JPS6116699Y2 - - Google Patents

Info

Publication number
JPS6116699Y2
JPS6116699Y2 JP1980167626U JP16762680U JPS6116699Y2 JP S6116699 Y2 JPS6116699 Y2 JP S6116699Y2 JP 1980167626 U JP1980167626 U JP 1980167626U JP 16762680 U JP16762680 U JP 16762680U JP S6116699 Y2 JPS6116699 Y2 JP S6116699Y2
Authority
JP
Japan
Prior art keywords
substrate
outer edge
liquid
air
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980167626U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5791253U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980167626U priority Critical patent/JPS6116699Y2/ja
Publication of JPS5791253U publication Critical patent/JPS5791253U/ja
Application granted granted Critical
Publication of JPS6116699Y2 publication Critical patent/JPS6116699Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1980167626U 1980-11-25 1980-11-25 Expired JPS6116699Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980167626U JPS6116699Y2 (enExample) 1980-11-25 1980-11-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980167626U JPS6116699Y2 (enExample) 1980-11-25 1980-11-25

Publications (2)

Publication Number Publication Date
JPS5791253U JPS5791253U (enExample) 1982-06-04
JPS6116699Y2 true JPS6116699Y2 (enExample) 1986-05-22

Family

ID=29526252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980167626U Expired JPS6116699Y2 (enExample) 1980-11-25 1980-11-25

Country Status (1)

Country Link
JP (1) JPS6116699Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0251836B1 (en) * 1986-05-30 1991-07-17 Digital Equipment Corporation Integral heat pipe module

Also Published As

Publication number Publication date
JPS5791253U (enExample) 1982-06-04

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