JPS61170673A - Automatic handler for automatic measurement for semiconductor integration circuit device - Google Patents

Abstract

PURPOSE:To make common the measuring heads of various types by positioning probe pins serving as electrodes to the end face of the measuring head, pegging the pins to the end face and pressing the probe pins to the leads of an IC from the longitudinal direction thereof thereby connecting electrically the pins and the leads. CONSTITUTION:Each probe pin 1 consists of a cylindrical holder 7, a contact pin 6 which slides vertically under the guide of the holder 7 and a spring 8 which energized downward the pin 6. Plural pieces of the probe pins 1 are positioned to the bottom end face of the measuring head 5 and are pegged thereto. The construction of the measuring heads of a DIP type and PGA type is thus made common.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor integrated circuit device (IC) lead and an I.
This invention relates to an autohandler that electrically connects an LSI tester that performs electrical measurements of C.

[Conventional technology]

Conventionally, autohandlers used in systems that automatically perform electrical measurements on semiconductor integrated circuit devices (ICs) have mainly been for DIP-type packages, and as shown in Figure 5, the 747 cage 3 I brought out more
The electrode 5a of the measurement head 5 was brought into contact with the lead 2 of C from the outside. A guide 4 is used to supply the i4 cage, and when the IC is set at the measurement position, it is sandwiched between the electrodes 5 on both sides and electrically connected to the LSI tester to perform measurement.

[Problem that the invention seeks to solve]

In recent years, as the scale of semiconductor integrated circuit devices has increased, the number of pins has increased, and it is expected that the number of pins will increase further in the future. As the number of pins in large-scale semiconductor integrated circuit devices increases, the mainstream of arm cages is shifting from the DIP type to the PGA type, and the PGA type is rapidly increasing.

Current autohandlers that sandwich the leads between electrodes cannot maintain electrical contact with the IC leads pulled out from the PGA type package.

Furthermore, even in the case of the DIP type, it was necessary to prepare and use dedicated electrodes depending on the number of pins.

[Means for solving problems]

The present invention provides an auto-handler that electrically connects an IC and an LSI tester that performs electrical measurements of the IC by bringing the electrodes into contact with the leads of the IC pulled out from the package. As, I.C.
An auto for automatic measurement of semiconductor integrated circuit devices, characterized in that a plurality of probe pins are positioned and planted on the end face of a measurement head using probe pins biased by a spring that are brought into contact with the tip of a lead. A handler.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, the present invention uses probe pins 1 as electrodes brought into contact with IC leads 2 drawn out from a package 3.

The probe pin 1 is attached to a cylindrical holder 7 as shown in FIG.
The contact pin 6 is guided by the holder 7 and slides up and down, and the spring 8 biases the contact pin 6 downward.

In the present invention, a plurality of probe pins 1 are provided, and the plurality of globe pins 1 are positioned and implanted on the lower end surface of the measurement head 5. As shown in FIG. 4, if the globe pins 1 are arranged in a rectangular manner in accordance with the lead pitch drawn out from the PGA/package, automatic measurement of the same type of PGA package becomes possible.

In the embodiment, in order to measure the electrical characteristics of an IC as shown in FIG. 3, the measurement head 5 is set with the probe pin 1 facing downward. On the other hand, the package 3 is conveyed by the guide 4 to just below the head 5 with the IC leads 2 facing upward. Next, push up the IC together with the guide 4 using the cylinder 9.
The tip of the lead 2 of the IC is pressed against the glove pin 1, and the lead 2 of the lock cage and the glove pin 1 are electrically connected, and the electrical connection is made by inputting from the IC tester. After making the connections, make electrical measurements. Thereafter, this process is repeated and electrical measurements of the IC are continuously performed.

For semiconductor integrated circuit devices that use the same type of cable or cage, even if the size and number of pins change, if you use the probe pin array, you can simply replace the guide 4''f: without replacing the electrodes. Automatic measurement is possible.

In the embodiment, a PGA type is used, but a DIP type can be used as well.

Note that the present invention does not impose any limitations on the method of transporting the semiconductor integrated circuit device to the probe pin array or the method of pressing the semiconductor integrated circuit device onto the probe pin array.

〔Effect of the invention〕

As explained above, according to the present invention, probe pins serving as electrodes are positioned and implanted on the end face of the measurement head, and the probe pins are brought into contact with the leads of the IC from the length direction to electrically Since the DIP type and PGA type have the same measurement head structure by simply changing the pin arrangement, they can be used for automatic measurement of PGA type ICs, which are becoming mainstream, and are also identical. In the case of an IC using a type of package, even if the size and number of pins change, automatic measurement can be performed using a negative measuring head.

[Brief explanation of drawings]

Fig. 1 is a configuration diagram showing an embodiment of the measuring head section of the present invention, Fig. 2 is an enlarged view of the connection part between the lead and the globe pin of a semiconductor integrated circuit device, and Fig. 3 is a diagram showing the embodiment of the measuring head section of the present invention. FIG. 4 is a plan view showing globe pins arranged in a rectangular array, and FIG. 5 is a configuration diagram showing the measuring head section of a conventional autohandler. 1... Probe pin, 2... IJ-)', 3...
Nogutsu cage, 4...guide, 5...electrode, 6...
・Contact pin, 7...Holder, 8...Spring, 9...Cylinder. 3 parts Figure 4 Figure 5

Claims (1)

[Claims] (1) In an autohandler that electrically connects an IC and an LSI tester that performs electrical measurements of the IC by bringing the electrode into contact with the lead of the IC pulled out from the package, as the electrode, For automatic measurement of semiconductor integrated circuit devices, characterized in that a plurality of probe pins are positioned and planted on the end face of a measurement head using probe pins biased by a spring that are brought into contact with the tip of an IC lead. auto handler.