JPS61172396A - Manufacture of hybrid ic device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD The present invention relates to a method of manufacturing a hybrid integrated circuit device having a plurality of hybrid integrated circuit patterns.

[Background technology]

When making a hybrid integrated circuit device with multiple structures by sharing some of the external connection terminals of two different hybrid integrated circuit mounting boards, conventionally, circuit formation and mounting were performed separately on the two types of boards, and the common external connection terminals were For the first time, at the stage of installing the connection terminals, separate two
Since two mounting boards are combined and it is then possible to check the function as one circuit block, there is a problem that if only one circuit board is defective, both boards are ruined. In order to prevent this problem, a method is used in which only one circuit board is checked in advance using a measurement circuit that incorporates the other standard circuit board, but if delicate constant adjustments are required, the above-mentioned check can be performed. There was a drawback in that even if boards that passed the test were combined, the electrical characteristics would be defective.

[Purpose of the invention]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a technique that can facilitate adjustment of the electrical characteristics of separate hybrid integrated circuit patterns that are combined in advance, in order to eliminate these drawbacks.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical devices among the devices disclosed in this application is as follows.

That is, a plurality of hybrid integrated circuit patterns are provided on one insulating substrate, and common external connection terminal attachment electrodes of these hybrid integrated circuit patterns are electrically connected, and separate hybrid integrated circuit patterns are combined in advance. After adjusting the electrical characteristics of the hybrid integrated circuit, the hybrid integrated circuit is divided into individual hybrid integrated circuit patterns, and two predetermined hybrid integrated circuits are combined to form a device.

[Structure of the invention]

Hereinafter, the configuration of the present invention will be explained along with examples.

In addition, in all the figures for explaining the embodiment, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

1 and 2 are diagrams for explaining a method of manufacturing a hybrid integrated circuit device according to an embodiment of the present invention, and FIG.
FIG. 2 is a plan view showing a schematic configuration of a hybrid integrated circuit board before division, in which a plurality of hybrid integrated circuit patterns are provided on one insulating substrate.

FIG. 2 is a cross-sectional view of a hybrid integrated circuit device in which two insulating substrates having a plurality of hybrid integrated circuit patterns are combined.

In FIGS. 1 and 2, reference numeral 1 denotes a board for mounting a hybrid integrated circuit, and a board made of, for example, 96% alumina (AQ203) is used. This hybrid integrated circuit mounting board 1
Above are two hybrid integrated circuit pattern areas 3A and 4A, 3B and 4B, and 3C, with electrodes 2 for attaching external connection terminals facing each other.
and 40. formed over 3D and 4D, respectively.
In Figure 1, other parts other than the external connection terminal mounting electrode 2 are omitted, but the hybrid integrated circuit patterns may be the same or different, and even if the hybrid integrated circuit patterns are the same, they can be mounted. Whether there are parts or not.

The types and quantities may be different.

In addition, the hybrid integrated circuit pattern, as shown in FIG.
A large number of patterns having the same combination may be lined up.

Next, in the state shown in FIG. 1 before the external connection terminal 6 is attached, each hybrid integrated circuit pattern area 3A and 4A,
Adjust the electrical characteristics of 3B and 4B, 3G and 40.3D and 4D.

After adjusting the electrical characteristics, the hybrid integrated circuit board 1 shown in FIG. 1 is divided along the hybrid integrated circuit pattern dividing line 5, and the 21i! As shown in iI, for example, two hybrid integrated circuit pattern areas 3A and 4A (3B and 4B, 3
By combining the hybrid integrated circuit boards 3 and 4 consisting of C, 40.8D, and 4D), attaching the external connection terminal 6 to the external connection terminal attachment electrode 2, and coating it with the coating agent 7, a hybrid integrated circuit device is obtained. is completed.

In addition, in FIG. 2, 8 is an electronic component.

〔effect〕

As explained above, according to the present invention, the following effects can be obtained.

(1) A plurality of hybrid integrated circuit patterns are provided on one insulating substrate, and the electrical characteristics of each hybrid integrated circuit are determined by connecting the hybrid integrated circuit patterns using a common external connection terminal mounting electrode 2. After adjustment, the electrical characteristics of each hybrid integrated circuit can be easily adjusted within the same plane by dividing the hybrid integrated circuit into patterns and combining a plurality of predetermined hybrid integrated circuits to form a device. This makes it easy to adjust functions.

(2) According to (1) above, the electrical characteristics can be checked at an early stage after mounting.

(3) According to (1) above, it is possible to eliminate defects while the added value is small, so production costs can be reduced.

(4) According to the above (1), whereas conventionally two sets of ceramic plate cantilevers and mask patterns were required, the present invention requires only one set, so development costs can be reduced.

The present invention has been specifically explained above using examples.
It goes without saying that the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the spirit thereof.

[Brief explanation of the drawing]

1 and 2 are diagrams for explaining a method of manufacturing a hybrid integrated circuit device according to an embodiment of the present invention. FIG. FIG. 2 is a plan view showing a schematic configuration of the hybrid integrated circuit board provided above before division; FIG. be. In the figure, 1... Substrate for mounting hybrid integrated circuit, 2... Electrode for attaching external connection terminal, 3, 4... Hybrid integrated circuit pattern, 5... Hybrid integrated circuit pattern dividing line, 6...・External connection terminal, 7...Coating agent, 8...Electronic components Figure 1 Figure 2

Claims (1)

[Claims] In a method for manufacturing a hybrid integrated circuit device in which two hybrid integrated circuit mounting boards each having a hybrid integrated circuit pattern formed on an insulating substrate such as alumina are combined into one circuit block, a plurality of hybrid integrated circuit patterns are formed on an insulating substrate such as alumina. are installed on one insulating substrate, the common external connection terminal mounting electrodes of those hybrid integrated circuit patterns are electrically connected, and the electrical characteristics of each hybrid integrated circuit pattern are adjusted. 1. A method of manufacturing a hybrid integrated circuit device, comprising dividing the device into patterns and combining a plurality of predetermined hybrid integrated circuit patterns to form the device.