JPS61162059U - - Google Patents

Info

Publication number
JPS61162059U
JPS61162059U JP1985043795U JP4379585U JPS61162059U JP S61162059 U JPS61162059 U JP S61162059U JP 1985043795 U JP1985043795 U JP 1985043795U JP 4379585 U JP4379585 U JP 4379585U JP S61162059 U JPS61162059 U JP S61162059U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
circuit device
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985043795U
Other languages
English (en)
Other versions
JPH0319227Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985043795U priority Critical patent/JPH0319227Y2/ja
Publication of JPS61162059U publication Critical patent/JPS61162059U/ja
Application granted granted Critical
Publication of JPH0319227Y2 publication Critical patent/JPH0319227Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第1図および第2図はこの考案の一実施例を示
し、第1図aは斜視図、同図bは別の方向から視
た斜視図、第2図は容器内への実装状態を示す斜
視図、第3図ないし第5図は別の一実施例にかか
り、第3図は斜視図、第4図は放熱台の上面図で
図aは二等辺型、図bは不等辺型の各々を示し、
第5図は容器内への実装状態を示す斜視図、第6
図および第7図は従来例にかかり、第6図は斜視
図、第7図は容器内への実装状態を示す斜視図で
ある。 1,11……放熱台、1a,11a……放熱台
の取着成型面、1b,1c,11b,11c……
放熱台の取着成型面、102……基板、103…
…トランジスタ、104,104……リード、1
06……容器、106b,106c……容器の取
着面。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 混成集積回路装置における放熱台が、その
    一部側面に形成された平面に、配線回路基板、半
    導体素子、および前記配線回路基板に取着された
    リードを備えるとともに、前記平面以外の側面に
    、この混成集積回路装置を収納取着する容器内に
    おける取着面に密接する取着成型面を備えてなる
    混成集積回路装置。 (2) 放熱台が三角柱型で、その一側面が配線回
    路基板、半導体素子、および前記配線回路基板に
    取着されたリードを備え、他の二側面がこの混成
    集積回路装置を収納取着する容器内側面の隅部に
    密接する取着成型面であることを特徴とする実用
    新案登録請求の範囲第1項に記載の混成集積回路
    装置。
JP1985043795U 1985-03-28 1985-03-28 Expired JPH0319227Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985043795U JPH0319227Y2 (ja) 1985-03-28 1985-03-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985043795U JPH0319227Y2 (ja) 1985-03-28 1985-03-28

Publications (2)

Publication Number Publication Date
JPS61162059U true JPS61162059U (ja) 1986-10-07
JPH0319227Y2 JPH0319227Y2 (ja) 1991-04-23

Family

ID=30555788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985043795U Expired JPH0319227Y2 (ja) 1985-03-28 1985-03-28

Country Status (1)

Country Link
JP (1) JPH0319227Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013069959A (ja) * 2011-09-26 2013-04-18 Nissan Motor Co Ltd パワーモジュールの冷却構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013069959A (ja) * 2011-09-26 2013-04-18 Nissan Motor Co Ltd パワーモジュールの冷却構造

Also Published As

Publication number Publication date
JPH0319227Y2 (ja) 1991-04-23

Similar Documents

Publication Publication Date Title
JPS61162059U (ja)
JPH0326105U (ja)
JPS63102292U (ja)
JPS6245841U (ja)
JPH0247055U (ja)
JPH0180948U (ja)
JPS6262490U (ja)
JPH0298646U (ja)
JPS5842950U (ja) 半導体装置
JPS6052632U (ja) 電力用半導体素子
JPH0463147U (ja)
JPS5967943U (ja) 半導体素子の冷却構造
JPS6176998U (ja)
JPS588956U (ja) 放熱器へのトランジスタ等の取付構造
JPH044776U (ja)
JPS6192067U (ja)
JPH03122550U (ja)
JPS58116238U (ja) トランジスタの放熱板装置
JPS6134750U (ja) 半導体装置
JPS62157155U (ja)
JPS63128741U (ja)
JPH01125543U (ja)
JPS6088557U (ja) 半導体素子の放熱装置
JPH0474447U (ja)
JPS5939942U (ja) 発熱電子部品取付構造