JPS6127664A - Installation of lead terminal - Google Patents

Installation of lead terminal

Info

Publication number
JPS6127664A
JPS6127664A JP14763784A JP14763784A JPS6127664A JP S6127664 A JPS6127664 A JP S6127664A JP 14763784 A JP14763784 A JP 14763784A JP 14763784 A JP14763784 A JP 14763784A JP S6127664 A JPS6127664 A JP S6127664A
Authority
JP
Japan
Prior art keywords
lead
lead terminals
clips
lead frame
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14763784A
Other languages
Japanese (ja)
Other versions
JPH0470777B2 (en
Inventor
Noritaka Koshiba
小柴　則隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wako Sangyo KK
Original Assignee
Wako Sangyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wako Sangyo KK filed Critical Wako Sangyo KK
Priority to JP14763784A priority Critical patent/JPS6127664A/en
Publication of JPS6127664A publication Critical patent/JPS6127664A/en
Publication of JPH0470777B2 publication Critical patent/JPH0470777B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To prevent a lefthand and righthand clips opposing each other from deviating from linear arrangement and thereby to stabilize product quality by a method wherein clips are built on the lefthand and righthand sides in a lead frame for the formation of pairs of lead terminals and clips are inserted into a substrate in pairs. CONSTITUTION:Clips 2a, 2b are formed at both the left and right sides of a lead frame 1, and guide holes 3a, 3b are formed along both flank panels 6. Separation is accomplished along the middle portion for the creation of a pair of lead terminals 4. The clips 2a, 2b are inserted into both sides of a ceramic substrate by using an inserting unit. The curvature formed by a clip 2 may be moidified as necessary and the flank panels 6 are cut away later. With a pair of lefthand and righthand lead terminals being produced out of one and the same lead frame to be installed to the two sides of the ceramic substrate, there is no directional deviation between the two opposing lead terminals. The two pins are maintained in a line, which ensures stable positions for clips to be inserted into the ceramic substrate.

Description

【発明の詳細な説明】 〔技術分野〕 この発明は、帯状のリードフレームからリード端子を形
成して基板へ挿入するリード端子の取付方法、特に基板
の両側端部に取り付ける際の対向ずれを防止したリード
端子の取付方法に関する。[Detailed Description of the Invention] [Technical Field] The present invention relates to a lead terminal mounting method in which lead terminals are formed from a strip-shaped lead frame and inserted into a board, and in particular, to prevent misalignment when mounting lead terminals on both ends of a board. This article relates to a method for attaching lead terminals.

〔従来技術〕[Prior art]

ＩＣ５ＬＳＩなどのようなチップ化された集積回路部品
は、セラミツ、り等の基板に多数の電子回路素子を実装
し、その基板の側端部にリード端子を取り付けることに
より形成される。この回路部品は、回路パターンが印刷
配線されたプリント基板等に取り・付けられて所定の電
気回路を構成する。A chipped integrated circuit component such as an IC5LSI is formed by mounting a large number of electronic circuit elements on a substrate made of ceramic, phosphor, or the like, and attaching lead terminals to the side ends of the substrate. This circuit component is attached to a printed circuit board or the like on which a circuit pattern is printed and wired to form a predetermined electric circuit.

その際、プリント基板に設けられた穴にリード端子を貫
通させて固定するか、あるいは直接プリント基板上の配
線にリード端子を半田付けして固定することにより、回
路部品がプリント基板に取り付けられる。ここで重要と
なる点は、多数の電子　　　　　　１回路素子を実装す
る基板にリード端子を確実に取り付けることであり、特
に基板の左右両側端部にリード端子を取り付ける場合に
おいては所謂対向ずれが生じると取付不良となり、外部
振動等に起因してリード端子の一部のピンが外れたりす
ることがある。At this time, the circuit component is attached to the printed circuit board by passing the lead terminal through a hole provided in the printed circuit board and fixing it, or by directly fixing the lead terminal by soldering to the wiring on the printed circuit board. The important point here is to securely attach the lead terminals to the board on which a large number of electronic circuit elements are mounted, and especially when attaching the lead terminals to the left and right ends of the board, so-called misalignment may occur. This may result in poor installation and some pins of the lead terminal may come off due to external vibrations, etc.

従来、上記のような基板に対するリード端子の取付方法
としては、例えば以下に述べるような方法が知られてい
る。即ち、電子回路素子を実装するセラミック基板の両
側にリード端子を取り付ける場合、先ず帯状に形成され
たリードフレームを２つのドラムに巻回しておき、これ
らの左右のドラムからそれぞれのリードフレームを並行
に送給する。このとき、左右のドラムに巻回するリード
フレームの巻き方向は互いに逆方向としである。Conventionally, as a method for attaching lead terminals to the above-mentioned substrate, for example, the following method is known. In other words, when attaching lead terminals to both sides of a ceramic substrate on which electronic circuit elements are mounted, a lead frame formed in a band shape is first wound around two drums, and each lead frame is connected in parallel from these left and right drums. send. At this time, the winding directions of the lead frames wound around the left and right drums are opposite to each other.

そして、並列に送り込まれた右のリードフレームを切断
、プレス加工してリード端子を形成する。Then, the right lead frame fed in parallel is cut and pressed to form lead terminals.

この切断、プレス加工工程では、目的に合った種々の形
状のリップ部（基板へ挿入される部分）が形成されると
共に、必要に応じて端末部分の加工、不要ビンの切断等
が行われる。このようにして成形された左右のリード端
子は、それぞれの挿入装置によりセラミック基板の両側
端部にクリップ部が挿入され、後段のボンディング工程
を経てセラミック基板に取り付けられる。この左右のリ
ード端子が取り付けられたセラミック基板は、上述した
ようにプリント基板等に取り付けられて使用される。In this cutting and pressing step, lip portions (portions to be inserted into the substrate) of various shapes suited to the purpose are formed, and the terminal portions are processed, unnecessary bottles are cut, etc. as necessary. The left and right lead terminals formed in this manner have clip portions inserted into both ends of the ceramic substrate by respective insertion devices, and are attached to the ceramic substrate through a subsequent bonding process. The ceramic substrate to which the left and right lead terminals are attached is used by being attached to a printed circuit board, etc., as described above.

しかしながら、このような従来のリード端子の取付方法
にあっては、基板の左右両側にリード端子を取り付ける
場合、左右のリード端子を別々に成形して送り込んでい
るため、左右のリード端子が対向ずれを起こし易く、各
ビンが揃わず品質不良が発生するという問題点があった
。However, in this conventional method of attaching lead terminals, when attaching lead terminals to both the left and right sides of a board, the left and right lead terminals are molded and fed separately, so the left and right lead terminals may be misaligned. There was a problem in that each bottle was not aligned and quality defects occurred.

〔発明の目的〕[Purpose of the invention]

この発明は、上記のような従来方法の問題点に着目して
なされたもので、リードフレームの左右両側にクリップ
部を形成して左右一対のリード端子を成形し、この一対
のリード端子のクリップ部を基板に挿入することにより
、左右の対向ずれを防止し、品質を安定させることがで
きるリード端子の取付方法を提供するものである。This invention was made by focusing on the problems of the conventional method as described above. Clip portions are formed on both left and right sides of a lead frame to form a pair of left and right lead terminals, and the clips of the pair of lead terminals are formed. The present invention provides a method for attaching a lead terminal that can prevent left and right misalignment and stabilize quality by inserting a lead terminal into a board.

〔発明の構成〕[Structure of the invention]

帯状に形成されたリードフレームの左右両側にクリップ
部を形成し、且つ両端部にそれぞれの案内孔を設けて左
右一対のリード端子を形成する。Clip portions are formed on both left and right sides of a lead frame formed in a band shape, and guide holes are provided at both ends to form a pair of left and right lead terminals.

次いで、中央部を切断し、これにより分断された左右の
リード端子のクリップ部を基ぼの両側端部に挿入してリ
ード端子を基板に取り付けるようにしたリード端子の取
付方法である。Next, the lead terminal is attached to the substrate by cutting the central portion and inserting the clip portions of the left and right lead terminals thus separated into both ends of the substrate.

〔実施例〕〔Example〕

以下、この発明の一実施例を図面を用いて説明する。 An embodiment of the present invention will be described below with reference to the drawings.

先ず、１つのドラムに帯状に形成されたリードフレーム
を巻回しておき、このドラムからリードフレームを切断
装置およびプレス加工装置に送り込んでいく。この切断
工程、プレス加工工程では、’）−Ｆ７レームの左右両
側に一対のクリップ部が形成されると共に両端部にそれ
ぞれ案内孔が形成される。第１図は、上記工程でクリッ
プ部が形成されたリードフレームの一例を示したもので
ある。First, a lead frame formed in a band shape is wound around one drum, and the lead frame is fed from this drum to a cutting device and a press processing device. In this cutting step and press working step, a pair of clip portions are formed on both left and right sides of the ')-F7 frame, and guide holes are formed at both ends, respectively. FIG. 1 shows an example of a lead frame in which a clip portion is formed in the above process.

リードフレーム１の左右両側にクリップ部２８゜２ｂが
形成されており、両端部にはそれぞれの案内孔３ａ　、
３ｂが形成されている。この案内孔３ａ、３ｂが形成さ
れているのは、案内孔３　ａ、３ｂでリードフレーム１
を送給するためのものである。Clip portions 28° 2b are formed on both left and right sides of the lead frame 1, and guide holes 3a,
3b is formed. These guide holes 3a, 3b are formed in the lead frame 1.
It is for sending.

上記のようにクリップ部２ａｊ２ｂが形成されたリード
フレームは、次段工程で中央部分が切断され、左右一対
のリード端子が成形される。そして、このリード端子を
各々の案内孔３ａ、３ｂに送り機構を係合させて送給し
、次の挿入工程・＼移行する。挿入工程では、それぞれ
の挿入装置によってセラミック基板の左右側端部に上記
リード端子のクリップ部２ａ　、　２ｂを同時あるいは
順次挿入していく。これにより、セラミック基板の両側
にリード端子が取り付けられ、後段のボンディング工程
へ移行していく。The lead frame in which the clip portions 2aj2b are formed as described above is cut at the center in the next step, and a pair of left and right lead terminals are formed. Then, the lead terminals are fed by engaging the feed mechanism into each of the guide holes 3a and 3b, and proceed to the next insertion process. In the insertion step, the clip portions 2a and 2b of the lead terminals are simultaneously or sequentially inserted into the left and right end portions of the ceramic substrate using respective insertion devices. As a result, lead terminals are attached to both sides of the ceramic substrate, and the process moves to the subsequent bonding process.

第２図は、上記リード端子を示す図である。リード端子
４の一端にクリップ部２が形成され、その中央部の形状
は必要に応じて曲げ加工が行われる。また、他端の各ビ
ン５は共通部分６は後に切り落される。第３図は第２図
の側面図を示し、第４図は中央部を曲げたリード端子４
の一例を示す図で、この第４図に示すものはクリップ部
２の形状を、セラミック基板を上下がら挟むことができ
るようにしたものである。FIG. 2 is a diagram showing the lead terminal. A clip portion 2 is formed at one end of the lead terminal 4, and the shape of the central portion thereof is bent as necessary. Further, the common portion 6 of each bottle 5 at the other end is cut off later. Fig. 3 shows a side view of Fig. 2, and Fig. 4 shows the lead terminal 4 with the central part bent.
In the example shown in FIG. 4, the shape of the clip portion 2 is such that it can hold a ceramic substrate from above and below.

上述したように、リード端子４は、クリップ部２をセラ
ミツタ基板の側端部に挿入することにより、セラミック
基板に取り付けられ、その際１っのリードフレームから
左右一対のリード端子を成形して基板の両側に取り付け
ているので、従来のような対向ずれを起こすことはなく
、各ビンが一定に揃い、クリップ部の挿入位置が安定す
るので品質が向上する。As described above, the lead terminals 4 are attached to the ceramic substrate by inserting the clip portions 2 into the side edges of the ceramic substrate. Since the clips are attached to both sides of the clip, there is no problem of misalignment as in the conventional case, and the bins are aligned uniformly and the inserting position of the clip portion is stabilized, improving quality.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、この発明によれば、リードフレー
ムの左右両側にクリップ部を形成して左右一対のリード
端子を形成し、この一対のリード端子のクリップ部を基
板に挿入して取り付けるようにしたため、基板の両側に
リード端子を取り付ける場怨転対同ずれを防止すること
ができ、各ピンが一定に揃い、クリップ部の挿入位置が
安定して品質を向上させることができるという効果があ
る。As explained above, according to the present invention, a pair of left and right lead terminals are formed by forming clip portions on both the left and right sides of a lead frame, and the clip portions of the pair of lead terminals are inserted and attached to a board. Therefore, it is possible to prevent misalignment when attaching lead terminals on both sides of the board, and each pin is aligned uniformly, which has the effect of stabilizing the insertion position of the clip part and improving quality. .

【図面の簡単な説明】[Brief explanation of drawings]

第１図はクリップ部および案内孔を形成したリードフレ
ームを示す図、第２図はリード端子の形状を示す図、第
３図はその側面図、第４図はリード端子の他の形状を示
す図である。 １・・・・・・リードフレーム ２．２ａ、２ｂ・・・・・・クリップ部３ａｔ３ｂ・・
・・・・案内孔 ４・・・・・・リード端子 第７図 第２図　　　　　第３図 す 第４図Fig. 1 is a diagram showing a lead frame with a clip portion and a guide hole formed therein, Fig. 2 is a diagram showing the shape of the lead terminal, Fig. 3 is a side view thereof, and Fig. 4 is a diagram showing other shapes of the lead terminal. It is a diagram. 1...Lead frame 2.2a, 2b...Clip portion 3at3b...
...Guide hole 4...Lead terminal Fig. 7 Fig. 2 Fig. 3 Fig. 4

Claims (1)

【特許請求の範囲】[Claims] 　帯状に形成されたリードフレームからリード端子を形
成して基板へ取り付けるリード端子の取付方法において
、リードフレームの左右両側にクリップ部を形成すると
共に両端部にそれぞれの案内孔を設けて左右一対のリー
ド端子を形成し、次いで中央部を切断して基板の両側端
部に前記左右のリード端子のクリップ部を挿入すること
によりリード端子を基板へ取り付けるようにしたことを
特徴とするリード端子の取付方法。In a method for attaching lead terminals by forming lead terminals from a lead frame formed in a strip shape and attaching them to a board, a pair of left and right leads are formed by forming clip portions on both left and right sides of the lead frame and providing respective guide holes at both ends. A method for attaching a lead terminal, characterized in that the lead terminal is attached to a board by forming a terminal, then cutting the center portion, and inserting the clip portions of the left and right lead terminals into both ends of the board. .
JP14763784A 1984-07-18 1984-07-18 Installation of lead terminal Granted JPS6127664A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14763784A JPS6127664A (en) 1984-07-18 1984-07-18 Installation of lead terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14763784A JPS6127664A (en) 1984-07-18 1984-07-18 Installation of lead terminal

Publications (2)

Publication Number Publication Date
JPS6127664A true JPS6127664A (en) 1986-02-07
JPH0470777B2 JPH0470777B2 (en) 1992-11-11

Family

ID=15434835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14763784A Granted JPS6127664A (en) 1984-07-18 1984-07-18 Installation of lead terminal

Country Status (1)

Country Link
JP (1) JPS6127664A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816427A (en) * 1986-09-02 1989-03-28 Dennis Richard K Process for connecting lead frame to semiconductor device
EP0346035A2 (en) * 1988-06-09 1989-12-13 Oki Electric Industry Co., Ltd. Terminal structure and process of fabricating the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4522623Y1 (en) * 1967-12-27 1970-09-07
JPS5259265U (en) * 1975-10-29 1977-04-30
JPS5618448A (en) * 1979-07-24 1981-02-21 Sony Corp Composite electronic part

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4522623Y1 (en) * 1967-12-27 1970-09-07
JPS5259265U (en) * 1975-10-29 1977-04-30
JPS5618448A (en) * 1979-07-24 1981-02-21 Sony Corp Composite electronic part

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4816427A (en) * 1986-09-02 1989-03-28 Dennis Richard K Process for connecting lead frame to semiconductor device
EP0346035A2 (en) * 1988-06-09 1989-12-13 Oki Electric Industry Co., Ltd. Terminal structure and process of fabricating the same
US4989318A (en) * 1988-06-09 1991-02-05 Oki Electric Industry Co., Ltd. Process of assembling terminal structure
US5081764A (en) * 1988-06-09 1992-01-21 Oki Electric Industry Co., Ltd. Terminal structure and process of fabricating the same

Also Published As

Publication number Publication date
JPH0470777B2 (en) 1992-11-11

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