JPS61179862A - Continuous hot dipping method - Google Patents

Continuous hot dipping method

Info

Publication number
JPS61179862A
JPS61179862A JP60019615A JP1961585A JPS61179862A JP S61179862 A JPS61179862 A JP S61179862A JP 60019615 A JP60019615 A JP 60019615A JP 1961585 A JP1961585 A JP 1961585A JP S61179862 A JPS61179862 A JP S61179862A
Authority
JP
Japan
Prior art keywords
plating
bath
flux
alloy
long
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60019615A
Other languages
Japanese (ja)
Inventor
Takeshi Miyazaki
健史 宮崎
Satoru Takano
悟 高野
Takeshi Wakishima
脇島 健
Yoshinori Okada
岡田 良規
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP60019615A priority Critical patent/JPS61179862A/en
Publication of JPS61179862A publication Critical patent/JPS61179862A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/003Apparatus
    • C23C2/0036Crucibles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/024Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:To execute continuous hot dipping without undeposited plating by dipping a long-sized material subjected to a flux treatment into a Pb bath and into a plating bath in succession to said treatment. CONSTITUTION:The long-sized material 1 on which the flux is coated is dipped into a Pb bath 3 of a plating cell 2 via a sinker roll 5 and the surface htereof is cleaned and activated by a catalytic reaction. The long-sized material 1 is then dipped in a Zn-Al alloy plating bath 4 to bring the material 1 and the bath 4 into reaction. The plated material is pulled up while the material is squeezed by a squeegee 6. The Zn-Al alloy as the bath 4 consists preferably of 0.2-60% Al and the balance Zn and unavoidable impurities. The uniform plating layer is thus deposited on the above-mentioned material without the undeposited plating and the problem of discoloration is obviated.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、長尺材の周りに金属又は合金の溶融めっきを
連続的に施す方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method of continuously applying hot-dip plating of metal or alloy around a long material.

(背景技術) 従来、線、条、テープ、板等の長尺材をフラックスを用
いて連続的に溶融めっきを施すには、第2図に例を示す
ような方法を採っていた。図におで、めっき浴I2に浸
漬された後、カーボン、ダイス等の絞りI4により余分
のめっき材を絞り、めっきを行なっていた。13はシン
カーロールである。
(Background Art) Conventionally, in order to continuously hot-dip plate long materials such as wires, strips, tapes, and plates using flux, a method such as the one shown in FIG. 2 has been used. As shown in the figure, after being immersed in a plating bath I2, excess plating material was squeezed out using a diaphragm I4 made of carbon, dice, etc., and plating was performed. 13 is a sinker roll.

この場合、めっき未着を生じることがしばしばあった。In this case, non-plating often occurred.

例えばAQを含むZn合金めっきではAQO,2%以上
でめっき未着を生じ易かった。
For example, in Zn alloy plating containing AQ, non-plating tends to occur when the AQO is 2% or more.

この未着対策としてフラックスの組成が種々検討されて
いたが、フラックスがめつき浴と反応後もしばしば表面
に残り、めっき浴と被めっき材表面との反応を妨げるた
め、めっきの未着の原因となったり、又めっき後表面の
変色問題を生じる欠点があった。
Various flux compositions have been investigated as a countermeasure for this non-adhesion, but flux often remains on the surface even after reacting with the plating bath and prevents the reaction between the plating bath and the surface of the plated material, which may be the cause of the non-adhesion of the plating. There was also a problem of discoloration of the surface after plating.

例えば上述のAl0.2%以上を含存するZn−AQ合
金めっきは耐食性が良好であり、又めっき時にZnの合
金層を生成しないため、特に耐熱性が良好であり、開発
が望まれていたが、めっき浴表面にAQの高濃度ドロス
を生じ、このAQとフラックスが反応してAUCQaガ
スを生じ、線表面に残留するため、めっきの未着を生じ
昌り、又めっき後一方、酸化還元を利用するゼンジマー
法もこの種のめっきに利用されていたが、酸化還元に高
温処理を必要とし、高温を経るため、強度が低くなる欠
点があった。
For example, the above-mentioned Zn-AQ alloy plating containing 0.2% or more of Al has good corrosion resistance and does not produce a Zn alloy layer during plating, so it has particularly good heat resistance, and its development has been desired. , a high concentration of AQ dross is produced on the surface of the plating bath, and this AQ and flux react to produce AUCQa gas, which remains on the wire surface, resulting in non-adhesion of the plating and, on the other hand, oxidation-reduction after plating. The Sendzimer method has also been used for this type of plating, but it requires high-temperature treatment for oxidation-reduction and has the drawback of low strength due to the high temperature.

(発明の開示) 本発明は、上述の事情に鑑み成されたもので、めっきの
未着の原因となるめっき浴とフラックスの反応を無クシ
、めっきの未着、変色問題を生ぜず、高温を経ず、高強
度であり、耐食性、耐熱性が良好なめっき材の製造が可
能な長尺材の連続溶融めっき方法を提供せんとするもの
である。
(Disclosure of the Invention) The present invention has been made in view of the above-mentioned circumstances. It is an object of the present invention to provide a method for continuous hot-dip plating of long materials, which can produce a plating material with high strength, good corrosion resistance, and heat resistance without undergoing any process.

本発明は、フラックスを用いて長尺材に連続的に溶融め
っきを施す方法において、フラックス処理後Pb浴に浸
漬し、引続きめっき浴に浸漬することを特徴とする連続
溶融めっき方法である。
The present invention is a continuous hot-dip plating method for continuously hot-dipping a long material using flux, which is characterized by immersing the material in a Pb bath after flux treatment, and then immersing it in a plating bath.

本発明において、長尺材とは線、条、テープ、板等の長
尺物で、例えばCu+ AQ+ Fe+ N+もしくは
それらの合金、Nb−Ti等の金属もしくはその合金、
又はそれらの複合材である。
In the present invention, a long material is a long material such as a wire, strip, tape, plate, etc., such as Cu+ AQ+ Fe+ N+ or an alloy thereof, a metal such as Nb-Ti or an alloy thereof,
Or a composite material thereof.

又それらの周りに溶融めっきする金属は、例えばZn+
 AQ+ Sn+ Cu+ Pb又はそれらの合金であ
る。
The metal to be hot-dipped around them is, for example, Zn+
AQ+ Sn+ Cu+ Pb or an alloy thereof.

特に本発明は、従来めっきの未着の生じ易かった鉄合金
、Fe−Ni合金(例、インバー)等上のZn−AQ合
金めっきに有効である。
In particular, the present invention is effective for Zn-AQ alloy plating on iron alloys, Fe-Ni alloys (eg, invar), etc., which have conventionally been prone to non-plating.

以下、本発明を図面を用いて実施例により説明する。第
1図は本発明方法の実施例を説明するための断面図であ
る。図において、1は予め脱脂、酸洗、フラックス処理
等により表面にフラックスを塗布された長尺材である。
Hereinafter, the present invention will be explained by examples using the drawings. FIG. 1 is a sectional view for explaining an embodiment of the method of the present invention. In the figure, 1 is a long material whose surface has been coated with flux by degreasing, pickling, flux treatment, etc. in advance.

2はめっき槽で、その下部にPb浴3を収容し、その出
口に、例えばZn−AQ合金めっき浴4を浮べたもので
ある。フラックス塗布された長尺材1は先ずPb浴3に
浸漬され、接触反応することにより、表面を清浄で活性
な表面にされる。清浄で活性な表面にされた長尺材1は
引続きZn−Af1合金めっき浴4に浸漬され、素材と
めっき浴が反応し、絞り6で絞られて引上げられること
により、めっきの未着を生ぜず、均一なめっき層を付着
することができる。5はシンカーロールである。
Reference numeral 2 denotes a plating tank, in which a Pb bath 3 is accommodated in the lower part, and a Zn-AQ alloy plating bath 4, for example, is floated at the outlet thereof. The long material 1 coated with flux is first immersed in a Pb bath 3 and subjected to a contact reaction, thereby making the surface clean and active. The long material 1 with a clean and active surface is then immersed in the Zn-Af1 alloy plating bath 4, the material and the plating bath react, and the material is squeezed and pulled up by the aperture 6, thereby causing non-plating. Therefore, a uniform plating layer can be deposited. 5 is a sinker roll.

めっき浴としてZn−Al!合金を用いる場合は、Al
0.2〜60%を含打し、残部がZnと不可避的な不純
物から成ることが好ましい。AQ O,2%未溝ではそ
の主たる目的である耐熱性、耐食性の効果が期待できず
、AQが1i0%を越えると耐熱性向上の効果が飽和し
、又合金溶湯の粘性が高くなり、溶融めっき時の外観不
良が著しくなる。
Zn-Al as a plating bath! When using an alloy, Al
It is preferable that 0.2 to 60% be impregnated, with the remainder consisting of Zn and unavoidable impurities. If AQ O, 2% is not grooved, the main purpose of improving heat resistance and corrosion resistance cannot be expected, and if AQ exceeds 1i0%, the effect of improving heat resistance will be saturated, and the viscosity of the molten alloy will increase, making it difficult to melt. Appearance defects during plating become significant.

法により鋼線にZn−Af1合金溶融めっきを施した。The steel wire was hot-dipped with Zn-Af1 alloy by the method.

直径3.0m−の鋼線を温度460℃のPb浴を通して
脱脂し、水冷した後、20%HCR溶液中で酸洗し、水
洗し、60℃に加熱したZnCQ2v NH4CQ混合
フラフクス溶液中に浸漬した後、乾燥した。
A steel wire with a diameter of 3.0 m was degreased through a Pb bath at a temperature of 460 °C, cooled with water, pickled in a 20% HCR solution, washed with water, and immersed in a ZnCQ2v NH4CQ mixed flux solution heated to 60 °C. After that, it was dried.

この線を、従来例は第Φ図に示すZn−AQ 5%合金
めっき浴!2に浸漬した後、カーボン絞りを施し、又本
発明例で第8図に示すPb浴3、引続きZn−AQ 5
%合金めっき浴4に浸漬した後、カーボン絞りを施した
。合金めっき浴の温度は共に420℃とした。
The conventional example is a Zn-AQ 5% alloy plating bath shown in Fig. Φ! After soaking in Pb bath 3 shown in FIG.
% alloy plating bath 4, carbon squeezing was performed. The temperature of both alloy plating baths was 420°C.

従来例では、めっき浴入口表面上でフラックスが反応し
、めっきには黒点状未着が多数発生した。
In the conventional example, the flux reacted on the surface of the inlet of the plating bath, resulting in many black spots on the plating.

本発明例では、Pb浴入口表面上でフラックスが反応し
、合金めっき浴表面では反応物が浮上せず、めっきには
未着を生ぜず、均一で、光沢のあるめっき線を得ること
ができた。
In the example of the present invention, the flux reacts on the surface of the Pb bath inlet, the reactants do not float on the surface of the alloy plating bath, no unattached plating occurs, and it is possible to obtain a uniform and shiny plating line. Ta.

(発明の効果) 上述のように構成された本発明の連続溶融めっき方法は
次のような効果がある。
(Effects of the Invention) The continuous hot-dip plating method of the present invention configured as described above has the following effects.

(イ)フラックスを用いる連続溶融めっき方法において
、フラックス処理後Pb浴に浸漬することにより、Pb
浴とフラックスが反応し、長尺材表面を清浄で活性な表
面とし、引続きめっき浴に浸漬することにより、清浄で
活性な表面を有する素材とめっき浴が反応し、フラック
スがめつき浴と反応しないため、めっきの未着を生ぜず
、又めっき後フラックス反応物の残留がなく、変色問題
を生ぜず、均一なめっき材を製造し得る。
(a) In the continuous hot-dip plating method using flux, by immersing in a Pb bath after flux treatment, Pb
The bath and flux react to make the surface of the long material a clean and active surface, and by subsequent immersion in the plating bath, the material with a clean and active surface reacts with the plating bath, and the flux does not react with the plating bath. Therefore, there is no non-adhesion of plating, there is no residual flux reactant after plating, there is no discoloration problem, and a uniformly plated material can be produced.

(0)前処理に、ゼンジマー法のような高温処理を必要
としないので、めっきにより強度が低下せず高強度のめ
っき材が得られる。
(0) Since high-temperature treatment such as the Sendzimer method is not required for pretreatment, a high-strength plated material can be obtained without decreasing strength due to plating.

(ハ)本発明方法はPb浴を設置するのみで実施できる
ので、未首の生じ易かっためっきが簡便にできる。
(c) Since the method of the present invention can be carried out by simply installing a Pb bath, plating that tends to cause undulating can be easily performed.

(ニ)めっき金属としてAQを含をするZn合金を用い
る場合には、特にフラックスが合金洛中のAQと反応せ
ず、未若のないZn−AU合金めっき材が容易に得られ
ると共に、AQを高濃度にできるため、耐食性、耐熱性
の優れためっき材の製造が可能となる。
(d) When a Zn alloy containing AQ is used as the plating metal, the flux does not react with the AQ in the alloy, and a Zn-AU alloy plated material with no defects can be easily obtained, and the AQ can be easily obtained. Since it can be made at a high concentration, it is possible to manufacture plating materials with excellent corrosion resistance and heat resistance.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明方法の実施例を説明するための断面図で
ある。 第2図は従来のめっき方法の例を説明するため断面図で
ある。 L 、II・・・長尺材、2・・・めっき槽、3・・・
Pb浴、4・・・Zn−AQ合金めっき浴%5113・
・・シンカーロール、8.14・・・絞り、!2・・・
めっき浴。 第 1 図 第2図
FIG. 1 is a sectional view for explaining an embodiment of the method of the present invention. FIG. 2 is a cross-sectional view for explaining an example of a conventional plating method. L, II... Long material, 2... Plating tank, 3...
Pb bath, 4...Zn-AQ alloy plating bath%5113.
...Sinker roll, 8.14...Aperture,! 2...
Plating bath. Figure 1 Figure 2

Claims (2)

【特許請求の範囲】[Claims] (1)フラックスを用いて長尺材に連続的に溶融めっき
を施す方法において、フラックス処理後Pb浴に浸漬し
、引続きめっき浴に浸漬することを特徴とする連続溶融
めっき方法。
(1) A continuous hot-dip plating method in which a long material is continuously hot-dipped using flux, which comprises immersing it in a Pb bath after flux treatment, and then immersing it in a plating bath.
(2)めっき浴が、Al0.2〜60%を含有し、残部
がZnと不可避的な不純物から成る特許請求の範囲第1
項記載の連続溶融めっき方法。
(2) Claim 1 in which the plating bath contains 0.2 to 60% Al, with the remainder consisting of Zn and unavoidable impurities.
Continuous hot-dip plating method described in section.
JP60019615A 1985-02-04 1985-02-04 Continuous hot dipping method Pending JPS61179862A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60019615A JPS61179862A (en) 1985-02-04 1985-02-04 Continuous hot dipping method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60019615A JPS61179862A (en) 1985-02-04 1985-02-04 Continuous hot dipping method

Publications (1)

Publication Number Publication Date
JPS61179862A true JPS61179862A (en) 1986-08-12

Family

ID=12004088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60019615A Pending JPS61179862A (en) 1985-02-04 1985-02-04 Continuous hot dipping method

Country Status (1)

Country Link
JP (1) JPS61179862A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5834825A (en) * 1995-12-27 1998-11-10 Nec Corporation Semiconductor device having spiral wiring directly covered with an insulating layer containing ferromagnetic particles
KR20040028123A (en) * 2002-09-30 2004-04-03 배달향 method for hot-dip plating of aluminium or aluminium alloy on steel products with prominence and depression
JP2013036070A (en) * 2011-08-05 2013-02-21 Masuda Sanso Kogyosho:Kk Method for forming intermetallic compound layer and molten metal processing member

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5834825A (en) * 1995-12-27 1998-11-10 Nec Corporation Semiconductor device having spiral wiring directly covered with an insulating layer containing ferromagnetic particles
KR20040028123A (en) * 2002-09-30 2004-04-03 배달향 method for hot-dip plating of aluminium or aluminium alloy on steel products with prominence and depression
JP2013036070A (en) * 2011-08-05 2013-02-21 Masuda Sanso Kogyosho:Kk Method for forming intermetallic compound layer and molten metal processing member

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