JPS61166149A - 多層混成集積回路装置 - Google Patents

多層混成集積回路装置

Info

Publication number
JPS61166149A
JPS61166149A JP60007817A JP781785A JPS61166149A JP S61166149 A JPS61166149 A JP S61166149A JP 60007817 A JP60007817 A JP 60007817A JP 781785 A JP781785 A JP 781785A JP S61166149 A JPS61166149 A JP S61166149A
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
framework
spacer
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60007817A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0558597B2 (enExample
Inventor
Yoshio Miura
三浦　敬男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP60007817A priority Critical patent/JPS61166149A/ja
Publication of JPS61166149A publication Critical patent/JPS61166149A/ja
Publication of JPH0558597B2 publication Critical patent/JPH0558597B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP60007817A 1985-01-18 1985-01-18 多層混成集積回路装置 Granted JPS61166149A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60007817A JPS61166149A (ja) 1985-01-18 1985-01-18 多層混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60007817A JPS61166149A (ja) 1985-01-18 1985-01-18 多層混成集積回路装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP1030631A Division JPH01257392A (ja) 1989-02-08 1989-02-08 多層混成集積回路装置
JP1030630A Division JPH01257391A (ja) 1989-02-08 1989-02-08 多層混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS61166149A true JPS61166149A (ja) 1986-07-26
JPH0558597B2 JPH0558597B2 (enExample) 1993-08-26

Family

ID=11676143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60007817A Granted JPS61166149A (ja) 1985-01-18 1985-01-18 多層混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS61166149A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02117079A (ja) * 1988-10-27 1990-05-01 Mazda Motor Corp 金属基板を有する集積回路のコネクタ構造
JPH02199782A (ja) * 1989-01-30 1990-08-08 Sanyo Electric Co Ltd 金属基板を有する集積回路のコネクタ構造
JPH02220376A (ja) * 1989-02-20 1990-09-03 Mazda Motor Corp 金属基板を有する集積回路のコネクタ構造
JPH02226675A (ja) * 1989-02-28 1990-09-10 Sanyo Electric Co Ltd 混成集積回路の固定構造
CN114900951A (zh) * 2022-06-08 2022-08-12 东莞光阳兴业电子配件有限公司 一种便于连接且可分离的双面fpc板及连接及分离方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02117079A (ja) * 1988-10-27 1990-05-01 Mazda Motor Corp 金属基板を有する集積回路のコネクタ構造
JPH02199782A (ja) * 1989-01-30 1990-08-08 Sanyo Electric Co Ltd 金属基板を有する集積回路のコネクタ構造
JPH02220376A (ja) * 1989-02-20 1990-09-03 Mazda Motor Corp 金属基板を有する集積回路のコネクタ構造
JPH02226675A (ja) * 1989-02-28 1990-09-10 Sanyo Electric Co Ltd 混成集積回路の固定構造
CN114900951A (zh) * 2022-06-08 2022-08-12 东莞光阳兴业电子配件有限公司 一种便于连接且可分离的双面fpc板及连接及分离方法

Also Published As

Publication number Publication date
JPH0558597B2 (enExample) 1993-08-26

Similar Documents

Publication Publication Date Title
JPS62126661A (ja) 混成集積回路装置
JPS61166149A (ja) 多層混成集積回路装置
JPH09186042A (ja) 積層電子部品
JPS59194460A (ja) 半導体装置
JPH01257391A (ja) 多層混成集積回路装置
JPH01257392A (ja) 多層混成集積回路装置
JPS58159361A (ja) 多層混成集積回路装置
JPS61166148A (ja) 多層混成集積回路装置
JPH02146792A (ja) 半導体装置の実装構造
JPH0442937Y2 (enExample)
JPS61166147A (ja) 多層混成集積回路装置
JPH0519974Y2 (enExample)
JPS6366959A (ja) 多重リ−ドフレ−ム
JPH0445253Y2 (enExample)
JPH02110990A (ja) 混成集積回路
JP2766361B2 (ja) 半導体装置
JPH0517905Y2 (enExample)
JPH0442938Y2 (enExample)
JP2664440B2 (ja) 混成集積回路
JPH0631723Y2 (ja) 半導体装置
JPS6132560A (ja) 半導体装置
JPH043500Y2 (enExample)
JPH064605Y2 (ja) 混成集積回路
JPH04130756A (ja) 半導体装置
JPS6120757Y2 (enExample)