deteriorates solderability.

Problems to be Solved by the Invention As shown in Fig. 6, a reflow-type high-frequency coil with a bent reflow part (soldering part) has problems when mounted on electronic equipment.
There have been problems that require various countermeasures, such as correcting each terminal to be horizontal (perpendicular) and soldering methods to prevent air voids.

In view of the above-mentioned problems, the present invention provides a high-frequency coil that can always perform stable soldering even when a reflow part is slightly bent in the vertical direction or when there are uneven parts such as a printed circuit board.

In order to achieve this object, the high-frequency coil of the present invention is provided with at least one groove cut in the soldering part of the L-shaped or U-shaped flat plate terminal bent at right angles. It consists of a flat plate bent terminal.

Function: With this configuration, it is possible to prevent a flat terminal bent at right angles from deteriorating the soldering properties as shown in FIGS. 5 and 6.

EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings.

FIG. 1 shows a perspective view of a reflow type high frequency coil in an embodiment of the present invention. In Figure 1, 1 is L
The ゛-shaped template plate terminal 2 is a grooved portion provided in a central part of the soldering portion of the L-shaped terminal, 3 is a multiple bobbin, and 4 is a coil portion.

FIG. 2 is a perspective view of the present invention applied to other chip components. 6 is a chip component, 6 is a U-shaped flat plate electrode, 7 is
This is a groove cut in the soldering part of the U-shaped flat terminal.

The operation of the high frequency coil and chip components configured as described above will be explained below.

As shown in FIGS. 1 and 2, the soldering effect of flat plate terminals bent at right angles is greatly improved by providing a grooved portion in the soldering portion.

As described above, the reflow-type high-frequency coil and chip components according to this embodiment have improved soldering properties, eliminate the conventional disadvantages of mounting defects and spending time and labor on prior corrections, and are stable reflow-type high-frequency coils and chip components. Coil or chip parts can be obtained, which has a great effect on quality improvement. In addition, it is possible to align the grooved part with the point on the printed circuit board, ensuring the positioning of the reflow type high-frequency coil or chip component. Although the groove cut portion is provided at one location, the groove cut portion may be provided over the entire area as shown in FIG. 3, and one or more groove cut portions may be provided. In the figure, 8 is a high-frequency coil, 9 is a flat terminal, and 1o is a grooved part of a reflow part.

Effects of the Invention As described above, the present invention provides a grooved portion for soldering of an L-shaped or U-shaped flat plate terminal bent at right angles, thereby achieving stable soldering using a reflow-type high-frequency method. Coils or chip parts can be obtained, which have great practical effects.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a reflow-type high-frequency coil with a groove cut part in the reflow part of the present invention, Fig. 2 is a perspective view of a chip component to which the present invention is applied, and Fig. 3 is a perspective view of a reflow-type high-frequency coil having a grooved part in the reflow part of the present invention. FIG. 4 is a perspective view of a conventional reflow-type high-frequency coil, and FIG. 5 is a cross-sectional view of a conventional reflow-type high-frequency coil when a part of the flow is bent in the positive direction. , FIG. 6 is a cross-sectional view of a conventional reflow type high-frequency coil when a part of the flow is bent in a negative direction, and FIG. 7 is a cross-sectional view of a case where an air void occurs. DESCRIPTION OF SYMBOLS 1...L-shaped child plate terminal, 2...Groove cut portion, 3...Multiple bobbin, 4...Coil, 5... ...Chip parts, 6...U-shaped flat terminal, 7...groove section, 8...high frequency coil, 9...flat plate terminal glue Flo part, 1
o... Grooving part in a part of reflow. Name of agent: Patent attorney Toshio Nakao and one other person ai
1 Figure 8 - Single series bobbin 4 - Coil Figure 2 Figure 3 Figure 5 Figure 6 Figure 7

Claims (1)

[Claims] A reflow type high-frequency coil comprising a flat plate terminal bent at right angles and having at least one groove cut in the soldering part of the L-shaped or U-shaped flat plate terminal.