JPS61168235A - ボンデイング強度試験装置 - Google Patents

ボンデイング強度試験装置

Info

Publication number
JPS61168235A
JPS61168235A JP60008832A JP883285A JPS61168235A JP S61168235 A JPS61168235 A JP S61168235A JP 60008832 A JP60008832 A JP 60008832A JP 883285 A JP883285 A JP 883285A JP S61168235 A JPS61168235 A JP S61168235A
Authority
JP
Japan
Prior art keywords
tool
sensor
sample stage
load
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60008832A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0347582B2 (enExample
Inventor
Kiyou Takeshita
竹下　鞏
Tokuji Noura
野浦　徳治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rhesca Co Ltd
Original Assignee
Rhesca Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rhesca Co Ltd filed Critical Rhesca Co Ltd
Priority to JP60008832A priority Critical patent/JPS61168235A/ja
Publication of JPS61168235A publication Critical patent/JPS61168235A/ja
Publication of JPH0347582B2 publication Critical patent/JPH0347582B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques

Landscapes

  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP60008832A 1985-01-21 1985-01-21 ボンデイング強度試験装置 Granted JPS61168235A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60008832A JPS61168235A (ja) 1985-01-21 1985-01-21 ボンデイング強度試験装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60008832A JPS61168235A (ja) 1985-01-21 1985-01-21 ボンデイング強度試験装置

Publications (2)

Publication Number Publication Date
JPS61168235A true JPS61168235A (ja) 1986-07-29
JPH0347582B2 JPH0347582B2 (enExample) 1991-07-19

Family

ID=11703755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60008832A Granted JPS61168235A (ja) 1985-01-21 1985-01-21 ボンデイング強度試験装置

Country Status (1)

Country Link
JP (1) JPS61168235A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0772036A3 (en) * 1995-10-31 1998-05-13 Gerold Staudinger Apparatus for testing bonds between an (electric) element and a support provided with conducting tracks
EP1187190A1 (en) * 2000-09-11 2002-03-13 Marconi Communications GmbH Method for monitoring the length of constant-wire-length bonds & apparatus therefor
JP2004311991A (ja) * 2003-04-04 2004-11-04 Hesse & Knipps Gmbh ワイヤボンディング接合部を検査するための方法および装置
WO2005114722A1 (en) * 2004-05-18 2005-12-01 Dage Precision Industries Ltd. Test apparatus
JP2007530936A (ja) * 2004-03-22 2007-11-01 デイジ プレシジョン インダストリーズ リミテッド 高速引張り試験装置及び方法
JP4852041B2 (ja) * 2004-08-10 2012-01-11 デイジ プレシジョン インダストリーズ リミテッド 剪断試験装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5215736U (enExample) * 1975-07-22 1977-02-03
JPS5316284U (enExample) * 1976-07-22 1978-02-10

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5215736U (enExample) * 1975-07-22 1977-02-03
JPS5316284U (enExample) * 1976-07-22 1978-02-10

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0772036A3 (en) * 1995-10-31 1998-05-13 Gerold Staudinger Apparatus for testing bonds between an (electric) element and a support provided with conducting tracks
EP1187190A1 (en) * 2000-09-11 2002-03-13 Marconi Communications GmbH Method for monitoring the length of constant-wire-length bonds & apparatus therefor
US6661525B2 (en) 2000-09-11 2003-12-09 Marconi Communications Gmbh Method for monitoring the length of constant-wire-length bonds and apparatus therefor
JP2004311991A (ja) * 2003-04-04 2004-11-04 Hesse & Knipps Gmbh ワイヤボンディング接合部を検査するための方法および装置
JP2007530936A (ja) * 2004-03-22 2007-11-01 デイジ プレシジョン インダストリーズ リミテッド 高速引張り試験装置及び方法
WO2005114722A1 (en) * 2004-05-18 2005-12-01 Dage Precision Industries Ltd. Test apparatus
JP2007538242A (ja) * 2004-05-18 2007-12-27 デイジ プレシジョン インダストリーズ リミテッド 試験装置
US7555961B2 (en) 2004-05-18 2009-07-07 Nordson Corporation Test apparatus
JP4852041B2 (ja) * 2004-08-10 2012-01-11 デイジ プレシジョン インダストリーズ リミテッド 剪断試験装置

Also Published As

Publication number Publication date
JPH0347582B2 (enExample) 1991-07-19

Similar Documents

Publication Publication Date Title
US8424390B2 (en) Clamping mechanism for shear testing apparatus
US6758385B2 (en) Apparatus for performing a pull test
US7688096B2 (en) Contact load measuring apparatus and inspecting apparatus
JP2017227475A (ja) 硬さ試験機
US6185999B1 (en) Mini-tension tester
CN108627388A (zh) 一种瞬时冲击力的测量方法
EP0772036A2 (en) Apparatus for testing bonds between an (electric) element and a support provided with conducting tracks
US7021155B2 (en) Universal material testing method and device therefor
US4907458A (en) Pull testing
JPS61168235A (ja) ボンデイング強度試験装置
CN117347170A (zh) 一种键合引线的可靠性检测装置与方法
JPH04330757A (ja) ワイヤループ曲がり検査方法及びその装置
JP5353807B2 (ja) 材料試験機
CN210166244U (zh) 一种晶圆剪切力测试机
JPH11274248A (ja) ボンディング強度試験装置
JP2768773B2 (ja) 硬度測定装置
CN221378438U (zh) 一种测试液晶屏施压下形变的装置
JPH0456253B2 (enExample)
JPH0261537A (ja) ゴルフシャフトの試験装置
CN114264408B (zh) 一种利用力传感器校准测力环的方法
JP7714392B2 (ja) 検査装置、位置調整ユニット及び位置調整方法
JPH07113732A (ja) 引張試験方法
JP2748946B2 (ja) 繊維状物の圧縮試験方法
JPH01445A (ja) 被膜の密着性試験装置
CN118936541A (zh) 一种感应器测试装置

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term