JPS61182039U - - Google Patents

Info

Publication number
JPS61182039U
JPS61182039U JP1985065541U JP6554185U JPS61182039U JP S61182039 U JPS61182039 U JP S61182039U JP 1985065541 U JP1985065541 U JP 1985065541U JP 6554185 U JP6554185 U JP 6554185U JP S61182039 U JPS61182039 U JP S61182039U
Authority
JP
Japan
Prior art keywords
package substrate
conductor pin
printed wiring
flat
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985065541U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0331086Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985065541U priority Critical patent/JPH0331086Y2/ja
Publication of JPS61182039U publication Critical patent/JPS61182039U/ja
Application granted granted Critical
Publication of JPH0331086Y2 publication Critical patent/JPH0331086Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1985065541U 1985-04-30 1985-04-30 Expired JPH0331086Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985065541U JPH0331086Y2 (enExample) 1985-04-30 1985-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985065541U JPH0331086Y2 (enExample) 1985-04-30 1985-04-30

Publications (2)

Publication Number Publication Date
JPS61182039U true JPS61182039U (enExample) 1986-11-13
JPH0331086Y2 JPH0331086Y2 (enExample) 1991-07-01

Family

ID=30597629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985065541U Expired JPH0331086Y2 (enExample) 1985-04-30 1985-04-30

Country Status (1)

Country Link
JP (1) JPH0331086Y2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63285961A (ja) * 1987-05-18 1988-11-22 Ibiden Co Ltd 半導体搭載用基板
JP2010041053A (ja) * 2008-07-31 2010-02-18 Ibiden Co Ltd 半導体装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63285961A (ja) * 1987-05-18 1988-11-22 Ibiden Co Ltd 半導体搭載用基板
JP2010041053A (ja) * 2008-07-31 2010-02-18 Ibiden Co Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPH0331086Y2 (enExample) 1991-07-01

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