JPS61170916A - Production of magnetic head - Google Patents

Abstract

PURPOSE:To improve the adhesive property by placing a protective glass plate on a protruding pattern provided on a protective film, and pressing the plate on the pattern. CONSTITUTION:Many thin film magnetic head patterns 9 are formed on a wafer 1 consisting, for example, of a ceramic, etc., and a protective film 10 is formed thereon by sputtering Al, etc. Alumina, SiO2, etc. are vapor-deposited on the film 10 to provide a protruding pattern 14 having specified height, a protective glass plate 12 is set on the protruding pattern 14, and then an adhesive (a resin 13) is filled. A weight 17 is placed on a cut pattern 16, and the adhesive is cured in a furnace to form a solid adhered film. The wafer protective film 10 formed in not affected by the thickness distribution of the protective film where the central part is thick and both ends are thin, the adhesive is uniformly distributed between the protective glass plate 12 and the wafer 1 because of the protruding pattern 14, and the thickness of the resin 13 is made uniform to improve the adhesive strength.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is applied to manufacturing a magnetic head mounted on a magnetic device by creating a protrusion pattern at a constant height on the surface of a protective film provided on a wafer. , relates to a method of manufacturing a magnetic head in which the adhesive film thickness of a protective glass plate is made uniform.

A magnetic device is equipped with a magnetic head, and the magnetic head writes/reads information onto/from a recording medium.

For example, there is a magnetic head as shown in FIG. 3. FIG. 3 is a cross-sectional perspective view illustrating the structure of the thin film magnetic head.

In the figure, a magnetic head A has a lower magnetic layer 2, a coil 3 made of a conductive layer, an upper magnetic layer 5, and an insulator 4 laminated on a substrate 1 made of ceramic or the like, and further has a gap 6 at the tip for reading/writing. has. For further protection, a protective glass 7 is bonded to the surface with an adhesive 8.

Since the magnetic head A is protected by the protective glass 7, it is desirable that the protective glass 7 be firmly adhered so that it will not peel off during the use of the magnetic head A or during the manufacturing process.

[Conventional technology]

Conventionally, the protective glass 7 of the magnetic head is bonded by forming a large number of thin film magnetic head patterns 9 on a wafer (substrate) l by making full use of sputtering and etching techniques, as shown in FIG. In order to protect the thin film magnetic head pattern 9,
A protective film 10 made of alumina or the like is applied thereon by sputtering, spacers 11 are placed on both ends of the wafer 1, and a protective glass 12 is placed on top and bonded with resin 13.

Although not shown in the drawings, the wafer formed as described above is cut by mechanical processing, separated into individual pieces, and subjected to finishing processing to form a magnetic head.

[Problem that the invention seeks to solve]

Conventionally, it takes an enormous amount of time to form the protective glass for the magnetic head by sputtering with a thickness of 1 to 2 mm, so a thin protective film 9 of alumina or the like is formed on the wafer by sputtering. ') Place a plastic spacer 11 on both ends of 1, and place a protective glass plate 12 on top of the resin 13.
It was glued on.

However, since the protective film 10 is formed by sputtering, it is thick at the center and thin at both sides, as shown in FIG.

Therefore, if spacers 11 are placed on both ends of the spacer, and a temporary protective glass 12 (0.4 mm thick) is placed on top of it and bonded with resin 13, the resin at the center becomes thin (2 μm thick at the center).
. As a result, the adhesiveness of the protective glass 12 becomes weak at the center (it tends to peel off when the resin thickness of the adhesive is less than 5 μm), and this causes problems such as peeling off during the process of cutting and separating the wafers individually by mechanical processing and applying finishing processing. there were.

[Means for solving problems]

The above problem can be solved by manufacturing the magnetic head of the present invention in which a protrusion pattern of a certain height is provided on the protective film of the magnetic nodal pattern formed on the substrate, a protective glass plate is placed on the protrusion pattern, pressure is applied, and resin is bonded. Solved by method.

[Effect]

That is, by creating a protrusion pattern on the wafer protective film, placing the protective glass on top and bonding it with resin, the distribution of the wafer protective film (thick in the center and thin at both ends) is affected.
The resin in the center has a uniform thickness without becoming thin. Since the protrusion pattern is also formed by sputtering or the like, the adhesion is improved, unlike spacer adhesion, and there is no peeling during the process of cutting the wafer, separating it into individual pieces, and applying finishing processing.

〔Example〕
- Hereinafter, the gist of the present invention will be specifically explained with reference to the drawings.

FIGS. 1(A) and 1(B) are diagrams showing one embodiment of the present invention.
(a) is a plan view, (b) is a sectional view, and FIG. 2 is an enlarged view of the protrusion pattern of the present invention. Note that common symbols throughout the plan are the same object.

In the figure, a wafer (substrate) made of ceramic etc.
A large number of thin film magnetic head patterns 9 are formed on top of the pattern by making full use of sputtering technology and etching technology, and a protective film 10 is formed by sputtering alumina or the like on top of the pattern.
A protrusion pattern 14 of a constant height is provided by vapor-depositing 5IO2, etc., and a protective glass plate 12 is placed on the protrusion pattern 14 using a jig 1.
5 and then apply adhesive (resin 13).
Fill it. A strong adhesive film is formed by placing a weight 17 of about 100 gr on the cutting pattern 16 and curing it in an IH oven at 120°C.

As described above, the protrusion pattern 14 is formed on the wafer protective film 10.
By creating a wafer protective film 10 formed by sputtering, the protective glass temporary 12 and the base v are not affected by the protective film distribution, which is thick at the center and thin at both ends.
The distance between the i (wafers) 1 is made uniform by the protrusion pattern 14, and the thickness of the resin 13 becomes constant, so that the adhesive strength is improved.

In addition, a protrusion pattern 1 is formed by vapor deposition on the wafer protective film lo.
4, the adhesion is strong and does not have poor adhesion like conventional spacers.

Therefore, there is no possibility of delamination during the process of cutting the wafer by machining, separating the wafers into individual pieces, and applying finishing processes.

In addition, the formation of the above-mentioned protrusions is performed using a cutting marker for individually cutting the magnetic heads 18 formed on the wafer 1 (indicated by four points in the figure, only one magnetic head 18 is shown, and the others are omitted). 19 to a certain height.

The same thing applies if you press the button.

〔Effect of the invention〕

As explained above, according to the present invention, by forming the protrusion pattern on the wafer protective film, the protective glass can be bonded uniformly without being affected by the wafer protective film distribution.
Peeling during wafer processing or protective glass processing can be prevented.

[Brief explanation of drawings]

FIGS. 1(A) and 1(B) are diagrams showing one embodiment of the present invention.
A) is a plan view, (B) is a cross-sectional view, FIG. 2 is an enlarged view of the protrusion pattern of the present invention, FIG. 3 is a cross-sectional perspective view explaining the structure of a thin-film magnetic head, and FIG. 4 is a conventional magnetic head. FIG. 5 is a cross-sectional view illustrating a method of adhering the protective glass 7 on the wafer. FIG. In the figure, 1 is a wafer, 9 is a thin film magnetic head, 10 is a protective film, 12 is a protective glass plate, 13 is a resin, 14 is a projection pattern, 15 is a jig, 16 is a cutting pattern, 17 is a weight, and 18 is a magnetic head , SondoZ yfI5 Figure

Claims (1)

[Claims] In the step of providing a protective film on a magnetic head pattern formed on a substrate and bonding a protective glass plate onto the protective film, a protrusion pattern of a certain height is provided on the protective film, and the protrusion pattern is placed on the protrusion pattern. A method of manufacturing a magnetic head, characterized by placing a protective glass plate on it, applying pressure, and bonding it with resin.