JPS61166534U - - Google Patents

Info

Publication number
JPS61166534U
JPS61166534U JP4811985U JP4811985U JPS61166534U JP S61166534 U JPS61166534 U JP S61166534U JP 4811985 U JP4811985 U JP 4811985U JP 4811985 U JP4811985 U JP 4811985U JP S61166534 U JPS61166534 U JP S61166534U
Authority
JP
Japan
Prior art keywords
conductive
substrate
semiconductor chip
connection terminal
adhesive member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4811985U
Other languages
Japanese (ja)
Other versions
JPH079378Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985048119U priority Critical patent/JPH079378Y2/en
Publication of JPS61166534U publication Critical patent/JPS61166534U/ja
Application granted granted Critical
Publication of JPH079378Y2 publication Critical patent/JPH079378Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83194—Lateral distribution of the layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ，ｂ，ｃはこの考案の一実施例を示す
製造工程図、第２図はその第１変形例をを示す断
面図、第３図は第２変形例を示す断面図、第４図
ａ，ｂは従来例を示す製造工程図である。 １０……基板、１１……プラスチツクフイルム
、１２ａ……端子部、１３……絶縁性のある強力
な接着材、１４……異方性導電接着剤、１５……
半導体チツプ。 Figures 1a, b, and c are manufacturing process diagrams showing one embodiment of this invention; Figure 2 is a sectional view showing the first modification; Figure 3 is a sectional view showing the second modification; Figures 4a and 4b are manufacturing process diagrams showing a conventional example. DESCRIPTION OF SYMBOLS 10...Substrate, 11...Plastic film, 12a...Terminal part, 13...Insulating strong adhesive, 14...Anisotropic conductive adhesive, 15...
semiconductor chip.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導電性の接続端子部が形成された基板と、導電
性パツド部が形成された半導体チツプと、前記基
板の接続端子部と前記半導体チツプの導電性パツ
ド部とを接着する導電性接着部材と、前記基板の
前記接続端子部以外の部分と前記半導体チツプの
前記導電性パツド部以外の部分とを接着する前記
導電性接着部材より接着性が高い接着部材とから
なる半導体装置。 a substrate on which a conductive connection terminal portion is formed; a semiconductor chip on which a conductive pad portion is formed; a conductive adhesive member for bonding the connection terminal portion of the substrate and the conductive pad portion of the semiconductor chip; A semiconductor device comprising an adhesive member having higher adhesiveness than the conductive adhesive member for adhering a portion of the substrate other than the connection terminal portion and a portion of the semiconductor chip other than the conductive pad portion.
JP1985048119U 1985-04-02 1985-04-02 Semiconductor device Expired - Lifetime JPH079378Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985048119U JPH079378Y2 (en) 1985-04-02 1985-04-02 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985048119U JPH079378Y2 (en) 1985-04-02 1985-04-02 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS61166534U true JPS61166534U (en) 1986-10-16
JPH079378Y2 JPH079378Y2 (en) 1995-03-06

Family

ID=30564069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985048119U Expired - Lifetime JPH079378Y2 (en) 1985-04-02 1985-04-02 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH079378Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5277587A (en) * 1975-12-23 1977-06-30 Seiko Epson Corp Wiring of integrated circuit outside chip
JPS56110659U (en) * 1980-12-22 1981-08-27

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5277587A (en) * 1975-12-23 1977-06-30 Seiko Epson Corp Wiring of integrated circuit outside chip
JPS56110659U (en) * 1980-12-22 1981-08-27

Also Published As

Publication number Publication date
JPH079378Y2 (en) 1995-03-06

Similar Documents

Publication Publication Date Title
JPS61166534U (en)
JPS6117751U (en) Tape carrier semiconductor device
JPH028043U (en)
JPS6384941U (en)
JPS62126836U (en)
JPS61182036U (en)
JPH0428448U (en)
JPS6364035U (en)
JPS61195058U (en)
JPS63131146U (en)
JPS6226050U (en)
JPH0268450U (en)
JPS6115743U (en) semiconductor equipment
JPS59112954U (en) Insulator-encapsulated semiconductor device
JPS6361127U (en)
JPH0385636U (en)
JPS6194348U (en)
JPS6236535U (en)
JPS5825044U (en) Ground chip for semiconductor devices
JPS63149546U (en)
JPH0341948U (en)
JPS5842940U (en) Hybrid integrated circuit device
JPS5812952U (en) Resin-encapsulated semiconductor device
JPS63119258U (en)
JPS62192652U (en)