JPH0331086Y2 - - Google Patents

Info

Publication number
JPH0331086Y2
JPH0331086Y2 JP1985065541U JP6554185U JPH0331086Y2 JP H0331086 Y2 JPH0331086 Y2 JP H0331086Y2 JP 1985065541 U JP1985065541 U JP 1985065541U JP 6554185 U JP6554185 U JP 6554185U JP H0331086 Y2 JPH0331086 Y2 JP H0331086Y2
Authority
JP
Japan
Prior art keywords
semiconductor package
conductor pin
printed wiring
wiring board
package substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985065541U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61182039U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985065541U priority Critical patent/JPH0331086Y2/ja
Publication of JPS61182039U publication Critical patent/JPS61182039U/ja
Application granted granted Critical
Publication of JPH0331086Y2 publication Critical patent/JPH0331086Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W90/754—

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1985065541U 1985-04-30 1985-04-30 Expired JPH0331086Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985065541U JPH0331086Y2 (enExample) 1985-04-30 1985-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985065541U JPH0331086Y2 (enExample) 1985-04-30 1985-04-30

Publications (2)

Publication Number Publication Date
JPS61182039U JPS61182039U (enExample) 1986-11-13
JPH0331086Y2 true JPH0331086Y2 (enExample) 1991-07-01

Family

ID=30597629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985065541U Expired JPH0331086Y2 (enExample) 1985-04-30 1985-04-30

Country Status (1)

Country Link
JP (1) JPH0331086Y2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0815201B2 (ja) * 1987-05-18 1996-02-14 イビデン株式会社 半導体搭載用基板
US8378231B2 (en) * 2008-07-31 2013-02-19 Ibiden Co., Ltd. Semiconductor device and method for manufacturing the same

Also Published As

Publication number Publication date
JPS61182039U (enExample) 1986-11-13

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