JPS61168674U - - Google Patents

Info

Publication number
JPS61168674U
JPS61168674U JP18036184U JP18036184U JPS61168674U JP S61168674 U JPS61168674 U JP S61168674U JP 18036184 U JP18036184 U JP 18036184U JP 18036184 U JP18036184 U JP 18036184U JP S61168674 U JPS61168674 U JP S61168674U
Authority
JP
Japan
Prior art keywords
pattern
automatic alignment
conductor
insulating glass
mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18036184U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18036184U priority Critical patent/JPS61168674U/ja
Publication of JPS61168674U publication Critical patent/JPS61168674U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例、第2図、第3図は
従来実施例をそれぞれ示すパターン図である。 1……黒色絶縁ガラスによる下地パターン、2
……導体による目合せパターン、3……ワイヤボ
ンデイングする導体パターン、4……抵抗ペース
トによる下地パターン、5……抵抗ペースト等黒
色材料による目合せパターン。
FIG. 1 is a pattern diagram showing one embodiment of the present invention, and FIGS. 2 and 3 are pattern diagrams showing conventional embodiments. 1... Base pattern made of black insulating glass, 2
... Alignment pattern using a conductor, 3... Conductor pattern for wire bonding, 4... Base pattern using resistance paste, 5... Alignment pattern using a black material such as resistance paste.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 黒色の絶縁ガラスパターンの上に、ワイヤボン
デイング自動目合せ用のマークをワイヤボンデイ
ングする導体と同一印刷で形成した導体ペースト
で構成したことを特徴とする混成集積回路基板の
自動目合せパターン。
An automatic alignment pattern for a hybrid integrated circuit board, characterized in that a mark for automatic alignment in wire bonding is formed on a black insulating glass pattern using a conductor paste formed with the same printing as the conductor to be wire bonded.
JP18036184U 1984-11-28 1984-11-28 Pending JPS61168674U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18036184U JPS61168674U (en) 1984-11-28 1984-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18036184U JPS61168674U (en) 1984-11-28 1984-11-28

Publications (1)

Publication Number Publication Date
JPS61168674U true JPS61168674U (en) 1986-10-20

Family

ID=30737919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18036184U Pending JPS61168674U (en) 1984-11-28 1984-11-28

Country Status (1)

Country Link
JP (1) JPS61168674U (en)

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