JPS6118157A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6118157A
JPS6118157A JP13717584A JP13717584A JPS6118157A JP S6118157 A JPS6118157 A JP S6118157A JP 13717584 A JP13717584 A JP 13717584A JP 13717584 A JP13717584 A JP 13717584A JP S6118157 A JPS6118157 A JP S6118157A
Authority
JP
Japan
Prior art keywords
metal layer
bonding
substrate
sealing substrate
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13717584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0525182B2 (en:Method
Inventor
Kunizo Sawara
佐原　邦造
Kanji Otsuka
寛治 大塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13717584A priority Critical patent/JPS6118157A/ja
Publication of JPS6118157A publication Critical patent/JPS6118157A/ja
Publication of JPH0525182B2 publication Critical patent/JPH0525182B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP13717584A 1984-07-04 1984-07-04 半導体装置 Granted JPS6118157A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13717584A JPS6118157A (ja) 1984-07-04 1984-07-04 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13717584A JPS6118157A (ja) 1984-07-04 1984-07-04 半導体装置

Publications (2)

Publication Number Publication Date
JPS6118157A true JPS6118157A (ja) 1986-01-27
JPH0525182B2 JPH0525182B2 (en:Method) 1993-04-12

Family

ID=15192564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13717584A Granted JPS6118157A (ja) 1984-07-04 1984-07-04 半導体装置

Country Status (1)

Country Link
JP (1) JPS6118157A (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023511849A (ja) * 2020-01-08 2023-03-23 テキサス インスツルメンツ インコーポレイテッド 集積回路応力センサ

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0732867A (ja) * 1993-07-19 1995-02-03 Showa Alum Corp 熱交換器
JPH07190668A (ja) * 1993-12-28 1995-07-28 Showa Alum Corp 熱交換器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023511849A (ja) * 2020-01-08 2023-03-23 テキサス インスツルメンツ インコーポレイテッド 集積回路応力センサ

Also Published As

Publication number Publication date
JPH0525182B2 (en:Method) 1993-04-12

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