JPS6116239B2 - - Google Patents
Info
- Publication number
- JPS6116239B2 JPS6116239B2 JP174181A JP174181A JPS6116239B2 JP S6116239 B2 JPS6116239 B2 JP S6116239B2 JP 174181 A JP174181 A JP 174181A JP 174181 A JP174181 A JP 174181A JP S6116239 B2 JPS6116239 B2 JP S6116239B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- brazing filler
- alloy
- vapor pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP174181A JPS57115997A (en) | 1981-01-09 | 1981-01-09 | Low melting point cu-ag alloy brazing filler metal of good wettability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP174181A JPS57115997A (en) | 1981-01-09 | 1981-01-09 | Low melting point cu-ag alloy brazing filler metal of good wettability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57115997A JPS57115997A (en) | 1982-07-19 |
| JPS6116239B2 true JPS6116239B2 (enExample) | 1986-04-28 |
Family
ID=11509983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP174181A Granted JPS57115997A (en) | 1981-01-09 | 1981-01-09 | Low melting point cu-ag alloy brazing filler metal of good wettability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57115997A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3235574A1 (de) * | 1982-09-25 | 1984-03-29 | Degussa Ag, 6000 Frankfurt | Lotlegierungen zum aufloeten von kontaktwerkstoffen |
| US4459264A (en) * | 1983-03-14 | 1984-07-10 | Gte Products Corporation | Reactive metal-palladium-silver brazing alloys |
| JP7014003B2 (ja) * | 2018-03-28 | 2022-02-01 | 住友金属鉱山株式会社 | はんだ接合電極およびはんだ接合電極の被膜形成用銅合金ターゲット |
-
1981
- 1981-01-09 JP JP174181A patent/JPS57115997A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57115997A (en) | 1982-07-19 |
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