JPS61162064U - - Google Patents
Info
- Publication number
- JPS61162064U JPS61162064U JP1985044931U JP4493185U JPS61162064U JP S61162064 U JPS61162064 U JP S61162064U JP 1985044931 U JP1985044931 U JP 1985044931U JP 4493185 U JP4493185 U JP 4493185U JP S61162064 U JPS61162064 U JP S61162064U
- Authority
- JP
- Japan
- Prior art keywords
- conductive material
- package structure
- semiconductor package
- crimp terminals
- crimp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/20—
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- H10W72/072—
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- H10W72/07251—
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- H10W72/07252—
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- H10W72/227—
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- H10W72/241—
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- H10W72/29—
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- H10W72/944—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985044931U JPS61162064U (enExample) | 1985-03-29 | 1985-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985044931U JPS61162064U (enExample) | 1985-03-29 | 1985-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61162064U true JPS61162064U (enExample) | 1986-10-07 |
Family
ID=30557963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985044931U Pending JPS61162064U (enExample) | 1985-03-29 | 1985-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61162064U (enExample) |
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1985
- 1985-03-29 JP JP1985044931U patent/JPS61162064U/ja active Pending