JPS6118335B2 - - Google Patents
Info
- Publication number
- JPS6118335B2 JPS6118335B2 JP55175577A JP17557780A JPS6118335B2 JP S6118335 B2 JPS6118335 B2 JP S6118335B2 JP 55175577 A JP55175577 A JP 55175577A JP 17557780 A JP17557780 A JP 17557780A JP S6118335 B2 JPS6118335 B2 JP S6118335B2
- Authority
- JP
- Japan
- Prior art keywords
- molding
- resin
- temperature
- resins
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55175577A JPS5799759A (en) | 1980-12-11 | 1980-12-11 | Manufacture of resin sealing type electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55175577A JPS5799759A (en) | 1980-12-11 | 1980-12-11 | Manufacture of resin sealing type electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5799759A JPS5799759A (en) | 1982-06-21 |
| JPS6118335B2 true JPS6118335B2 (enExample) | 1986-05-12 |
Family
ID=15998510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55175577A Granted JPS5799759A (en) | 1980-12-11 | 1980-12-11 | Manufacture of resin sealing type electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5799759A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019189826A1 (ja) | 2018-03-29 | 2019-10-03 | 朝日インテック株式会社 | カテーテル、及び、再開通カテーテルシステム |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2579142B2 (ja) * | 1984-08-22 | 1997-02-05 | 三菱電機株式会社 | 樹脂封止型半導体装置 |
-
1980
- 1980-12-11 JP JP55175577A patent/JPS5799759A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019189826A1 (ja) | 2018-03-29 | 2019-10-03 | 朝日インテック株式会社 | カテーテル、及び、再開通カテーテルシステム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5799759A (en) | 1982-06-21 |
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