JPS6118338B2 - - Google Patents

Info

Publication number
JPS6118338B2
JPS6118338B2 JP15259080A JP15259080A JPS6118338B2 JP S6118338 B2 JPS6118338 B2 JP S6118338B2 JP 15259080 A JP15259080 A JP 15259080A JP 15259080 A JP15259080 A JP 15259080A JP S6118338 B2 JPS6118338 B2 JP S6118338B2
Authority
JP
Japan
Prior art keywords
wafer
temperature
integrated circuit
semiconductor wafer
probe card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15259080A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5776852A (en
Inventor
Toshimi Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP15259080A priority Critical patent/JPS5776852A/ja
Publication of JPS5776852A publication Critical patent/JPS5776852A/ja
Publication of JPS6118338B2 publication Critical patent/JPS6118338B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP15259080A 1980-10-30 1980-10-30 Card for probe Granted JPS5776852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15259080A JPS5776852A (en) 1980-10-30 1980-10-30 Card for probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15259080A JPS5776852A (en) 1980-10-30 1980-10-30 Card for probe

Publications (2)

Publication Number Publication Date
JPS5776852A JPS5776852A (en) 1982-05-14
JPS6118338B2 true JPS6118338B2 (ko) 1986-05-12

Family

ID=15543765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15259080A Granted JPS5776852A (en) 1980-10-30 1980-10-30 Card for probe

Country Status (1)

Country Link
JP (1) JPS5776852A (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62154636A (ja) * 1985-12-27 1987-07-09 Hitachi Electronics Eng Co Ltd Ｃｖｄ薄膜形成装置
JP5008877B2 (ja) * 2006-02-21 2012-08-22 株式会社リコー Ｉｃテスト方法

Also Published As

Publication number Publication date
JPS5776852A (en) 1982-05-14

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