JPH03152890A - Lead terminal fixing method for printed wiring board - Google Patents
Lead terminal fixing method for printed wiring boardInfo
- Publication number
- JPH03152890A JPH03152890A JP28996189A JP28996189A JPH03152890A JP H03152890 A JPH03152890 A JP H03152890A JP 28996189 A JP28996189 A JP 28996189A JP 28996189 A JP28996189 A JP 28996189A JP H03152890 A JPH03152890 A JP H03152890A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- boards
- lead terminals
- board
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 42
- 238000005476 soldering Methods 0.000 abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、−側方にのみリード端子を備えたシングル・
インライン型の印刷配線板におけるリード電極にリード
端子を取り付ける取り付け方法に関する。特にマイクロ
モジュールあるいは混成集積回路装置等に使用する印刷
配線板に適用できるリード端子の取り付け方法である。[Detailed Description of the Invention] [Industrial Field of Application] The present invention is directed to a single type device having lead terminals only on the - side.
The present invention relates to an attachment method for attaching lead terminals to lead electrodes on an in-line printed wiring board. This method of attaching lead terminals is particularly applicable to printed wiring boards used in micromodules or hybrid integrated circuit devices.
第４図ないし第６図を参照しつつ従来例を説明する。第
４図は従来例における集合基板分割側説明図、第５図は
従来例におけるリード端子取り付け説明図、第６図は第
５図Ａ−Ａ’断面図である。A conventional example will be explained with reference to FIGS. 4 to 6. FIG. 4 is an explanatory diagram of the divided board assembly side in the conventional example, FIG. 5 is an explanatory diagram of lead terminal attachment in the conventional example, and FIG. 6 is a sectional view taken along the line A-A' in FIG.
第４図において、一定方向に揃えられた配線パターンを
備えた単一の印刷配線板（以下、本明細書では単に単一
基板と記載する）１が多数集合して集合基板（以下、本
明細書では、単一の印刷配線板が多数集合している集合
基板を単に集合基板と記載する）３を形成している。In FIG. 4, a large number of single printed wiring boards (hereinafter simply referred to as a single board in this specification) 1 having wiring patterns aligned in a certain direction are assembled to form a collective board (hereinafter referred to as a single board in this specification). In this book, a collective board in which a large number of single printed wiring boards are assembled is simply referred to as a collective board) 3.
集合基板３は、図示されていない配線パターンが形成さ
れた後に、第４図図示のごとく、実線により分割されて
単一基板１となる。After forming a wiring pattern (not shown), the collective substrate 3 is divided into single substrates 1 by solid lines as shown in FIG.
次に、第５図および第６図に示すように、前記工程で分
割された単一基板１は、図示されていない装置により受
は台１０上を搬送されて来る。そして、受は台１０の端
部で停止した時、リード端子１３を多数連ねているリー
ド端子成形部材１２が、リード電極４に接近し、その後
図示されていない装置によりリード端子１３のクリップ
部１４がリード電極４に嵌着される。Next, as shown in FIGS. 5 and 6, the single substrate 1 that has been divided in the above process is transported on a receiving table 10 by a device (not shown). When the receiver stops at the end of the stand 10, the lead terminal molding member 12, in which a large number of lead terminals 13 are connected, approaches the lead electrode 4, and then the clip portion 14 of the lead terminal 13 is moved by a device (not shown). is fitted onto the lead electrode 4.
次の工程において半田付けが行われ、リード端子１３は
、単一基板１のリード電極４に取り付けられる。In the next step, soldering is performed, and the lead terminals 13 are attached to the lead electrodes 4 of the single substrate 1.
しかし、単一基板１のリード電極４にリード端子１３を
取り付ける場合、第５図図示のごとく、単一基板工を受
は台１０で搬送する搬送部１５が必要である。この搬送
部１５の裏側には、チップ部品を取り付けられないため
、この分実装密度を低下させる。なお、この場合向きを
変えても、リード電極４と反対側が必ず搬送部１５とな
るため、この搬送部１５にはチップ部品を取り付けるこ
とができない。However, when attaching the lead terminals 13 to the lead electrodes 4 of the single substrate 1, as shown in FIG. Since chip components cannot be attached to the back side of the transport section 15, the packaging density is reduced accordingly. In this case, even if the direction is changed, the side opposite to the lead electrodes 4 will always be the transport section 15, so no chip components can be attached to the transport section 15.
また、シングル・インライン型の単一基板１では、第５
図図示のごとく、−側方からのみリード端子１３のクリ
ップ部１４を嵌着するので、この時の押圧力が偏り、こ
れを防止する特別の治具が必要になる。In addition, in the single inline type single board 1, the fifth
As shown in the figure, since the clip portion 14 of the lead terminal 13 is fitted only from the negative side, the pressing force at this time is biased, and a special jig is required to prevent this.
本発明は、以上のような問題を解決するためのもので、
単一基板におけるチップ部品の実装密度を上げることが
できる印刷配線板におけるリード端子の取り付け方法を
提供することを目的とする。The present invention is intended to solve the above problems.
An object of the present invention is to provide a method for attaching lead terminals on a printed wiring board that can increase the packaging density of chip components on a single board.
また、本発明は、印刷配線板のリード電極にリード端子
を安定して嵌着できる印刷配線板におけるリード端子の
取り付け方法を提供することを目３
的とする。Another object of the present invention is to provide a method for attaching lead terminals to a printed wiring board, which allows the lead terminals to be stably fitted to the lead electrodes of the printed wiring board.
前記目的を達成するために、本発明の印刷配線板におけ
るリード端子の取り付け方法は、−側方にのみリード端
子を備えたシングル・インライン型の印刷配線板におけ
るリード電極にリード端子を取り付ける取り付け方法に
おいて、リード端子のない側を互いに対向し、リード端
子側を外方に向けて配置した少なくとも１組の対向基板
を多数集合した集合基板に配線パターンを形成する第１
工程と、前記集合基板から少なくとも１組の対向基板に
分割する第２工程と、前記対向基板の両側部のリード電
極にリード端子を取り付ける第３工程と、前記対向基板
を分割して単位基板に分割する第４工程とからなる。In order to achieve the above object, the method for attaching lead terminals on a printed wiring board of the present invention is as follows: - A method for attaching lead terminals to lead electrodes on a single in-line type printed wiring board having lead terminals only on the sides; In the first method, a wiring pattern is formed on a collective board made up of a large number of at least one pair of counterboards arranged with the sides without lead terminals facing each other and the lead terminals facing outward.
a second step of dividing the collective substrate into at least one set of counter substrates, a third step of attaching lead terminals to lead electrodes on both sides of the counter substrate, and dividing the counter substrate into unit substrates. and a fourth step of dividing.
本発明は、同じ配線パターンが形成されているシングル
・インライン型の単一基板を互いに対向４−
するように配置した対向基板を作成する。そして、前記
対向基板が恰も１つのデュアル・インライン型の基板の
ようにリード端子取り付け装置で搬送され、その両側に
リード端子が取り付けられる。The present invention creates a counter substrate in which single in-line type single substrates on which the same wiring pattern is formed are arranged to face each other. Then, the counter board is transported by a lead terminal attaching device like a single dual in-line board, and lead terminals are attached to both sides thereof.
したがって、対向基板の搬送部は、リード電極の部分を
使用できるので、単一基板の実装密度が向上する。Therefore, the lead electrode portion can be used for the conveyance section of the counter substrate, so that the packaging density on a single substrate is improved.
また、デュアル・インライン型の基板と同様に基板の両
端からリード端子を嵌着できるので、特別の治具を用い
なくとも安定したリード端子の取り付けが可能になる。Furthermore, as with a dual inline type board, lead terminals can be fitted from both ends of the board, so lead terminals can be stably mounted without using a special jig.
第１図ないし第３図を参照しつつ本発明の一実施例を説
明する。第１図は本発明における集合基板分割側説明図
、第２図は本発明におけるリード端子取り付け説明図、
第３図は本発明における単一基板説明図である。An embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is an explanatory diagram of the divided board assembly side in the present invention, FIG. 2 is an explanatory diagram of lead terminal attachment in the present invention,
FIG. 3 is an explanatory diagram of a single substrate in the present invention.
第１図において、単一基板１は、リード電極４が付いて
いない部分で対向し、反対側にリード電極４を備えるよ
うに配置され、ＰｌおよびＰ２のごとく、少なくとも１
組の対向基板（以下、本明細書ではこのような配置の単
一基板を対向基板と記載する）２を形成している。なお
、前記のような配置であれば、第１図図示のごとく、Ｐ
５およびＰ６とＰｌおよびＰ８との２組の基板を対向さ
せた対向基板２′とすることもできる。In FIG. 1, the single substrates 1 are arranged so that the parts without the lead electrodes 4 face each other and have the lead electrodes 4 on the opposite side, and at least one
A pair of opposing substrates (hereinafter, in this specification, a single substrate arranged in this manner will be referred to as an opposing substrate) 2 are formed. In addition, if the arrangement is as described above, as shown in FIG.
It is also possible to form a counter substrate 2' in which two sets of substrates 5 and P6 and P1 and P8 are opposed to each other.
そして、この対向基板２または２′が多数集合して集合
基板３を形成している。A large number of these opposing substrates 2 or 2' are assembled to form a collective substrate 3.
集合基板３は、配線パターンが形成された後に、第１図
図示の実線から分割されて対向基板２または２′とする
。このようにして分割された対向基板２または２′は、
図示されていない装置により受は台１０上を搬送されて
来る。そして、第２図図示のごとく、受は台１０から次
の受は台１１に移る位置で、リード端子１３が連なって
いるリード端子成形部材１２を両側のリード電極４に接
近させる。その後図示されていない装置により、リード
端子１３のクリップ部１４が両側のリード電極４に向か
って同時に押圧され、両者は嵌着される。After the wiring pattern is formed on the collective substrate 3, it is divided along the solid line shown in FIG. 1 to form a counter substrate 2 or 2'. The counter substrate 2 or 2' divided in this way is
The receiver is conveyed on the stand 10 by a device not shown. Then, as shown in FIG. 2, at a position where the receiver is transferred from the base 10 to the next base 11, the lead terminal molding member 12, on which the lead terminals 13 are connected, is brought close to the lead electrodes 4 on both sides. Thereafter, a device (not shown) simultaneously presses the clip portions 14 of the lead terminals 13 toward the lead electrodes 4 on both sides, and the two are fitted together.
次の半田付け工程において、リード端子１３と対向基板
２または２′の両側のリード電極４とが取り付けられる
。In the next soldering process, the lead terminals 13 and the lead electrodes 4 on both sides of the opposing substrate 2 or 2' are attached.
さらに、次の工程において、対向基板２または２′は、
点線で図示されているスリット５から分割され、単一基
板１になる。Furthermore, in the next step, the counter substrate 2 or 2' is
It is divided into a single substrate 1 through a slit 5 indicated by a dotted line.
以上、本発明の実施例を詳述したが、本発明は、前記実
施例に限定されるものではない。そして、特許請求の範
囲に記載された本発明を逸脱することがなければ、種々
の設計変更を行うことが可能である。Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. Various design changes can be made without departing from the scope of the invention as set forth in the claims.
たとえば、切断線８で集合基板３を切断し、耳部７を備
えたまま、対向基板２′とすることもできる。このよう
な対向基板２′は、前記耳部７を搬送部として使えるの
で、実装密度は高く取れる。For example, it is also possible to cut the collective substrate 3 along the cutting line 8 and use it as the counter substrate 2' with the ears 7 still provided. In such a counter substrate 2', the ear portion 7 can be used as a transfer portion, so that the mounting density can be high.
また、上記のような対向基板２′でも、リード端子取り
付け工程において、両側からリード端子１３を押圧する
ことができるので、リード端子１３の押圧は安定して行
える。Further, even with the counter substrate 2' as described above, the lead terminals 13 can be pressed from both sides in the lead terminal attaching process, so that the lead terminals 13 can be stably pressed.
さらに、第１図図示対向基板２′は、Ｐ５ないしＰ８ま
での２組であるが、対向基板２を２組以上に増加しても
良い。Further, although the counter substrates 2' shown in FIG. 1 are two sets P5 to P8, the number of counter substrates 2 may be increased to two or more sets.
さらに、本発明の方法は、マイクロモジュール、あるい
は混成集積回路装置の印刷配線板以外に電子機器用の印
刷配線板にも適用できる。Furthermore, the method of the present invention can be applied to printed wiring boards for electronic devices as well as printed wiring boards for micromodules or hybrid integrated circuit devices.
本発明によれば、リード端子取り付け工程において、対
向基板のリード電極を搬送部としたので、リード電極以
外には全てチップ部品を実装でき、実装密度が向上した
。According to the present invention, in the lead terminal attaching process, since the lead electrodes of the opposing substrate are used as the conveying portion, chip components can be mounted on all parts other than the lead electrodes, and the packaging density is improved.
また、本発明によれば、シングル・インライン型の基板
であるにもかかわらず、デュアル・インライン型の基板
と同様にして基板の両側からリード端子を取り付けるの
で、リード端子を押圧する力のバランスが取り易く、安
定した取り付け作業ができる。Furthermore, according to the present invention, even though it is a single inline type board, the lead terminals are attached from both sides of the board in the same way as a dual inline type board, so the balance of the force pressing the lead terminals is improved. Easy to remove and allows for stable installation work.
また、−度に２つの単位基体のリード挿入ができるので
、作業効率も倍加する。Furthermore, since leads can be inserted for two unit substrates at the same time, work efficiency is doubled.
第１図は本発明における集合基板分割側説明図、第２図
は本発明におけるリード端子取り付け説明図、第３図は
本発明における単一基板説明図、第４図は従来例におけ
る集合基板分割側説明図、第５図は従来例におけるリー
ド端子取り付け説明図、第６図は第５図Ａ−Ａ’断面図
である。
１・・・単一基板
２・・・対向基板
３・・・集合基板
４ ・ ・ ・リード電極
５・・・スリット
６・・・切断線
７・・・耳部
８・・・切断線
１０．１１・・・受は台
１２・・・リード端子成形部材
１３・ ・ ・ リード端子
１４・・・クリップ部
０
１５・
・搬送部
■
瞑Fig. 1 is an explanatory diagram of the divided board assembly side in the present invention, Fig. 2 is an explanatory diagram of lead terminal attachment in the present invention, Fig. 3 is an explanatory diagram of the single board in the present invention, and Fig. 4 is an explanatory diagram of the division of the collective board in the conventional example. 5 is a side explanatory view, FIG. 5 is an explanatory view of lead terminal attachment in a conventional example, and FIG. 6 is a sectional view taken along line AA' in FIG. 1...Single board 2...Counter board 3...Collected board 4...Lead electrode 5...Slit 6...Cutting line 7...Ear portion 8...Cutting line 10. 11...The receiver is the stand 12...Lead terminal molding member 13...Lead terminal 14...Clip part 0 15...Transportation part■
Claims (1)
イン型の印刷配線板におけるリード電極にリード端子を
取り付ける取り付け方法において、リード端子１３のな
い側を互いに対向し、リード端子１３側を外方に向けて
配置した少なくとも１組の対向基板２を多数集合した集
合基板３に配線パターンを形成する第１工程と、 前記集合基板３から少なくとも１組の対向基板２に分割
する第２工程と、 前記対向基板２の両側部のリード電極４にリード端子１
３を取り付ける第３工程と、 前記対向基板２を分割して単一基板１に分割する第４工
程と、 を備えたことを特徴とする印刷配線板におけるリード端
子の取り付け方法。[Claims] In an attachment method for attaching lead terminals to lead electrodes in a single in-line printed wiring board having lead terminals only on one side, the sides without lead terminals 13 are placed opposite each other, and the lead terminals A first step of forming a wiring pattern on a collective board 3 made up of a large number of at least one set of counter substrates 2 arranged with the 13 side facing outward; and dividing the collective board 3 into at least one set of counter substrates 2. In a second step, lead terminals 1 are attached to the lead electrodes 4 on both sides of the counter substrate 2.
3; and a fourth step of dividing the opposing substrate 2 into single substrates 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28996189A JPH03152890A (en) | 1989-11-09 | 1989-11-09 | Lead terminal fixing method for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28996189A JPH03152890A (en) | 1989-11-09 | 1989-11-09 | Lead terminal fixing method for printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03152890A true JPH03152890A (en) | 1991-06-28 |
Family
ID=17749975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28996189A Pending JPH03152890A (en) | 1989-11-09 | 1989-11-09 | Lead terminal fixing method for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03152890A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63259990A (en) * | 1987-04-15 | 1988-10-27 | 松下電器産業株式会社 | Manufacture of electronic component |
-
1989
- 1989-11-09 JP JP28996189A patent/JPH03152890A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63259990A (en) * | 1987-04-15 | 1988-10-27 | 松下電器産業株式会社 | Manufacture of electronic component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6246016B1 (en) | Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board | |
| JPH0679990A (en) | Ic memory card | |
| JPH03145186A (en) | Semiconductor module | |
| JPH03152890A (en) | Lead terminal fixing method for printed wiring board | |
| US5432680A (en) | Electronic assembly including lead terminals spaced apart in two different modes | |
| JPH04147660A (en) | Package of electronic component and mounting structure thereof | |
| JPH09246686A (en) | Connecting member and manufacture thereof | |
| JPH04101491A (en) | Mounting method for chip component | |
| JP2731584B2 (en) | Lead frame and method of manufacturing electronic component package using the same | |
| JPS6127664A (en) | Installation of lead terminal | |
| JPH0299394A (en) | Memory card module | |
| JPH031893Y2 (en) | ||
| JPH0539670Y2 (en) | ||
| JPH04241447A (en) | Semiconductor module | |
| JP2567964Y2 (en) | Terminal structure of electronic components | |
| JPH03255654A (en) | Surface mounting semiconductor device | |
| JPH03184366A (en) | Surface mount package | |
| JPH0250464A (en) | Lattice array type semiconductor element package | |
| TWI220993B (en) | Resistor device package and its manufacturing process | |
| JPH07122674A (en) | Hybrid integrated circuit | |
| JPH062693U (en) | Tape carrier with excellent bendability | |
| JPS62199434A (en) | Laminated board | |
| JPH03214791A (en) | Electronic apparatus | |
| JPH0831478A (en) | Electrode connection device | |
| JPH0520346U (en) | Optical module mounting structure |