JPS61182043U - - Google Patents
Info
- Publication number
- JPS61182043U JPS61182043U JP6647485U JP6647485U JPS61182043U JP S61182043 U JPS61182043 U JP S61182043U JP 6647485 U JP6647485 U JP 6647485U JP 6647485 U JP6647485 U JP 6647485U JP S61182043 U JPS61182043 U JP S61182043U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- lead
- lead terminal
- clamped
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 210000001503 joint Anatomy 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図及び第２図は、本考案のリード端子の接
合構造の断面図であり、第３図は、従来のリード
端子の接合構造の断面図である。
符号、１……金属基板、２……絶縁層、３……
導体端子部、４……リード端子、５……ハンダ、
６……リード端子固定部品、７……接着剤。
1 and 2 are sectional views of a lead terminal joining structure of the present invention, and FIG. 3 is a sectional view of a conventional lead terminal joining structure. Code, 1... Metal substrate, 2... Insulating layer, 3...
Conductor terminal part, 4...Lead terminal, 5...Solder,
6... Lead terminal fixing parts, 7... Adhesive.
Claims (1)
着剤を介して絶縁層に固定され、挾着された前記
リード端子の１部と導体端子部とをハンダにて固
着されたことを特徴とするリード端子の接合構造
。 A lead characterized in that a lead terminal fixing part with a lead terminal clamped thereon is fixed to an insulating layer via an adhesive, and a part of the clamped lead terminal and a conductor terminal part are fixed with solder. Terminal joint structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985066474U JPH034044Y2 (en) | 1985-05-07 | 1985-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985066474U JPH034044Y2 (en) | 1985-05-07 | 1985-05-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61182043U true JPS61182043U (en) | 1986-11-13 |
| JPH034044Y2 JPH034044Y2 (en) | 1991-02-01 |
Family
ID=30599413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985066474U Expired JPH034044Y2 (en) | 1985-05-07 | 1985-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH034044Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60124854A (en) * | 1983-12-09 | 1985-07-03 | Nec Corp | Hybrid integrated circuit device |
-
1985
- 1985-05-07 JP JP1985066474U patent/JPH034044Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60124854A (en) * | 1983-12-09 | 1985-07-03 | Nec Corp | Hybrid integrated circuit device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH034044Y2 (en) | 1991-02-01 |
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